Xilinx Inc. XC7K410T-2FB900I
- Part Number:
- XC7K410T-2FB900I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3129488-XC7K410T-2FB900I
- Description:
- IC FPGA 350 I/O 900FCBGA
- Datasheet:
- XC7K410T-2FB900I
Xilinx Inc. XC7K410T-2FB900I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7K410T-2FB900I.
- Factory Lead Time16 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case900-BBGA, FCBGA
- Number of Pins900
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2013
- SeriesKintex®-7
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations900
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply0.97V~1.03V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Terminal Pitch1mm
- Base Part NumberXC7K410T
- Number of Outputs500
- Operating Supply Voltage1V
- Power Supplies11.83.3V
- Number of I/O350
- RAM Size3.5MB
- Clock Frequency1818MHz
- Propagation Delay100 ps
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells406720
- Total RAM Bits29306880
- Number of LABs/CLBs31775
- Speed Grade2
- Number of Registers508400
- Radiation HardeningNo
- RoHS StatusNon-RoHS Compliant
XC7K410T-2FB900I Overview
This component is manufactured by Xilinx Inc. and falls under the category of Embedded - FPGAs (Field Programmable Gate Array) chips. It has 900 pins and is packaged in a tray. The terminal pitch is 1mm and it requires a power supply of 11.83.3V. It has 350 I/O (input/output) connections and a RAM (Random Access Memory) size of 3.5MB. The number of logic elements or cells is 406720 and the total amount of RAM bits is 29306880. It also has 31775 LABs/CLBs (Logic Array Blocks/Configurable Logic Blocks). This component is not compliant with RoHS (Restriction of Hazardous Substances) regulations.
XC7K410T-2FB900I Features
350 I/Os
Up to 29306880 RAM bits
900 LABs/CLBs
508400 registers
XC7K410T-2FB900I Applications
There are a lot of Xilinx Inc. XC7K410T-2FB900I FPGAs applications.
Voice recognition
Telecommunication
DO-254
Distributed Monetary Systems
Solar Energy
Ecosystem
Military Temperature
Data Mining
Aircraft navigation
Video & Image Processing
This component is manufactured by Xilinx Inc. and falls under the category of Embedded - FPGAs (Field Programmable Gate Array) chips. It has 900 pins and is packaged in a tray. The terminal pitch is 1mm and it requires a power supply of 11.83.3V. It has 350 I/O (input/output) connections and a RAM (Random Access Memory) size of 3.5MB. The number of logic elements or cells is 406720 and the total amount of RAM bits is 29306880. It also has 31775 LABs/CLBs (Logic Array Blocks/Configurable Logic Blocks). This component is not compliant with RoHS (Restriction of Hazardous Substances) regulations.
XC7K410T-2FB900I Features
350 I/Os
Up to 29306880 RAM bits
900 LABs/CLBs
508400 registers
XC7K410T-2FB900I Applications
There are a lot of Xilinx Inc. XC7K410T-2FB900I FPGAs applications.
Voice recognition
Telecommunication
DO-254
Distributed Monetary Systems
Solar Energy
Ecosystem
Military Temperature
Data Mining
Aircraft navigation
Video & Image Processing
XC7K410T-2FB900I More Descriptions
FPGA Kintex-7 406720 Cells 28nm Technology 1V 900-Pin FCBGA
Field Programmable Gate Array, 1818MHz, 406720-Cell, CMOS, PBGA900
Samsung Electro-Mechanics 220pF Multilayer Ceramic Capacitor (MLCC) 50 V 5% C0G dielectric CL max op. temp. 125C
Field Programmable Gate Array, 1818MHz, 406720-Cell, CMOS, PBGA900
Samsung Electro-Mechanics 220pF Multilayer Ceramic Capacitor (MLCC) 50 V 5% C0G dielectric CL max op. temp. 125C
The three parts on the right have similar specifications to XC7K410T-2FB900I.
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ImagePart NumberManufacturerFactory Lead TimeMountMounting TypePackage / CaseNumber of PinsOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsSubcategoryTechnologyVoltage - SupplyTerminal PositionTerminal FormTerminal PitchBase Part NumberNumber of OutputsOperating Supply VoltagePower SuppliesNumber of I/ORAM SizeClock FrequencyPropagation DelayProgrammable Logic TypeNumber of Logic Elements/CellsTotal RAM BitsNumber of LABs/CLBsSpeed GradeNumber of RegistersRadiation HardeningRoHS StatusSurface MountJESD-609 CodePbfree CodeECCN CodeTerminal FinishHTS CodePeak Reflow Temperature (Cel)Supply VoltageReach Compliance CodeReflow Temperature-Max (s)Pin CountQualification StatusCombinatorial Delay of a CLB-MaxHeight Seated (Max)LengthWidthContact PlatingJESD-30 CodeNumber of InputsNumber of TerminalsNumber of Logic CellsView Compare
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XC7K410T-2FB900I16 WeeksSurface MountSurface Mount900-BBGA, FCBGA900-40°C~100°C TJTray2013Kintex®-7Active4 (72 Hours)900Field Programmable Gate ArraysCMOS0.97V~1.03VBOTTOMBALL1mmXC7K410T5001V11.83.3V3503.5MB1818MHz100 psFIELD PROGRAMMABLE GATE ARRAY40672029306880317752508400NoNon-RoHS Compliant----------------------
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12 Weeks-Surface Mount676-BBGA, FCBGA6760°C~85°C TJTray2010Kintex®-7Active4 (72 Hours)676Field Programmable Gate ArraysCMOS0.97V~1.03VBOTTOMBALL1mmXC7K410T400-11.83.3V4003.5MB1098MHz-FIELD PROGRAMMABLE GATE ARRAY4067202930688031775-1508400-ROHS3 CompliantYESe1yes3A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.01NOT SPECIFIED1Vnot_compliantNOT SPECIFIED676Not Qualified0.74 ns3.37mm27mm27mm-----
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10 Weeks-Surface Mount676-BBGA, FCBGA--40°C~100°C TJTray2010Kintex®-7Active4 (72 Hours)676Field Programmable Gate ArraysCMOS0.97V~1.03VBOTTOMBALL1mmXC7K160400-11.83.3V4001.4MB1286MHz100 psFIELD PROGRAMMABLE GATE ARRAY1622401198080012675-2202800NoROHS3 CompliantYESe1yes3A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.01-1V--676-0.61 ns2.54mm27mm27mmCopper, Silver, TinS-PBGA-B676400--
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------------Field Programmable Gate ArraysCMOS-BOTTOMBALL1mm-400-11.83.3V--1818MHz-FIELD PROGRAMMABLE GATE ARRAY------Non-RoHS CompliantYES-------compliant--Not Qualified-----S-PBGA-B676400676406720
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