Xilinx Inc. XC7K325T-L2FFG676E
- Part Number:
- XC7K325T-L2FFG676E
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3133418-XC7K325T-L2FFG676E
- Description:
- IC FPGA 400 I/O 676FCBGA
- Datasheet:
- XC7K325T-L2FFG676E
Xilinx Inc. XC7K325T-L2FFG676E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7K325T-L2FFG676E.
- Factory Lead Time11 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case676-BBGA, FCBGA
- Operating Temperature0°C~100°C TJ
- PackagingTray
- Published2010
- SeriesKintex®-7
- JESD-609 Codee1
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations676
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Additional FeatureALSO OPERATES AT 1 V SUPPLY
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply0.87V~0.93V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage0.9V
- Terminal Pitch1mm
- Reach Compliance Codenot_compliant
- Reflow Temperature-Max (s)NOT SPECIFIED
- Base Part NumberXC7K325T
- Pin Count676
- JESD-30 CodeS-PBGA-B676
- Number of Outputs400
- Qualification StatusNot Qualified
- Power Supplies0.91.83.3V
- Memory Size1GB
- Number of I/O400
- RAM Size2MB
- Memory TypeDDR3
- Number of Inputs400
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells326080
- Total RAM Bits16404480
- Number of LABs/CLBs25475
- Number of Registers407600
- Combinatorial Delay of a CLB-Max0.91 ns
- Height Seated (Max)3.37mm
- Length27mm
- Width27mm
- RoHS StatusROHS3 Compliant
XC7K325T-L2FFG676E Overview
Xilinx Inc. is a well-known brand in the field of Embedded - FPGAs (Field Programmable Gate Array) chips. These chips are highly versatile and are widely used in various electronic devices. The company has a strong reputation for producing high-quality and reliable products. The Embedded - FPGAs (Field Programmable Gate Array) chip produced by Xilinx Inc. is a surface mount type, making it easy to install and use in various applications. It is also compliant with JESD-609 Code e1, which ensures its compatibility with industry standards. Moreover, the chip has a Moisture Sensitivity Level (MSL) of 4, which means it can withstand exposure to moisture for up to 72 hours without any damage. This makes it suitable for use in a wide range of environments and conditions. One of the key features of this Xilinx Inc. chip is its Terminal Finish, which is Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5). This finish provides excellent conductivity and ensures reliable performance of the chip. Additionally, the chip operates at a low supply voltage of 0.9V, making it energy-efficient and suitable for use in portable devices. It has a pin count of 676, which allows for a high level of connectivity and functionality. With 400 inputs, this chip offers a wide range of possibilities for designers and engineers to create innovative and complex electronic systems. The Xilinx Inc. Embedded - FPGAs (Field Programmable Gate Array) chip also boasts an impressive 16404480 total RAM bits, making it capable of handling large amounts of data and complex operations. It has 25475 LABs/CLBs, which are the basic building blocks of the chip and are responsible for its programmability and flexibility. This high number of LABs/CLBs allows for efficient and optimized performance of the chip. Additionally, the chip has a maximum seated height of 3.37mm, making it compact and suitable for use in space-constrained applications. In conclusion, the Xilinx Inc. Embedded - FPGAs (Field Programmable Gate Array) chip is a top-of-the-line product that offers high performance, reliability, and versatility. Its various parameters, such as mounting type, JESD-609 code, MSL, terminal finish, supply voltage, pin count, and total RAM bits, make it a highly desirable choice for electronic designers and engineers. With its advanced features and superior quality, this chip is sure to meet the demands of the ever-evolving electronics industry.
XC7K325T-L2FFG676E Features
400 I/Os
Up to 16404480 RAM bits
407600 registers
XC7K325T-L2FFG676E Applications
There are a lot of Xilinx Inc. XC7K325T-L2FFG676E FPGAs applications.
Data center search engines
Consumer Electronics
Bioinformatics
Audio
Development Boards and Shields for Microcontrollers
Data center hardware accelerators
Military Temperature
OpenCL
Embedded Vision
Security systems
Xilinx Inc. is a well-known brand in the field of Embedded - FPGAs (Field Programmable Gate Array) chips. These chips are highly versatile and are widely used in various electronic devices. The company has a strong reputation for producing high-quality and reliable products. The Embedded - FPGAs (Field Programmable Gate Array) chip produced by Xilinx Inc. is a surface mount type, making it easy to install and use in various applications. It is also compliant with JESD-609 Code e1, which ensures its compatibility with industry standards. Moreover, the chip has a Moisture Sensitivity Level (MSL) of 4, which means it can withstand exposure to moisture for up to 72 hours without any damage. This makes it suitable for use in a wide range of environments and conditions. One of the key features of this Xilinx Inc. chip is its Terminal Finish, which is Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5). This finish provides excellent conductivity and ensures reliable performance of the chip. Additionally, the chip operates at a low supply voltage of 0.9V, making it energy-efficient and suitable for use in portable devices. It has a pin count of 676, which allows for a high level of connectivity and functionality. With 400 inputs, this chip offers a wide range of possibilities for designers and engineers to create innovative and complex electronic systems. The Xilinx Inc. Embedded - FPGAs (Field Programmable Gate Array) chip also boasts an impressive 16404480 total RAM bits, making it capable of handling large amounts of data and complex operations. It has 25475 LABs/CLBs, which are the basic building blocks of the chip and are responsible for its programmability and flexibility. This high number of LABs/CLBs allows for efficient and optimized performance of the chip. Additionally, the chip has a maximum seated height of 3.37mm, making it compact and suitable for use in space-constrained applications. In conclusion, the Xilinx Inc. Embedded - FPGAs (Field Programmable Gate Array) chip is a top-of-the-line product that offers high performance, reliability, and versatility. Its various parameters, such as mounting type, JESD-609 code, MSL, terminal finish, supply voltage, pin count, and total RAM bits, make it a highly desirable choice for electronic designers and engineers. With its advanced features and superior quality, this chip is sure to meet the demands of the ever-evolving electronics industry.
