Xilinx Inc. XC7K410T-2FFV900C
- Part Number:
- XC7K410T-2FFV900C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3635954-XC7K410T-2FFV900C
- Description:
- IC FPGA 500 I/O 900FCBGA
- Datasheet:
- XC7K410T-2FFV900C
Xilinx Inc. XC7K410T-2FFV900C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7K410T-2FFV900C.
- Factory Lead Time12 Weeks
- Mounting TypeSurface Mount
- Package / Case900-BBGA, FCBGA
- Surface MountYES
- Operating Temperature0°C~85°C TJ
- PackagingBulk
- Published2009
- SeriesKintex®-7
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations900
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- HTS Code8542.39.00.01
- Voltage - Supply0.97V~1.03V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B900
- Number of I/O500
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells406720
- Total RAM Bits29306880
- Number of LABs/CLBs31775
- Combinatorial Delay of a CLB-Max0.61 ns
- Height Seated (Max)3.35mm
- Length31mm
- Width31mm
- RoHS StatusROHS3 Compliant
XC7K410T-2FFV900C Overview
The Xilinx Inc. brand offers a highly advanced Embedded - FPGAs (Field Programmable Gate Array) chip that falls under the category of Embedded - FPGAs (Field Programmable Gate Array). This chip is designed to be surface mounted, making it convenient for various applications. It was first published in 2009 and is currently an active part in the market. The Moisture Sensitivity Level (MSL) of this chip is 4, which means it has a shelf life of 72 hours after being exposed to moisture. The Terminal Finish of the chip is Tin/Silver/Copper (Sn/Ag/Cu), ensuring reliable connections and durability. It is classified under the JESD-30 Code S-PBGA-B900, indicating its specific package type. In terms of technical specifications, the Xilinx Inc. chip offers a total of 29,306,880 RAM bits, providing ample memory capacity for data storage and processing. The Combinatorial Delay of a CLB-Max, which refers to the maximum delay in the Combinatorial Logic Block, is an impressive 0.61 ns, highlighting the chip's high-speed performance. The chip has a length of 31mm, making it compact and suitable for integration into various electronic devices. Additionally, it is important to note that the chip is ROHS3 Compliant, indicating its compliance with environmental regulations and its commitment to sustainability. Overall, the Xilinx Inc. Embedded - FPGAs chip offers a powerful and versatile solution for a wide range of applications. With its surface mount capability, advanced technical features, and adherence to environmental standards, it is a reliable choice for engineers and designers seeking high-performance and environmentally friendly components.
XC7K410T-2FFV900C Features
500 I/Os
Up to 29306880 RAM bits
XC7K410T-2FFV900C Applications
There are a lot of Xilinx Inc. XC7K410T-2FFV900C FPGAs applications.
Software-defined radio
Medical Electronics
Aircraft navigation
Medical Applications
Distributed Monetary Systems
Automotive advanced driver assistance systems (ADAS)
Audio
Development Boards and Shields for Microcontrollers
Wireless Communications
OpenCL
The Xilinx Inc. brand offers a highly advanced Embedded - FPGAs (Field Programmable Gate Array) chip that falls under the category of Embedded - FPGAs (Field Programmable Gate Array). This chip is designed to be surface mounted, making it convenient for various applications. It was first published in 2009 and is currently an active part in the market. The Moisture Sensitivity Level (MSL) of this chip is 4, which means it has a shelf life of 72 hours after being exposed to moisture. The Terminal Finish of the chip is Tin/Silver/Copper (Sn/Ag/Cu), ensuring reliable connections and durability. It is classified under the JESD-30 Code S-PBGA-B900, indicating its specific package type. In terms of technical specifications, the Xilinx Inc. chip offers a total of 29,306,880 RAM bits, providing ample memory capacity for data storage and processing. The Combinatorial Delay of a CLB-Max, which refers to the maximum delay in the Combinatorial Logic Block, is an impressive 0.61 ns, highlighting the chip's high-speed performance. The chip has a length of 31mm, making it compact and suitable for integration into various electronic devices. Additionally, it is important to note that the chip is ROHS3 Compliant, indicating its compliance with environmental regulations and its commitment to sustainability. Overall, the Xilinx Inc. Embedded - FPGAs chip offers a powerful and versatile solution for a wide range of applications. With its surface mount capability, advanced technical features, and adherence to environmental standards, it is a reliable choice for engineers and designers seeking high-performance and environmentally friendly components.
