XCR3256XL-10FT256I

Xilinx Inc. XCR3256XL-10FT256I

Part Number:
XCR3256XL-10FT256I
Manufacturer:
Xilinx Inc.
Ventron No:
3631539-XCR3256XL-10FT256I
Description:
IC CPLD 256MC 9NS 256BGA
ECAD Model:
Datasheet:
XCR3256XL-10FT256I

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Specifications
Xilinx Inc. XCR3256XL-10FT256I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCR3256XL-10FT256I.
  • Factory Lead Time
    10 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    256-LBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Bulk
  • Published
    2003
  • Series
    CoolRunner XPLA3
  • JESD-609 Code
    e0
  • Pbfree Code
    no
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    256
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin/Lead (Sn63Pb37)
  • Additional Feature
    YES
  • HTS Code
    8542.39.00.01
  • Subcategory
    Programmable Logic Devices
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    240
  • Supply Voltage
    3.3V
  • Terminal Pitch
    1mm
  • Reach Compliance Code
    not_compliant
  • Reflow Temperature-Max (s)
    30
  • Pin Count
    256
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    3.3V
  • Supply Voltage-Max (Vsup)
    3.6V
  • Programmable Type
    In System Programmable (min 1K program/erase cycles)
  • Number of I/O
    164
  • Memory Type
    EEPROM
  • Propagation Delay
    10 ns
  • Number of Gates
    6000
  • Max Frequency
    105MHz
  • Speed Grade
    10
  • Output Function
    MACROCELL
  • Number of Macro Cells
    256
  • JTAG BST
    YES
  • Voltage Supply - Internal
    2.7V~3.6V
  • Delay Time tpd(1) Max
    9.1ns
  • Number of Logic Elements/Blocks
    16
  • Height Seated (Max)
    1.55mm
  • Length
    17mm
  • Width
    17mm
  • RoHS Status
    Non-RoHS Compliant
Description
XCR3256XL-10FT256I Overview
The Surface Mount option for the CoolRunner XPLA3 series is currently available and in active production. This packaging option is Bulk, meaning the components are not individually packaged but rather in bulk quantities. The technology used for these components is CMOS, which is known for its low power consumption and high speed capabilities. However, it should be noted that these components are not Reach compliant, meaning they do not meet certain environmental regulations. The maximum reflow temperature for these components is 30 degrees Celsius. Currently, these components have not yet been qualified, but they do have a speed grade of 10 and a maximum delay time of 9.1 nanoseconds.

XCR3256XL-10FT256I Features
256-LBGA package
164 I/Os
The operating temperature of -40°C~85°C TA
256 pin count

XCR3256XL-10FT256I Applications
There are a lot of Xilinx Inc. XCR3256XL-10FT256I CPLDs applications.

PULSE WIDTH MODULATION (PWM)
Address decoding
Dedicated input registers
Software-driven hardware configuration
Auxiliary Power Supply Isolated and Non-isolated
I2C BUS INTERFACE
ROM patching
State machine design
Power up sequencing
Configurable Addressing of I/O Boards
XCR3256XL-10FT256I More Descriptions
CPLD CoolRunner XPLA3 Family 6K Gates 256 Macro Cells 105MHz 0.35um (CMOS) Technology 3.3V 256-Pin FTBGA
YES 256-LBGA 2003 CoolRunner XPLA3 complex programmable logic device 105MHz 17mm 9.1ns 2.7V~3.6V
FTBGA-256 Programmable Logic Device (CPLDs/FPGAs) ROHS
No. Of I/O S:164I/O S; Logic Case Style:Ftbga; Frequency:105Mhz Rohs Compliant: No |Amd Xilinx XCR3256XL-10FT256I.
CPLD - Complex Programmable Logic Devices
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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