XC7K325T-L2FFG676E Features
400 I/Os
Up to 16404480 RAM bits
407600 registers
XC7K325T-L2FFG676E Applications
There are a lot of Xilinx Inc. XC7K325T-L2FFG676E FPGAs applications.
Data center search engines
Consumer Electronics
Bioinformatics
Audio
Development Boards and Shields for Microcontrollers
Data center hardware accelerators
Military Temperature
OpenCL
Embedded Vision
Security systems
XC7K325T-L2FFG676E More Descriptions
FPGA Kintex-7 Family 326080 Cells 28nm Technology 1V 676-Pin BGA
Field Programmable Gate Array, 25475 CLBs, PBGA676
IC GATE NAND 4CH 2-INP 14TSSOP
Field Programmable Gate Array, 25475 CLBs, PBGA676
IC GATE NAND 4CH 2-INP 14TSSOP
The three parts on the right have similar specifications to XC7K325T-L2FFG676E.
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ImagePart NumberManufacturerFactory Lead TimeMountMounting TypePackage / CaseOperating TemperaturePackagingPublishedSeriesJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishAdditional FeatureHTS CodeSubcategoryTechnologyVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReach Compliance CodeReflow Temperature-Max (s)Base Part NumberPin CountJESD-30 CodeNumber of OutputsQualification StatusPower SuppliesMemory SizeNumber of I/ORAM SizeMemory TypeNumber of InputsProgrammable Logic TypeNumber of Logic Elements/CellsTotal RAM BitsNumber of LABs/CLBsNumber of RegistersCombinatorial Delay of a CLB-MaxHeight Seated (Max)LengthWidthRoHS StatusSurface MountNumber of PinsClock FrequencySpeed GradeNumber of TerminalsNumber of Logic CellsView Compare
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XC7K325T-L2FFG676E11 WeeksSurface MountSurface Mount676-BBGA, FCBGA0°C~100°C TJTray2010Kintex®-7e1yesActive4 (72 Hours)6763A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)ALSO OPERATES AT 1 V SUPPLY8542.39.00.01Field Programmable Gate ArraysCMOS0.87V~0.93VBOTTOMBALLNOT SPECIFIED0.9V1mmnot_compliantNOT SPECIFIEDXC7K325T676S-PBGA-B676400Not Qualified0.91.83.3V1GB4002MBDDR3400FIELD PROGRAMMABLE GATE ARRAY32608016404480254754076000.91 ns3.37mm27mm27mmROHS3 Compliant-------
-
12 Weeks-Surface Mount676-BBGA, FCBGA0°C~85°C TJTray2010Kintex®-7e1yesActive4 (72 Hours)6763A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)-8542.39.00.01Field Programmable Gate ArraysCMOS0.97V~1.03VBOTTOMBALLNOT SPECIFIED1V1mmnot_compliantNOT SPECIFIEDXC7K410T676-400Not Qualified11.83.3V-4003.5MB--FIELD PROGRAMMABLE GATE ARRAY40672029306880317755084000.74 ns3.37mm27mm27mmROHS3 CompliantYES6761098MHz-1--
-
-----------------Field Programmable Gate ArraysCMOS-BOTTOMBALL--1mmcompliant---S-PBGA-B676400Not Qualified11.83.3V----400FIELD PROGRAMMABLE GATE ARRAY--------Non-RoHS CompliantYES-1818MHz-676406720
-
11 Weeks-Surface Mount900-BBGA, FCBGA0°C~100°C TJTray2009Kintex®-7e1yesActive4 (72 Hours)9003A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)-8542.39.00.01Field Programmable Gate ArraysCMOS0.97V~1.03VBOTTOMBALLNOT SPECIFIED1V1mmnot_compliantNOT SPECIFIEDXC7K325T900S-PBGA-B900500Not Qualified11.83.3V1GB5002MBDDR3500FIELD PROGRAMMABLE GATE ARRAY32608016404480254754076000.58 ns3.35mm31mm31mmROHS3 CompliantYES-1412MHz-3--
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