XC7K410T-2FFV900C Features
500 I/Os
Up to 29306880 RAM bits
XC7K410T-2FFV900C Applications
There are a lot of Xilinx Inc. XC7K410T-2FFV900C FPGAs applications.
Software-defined radio
Medical Electronics
Aircraft navigation
Medical Applications
Distributed Monetary Systems
Automotive advanced driver assistance systems (ADAS)
Audio
Development Boards and Shields for Microcontrollers
Wireless Communications
OpenCL
XC7K410T-2FFV900C More Descriptions
FPGA Kintex-7 406720 Cells 28nm 1V 900-Pin FCBGA
Field Programmable Gate Array, PBGA900
IC FPGA 500 I/O 900FCBGA
IC FPGA 360 I/O 484FBGA
Field Programmable Gate Array, PBGA900
IC FPGA 500 I/O 900FCBGA
IC FPGA 360 I/O 484FBGA
The three parts on the right have similar specifications to XC7K410T-2FFV900C.
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ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishHTS CodeVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeNumber of I/OProgrammable Logic TypeNumber of Logic Elements/CellsTotal RAM BitsNumber of LABs/CLBsCombinatorial Delay of a CLB-MaxHeight Seated (Max)LengthWidthRoHS StatusNumber of PinsPbfree CodeSubcategoryTechnologyReach Compliance CodeBase Part NumberPin CountNumber of OutputsQualification StatusPower SuppliesRAM SizeClock FrequencySpeed GradeNumber of RegistersNumber of TerminalsNumber of InputsNumber of Logic CellsMemory SizeMemory TypeView Compare
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XC7K410T-2FFV900C12 WeeksSurface Mount900-BBGA, FCBGAYES0°C~85°C TJBulk2009Kintex®-7e1Active4 (72 Hours)9003A991.DTin/Silver/Copper (Sn/Ag/Cu)8542.39.00.010.97V~1.03VBOTTOMBALLNOT SPECIFIED1V1mmNOT SPECIFIEDS-PBGA-B900500FIELD PROGRAMMABLE GATE ARRAY40672029306880317750.61 ns3.35mm31mm31mmROHS3 Compliant--------------------
-
12 WeeksSurface Mount676-BBGA, FCBGAYES0°C~85°C TJTray2010Kintex®-7e1Active4 (72 Hours)6763A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.010.97V~1.03VBOTTOMBALLNOT SPECIFIED1V1mmNOT SPECIFIED-400FIELD PROGRAMMABLE GATE ARRAY40672029306880317750.74 ns3.37mm27mm27mmROHS3 Compliant676yesField Programmable Gate ArraysCMOSnot_compliantXC7K410T676400Not Qualified11.83.3V3.5MB1098MHz-1508400-----
-
---YES------------BOTTOMBALL--1mm-S-PBGA-B676-FIELD PROGRAMMABLE GATE ARRAY-------Non-RoHS Compliant--Field Programmable Gate ArraysCMOScompliant--400Not Qualified11.83.3V-1818MHz--676400406720--
-
11 WeeksSurface Mount900-BBGA, FCBGAYES0°C~100°C TJTray2009Kintex®-7e1Active4 (72 Hours)9003A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.010.97V~1.03VBOTTOMBALLNOT SPECIFIED1V1mmNOT SPECIFIEDS-PBGA-B900500FIELD PROGRAMMABLE GATE ARRAY32608016404480254750.58 ns3.35mm31mm31mmROHS3 Compliant-yesField Programmable Gate ArraysCMOSnot_compliantXC7K325T900500Not Qualified11.83.3V2MB1412MHz-3407600-500-1GBDDR3
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