XC7K325T-L2FFG676E

Xilinx Inc. XC7K325T-L2FFG676E

Part Number:
XC7K325T-L2FFG676E
Manufacturer:
Xilinx Inc.
Ventron No:
3133418-XC7K325T-L2FFG676E
Description:
IC FPGA 400 I/O 676FCBGA
ECAD Model:
Datasheet:
XC7K325T-L2FFG676E

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Specifications
Xilinx Inc. XC7K325T-L2FFG676E technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7K325T-L2FFG676E.
  • Factory Lead Time
    11 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    676-BBGA, FCBGA
  • Operating Temperature
    0°C~100°C TJ
  • Packaging
    Tray
  • Published
    2010
  • Series
    Kintex®-7
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of Terminations
    676
  • ECCN Code
    3A991.D
  • Terminal Finish
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • Additional Feature
    ALSO OPERATES AT 1 V SUPPLY
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    0.87V~0.93V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    0.9V
  • Terminal Pitch
    1mm
  • Reach Compliance Code
    not_compliant
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Base Part Number
    XC7K325T
  • Pin Count
    676
  • JESD-30 Code
    S-PBGA-B676
  • Number of Outputs
    400
  • Qualification Status
    Not Qualified
  • Power Supplies
    0.91.83.3V
  • Memory Size
    1GB
  • Number of I/O
    400
  • RAM Size
    2MB
  • Memory Type
    DDR3
  • Number of Inputs
    400
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    326080
  • Total RAM Bits
    16404480
  • Number of LABs/CLBs
    25475
  • Number of Registers
    407600
  • Combinatorial Delay of a CLB-Max
    0.91 ns
  • Height Seated (Max)
    3.37mm
  • Length
    27mm
  • Width
    27mm
  • RoHS Status
    ROHS3 Compliant
Description
XC7K325T-L2FFG676E Overview
Xilinx Inc. is a well-known brand in the field of Embedded - FPGAs (Field Programmable Gate Array) chips. These chips are highly versatile and are widely used in various electronic devices. The company has a strong reputation for producing high-quality and reliable products. The Embedded - FPGAs (Field Programmable Gate Array) chip produced by Xilinx Inc. is a surface mount type, making it easy to install and use in various applications. It is also compliant with JESD-609 Code e1, which ensures its compatibility with industry standards. Moreover, the chip has a Moisture Sensitivity Level (MSL) of 4, which means it can withstand exposure to moisture for up to 72 hours without any damage. This makes it suitable for use in a wide range of environments and conditions. One of the key features of this Xilinx Inc. chip is its Terminal Finish, which is Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5). This finish provides excellent conductivity and ensures reliable performance of the chip. Additionally, the chip operates at a low supply voltage of 0.9V, making it energy-efficient and suitable for use in portable devices. It has a pin count of 676, which allows for a high level of connectivity and functionality. With 400 inputs, this chip offers a wide range of possibilities for designers and engineers to create innovative and complex electronic systems. The Xilinx Inc. Embedded - FPGAs (Field Programmable Gate Array) chip also boasts an impressive 16404480 total RAM bits, making it capable of handling large amounts of data and complex operations. It has 25475 LABs/CLBs, which are the basic building blocks of the chip and are responsible for its programmability and flexibility. This high number of LABs/CLBs allows for efficient and optimized performance of the chip. Additionally, the chip has a maximum seated height of 3.37mm, making it compact and suitable for use in space-constrained applications. In conclusion, the Xilinx Inc. Embedded - FPGAs (Field Programmable Gate Array) chip is a top-of-the-line product that offers high performance, reliability, and versatility. Its various parameters, such as mounting type, JESD-609 code, MSL, terminal finish, supply voltage, pin count, and total RAM bits, make it a highly desirable choice for electronic designers and engineers. With its advanced features and superior quality, this chip is sure to meet the demands of the ever-evolving electronics industry.

XC7K325T-L2FFG676E Features
400 I/Os
Up to 16404480 RAM bits
407600 registers

XC7K325T-L2FFG676E Applications
There are a lot of Xilinx Inc. XC7K325T-L2FFG676E FPGAs applications.

Data center search engines
Consumer Electronics
Bioinformatics
Audio
Development Boards and Shields for Microcontrollers
Data center hardware accelerators
Military Temperature
OpenCL
Embedded Vision
Security systems
XC7K325T-L2FFG676E More Descriptions
FPGA Kintex-7 Family 326080 Cells 28nm Technology 1V 676-Pin BGA
Field Programmable Gate Array, 25475 CLBs, PBGA676
IC GATE NAND 4CH 2-INP 14TSSOP
Product Comparison
The three parts on the right have similar specifications to XC7K325T-L2FFG676E.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mount
    Mounting Type
    Package / Case
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    Additional Feature
    HTS Code
    Subcategory
    Technology
    Voltage - Supply
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reach Compliance Code
    Reflow Temperature-Max (s)
    Base Part Number
    Pin Count
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Power Supplies
    Memory Size
    Number of I/O
    RAM Size
    Memory Type
    Number of Inputs
    Programmable Logic Type
    Number of Logic Elements/Cells
    Total RAM Bits
    Number of LABs/CLBs
    Number of Registers
    Combinatorial Delay of a CLB-Max
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Surface Mount
    Number of Pins
    Clock Frequency
    Speed Grade
    Number of Terminals
    Number of Logic Cells
    View Compare
  • XC7K325T-L2FFG676E
    XC7K325T-L2FFG676E
    11 Weeks
    Surface Mount
    Surface Mount
    676-BBGA, FCBGA
    0°C~100°C TJ
    Tray
    2010
    Kintex®-7
    e1
    yes
    Active
    4 (72 Hours)
    676
    3A991.D
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    ALSO OPERATES AT 1 V SUPPLY
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    0.87V~0.93V
    BOTTOM
    BALL
    NOT SPECIFIED
    0.9V
    1mm
    not_compliant
    NOT SPECIFIED
    XC7K325T
    676
    S-PBGA-B676
    400
    Not Qualified
    0.91.83.3V
    1GB
    400
    2MB
    DDR3
    400
    FIELD PROGRAMMABLE GATE ARRAY
    326080
    16404480
    25475
    407600
    0.91 ns
    3.37mm
    27mm
    27mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
  • XC7K410T-1FFG676C
    12 Weeks
    -
    Surface Mount
    676-BBGA, FCBGA
    0°C~85°C TJ
    Tray
    2010
    Kintex®-7
    e1
    yes
    Active
    4 (72 Hours)
    676
    3A991.D
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    -
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    0.97V~1.03V
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    1mm
    not_compliant
    NOT SPECIFIED
    XC7K410T
    676
    -
    400
    Not Qualified
    11.83.3V
    -
    400
    3.5MB
    -
    -
    FIELD PROGRAMMABLE GATE ARRAY
    406720
    29306880
    31775
    508400
    0.74 ns
    3.37mm
    27mm
    27mm
    ROHS3 Compliant
    YES
    676
    1098MHz
    -1
    -
    -
  • XC7K410T-1FF676C
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    Field Programmable Gate Arrays
    CMOS
    -
    BOTTOM
    BALL
    -
    -
    1mm
    compliant
    -
    -
    -
    S-PBGA-B676
    400
    Not Qualified
    11.83.3V
    -
    -
    -
    -
    400
    FIELD PROGRAMMABLE GATE ARRAY
    -
    -
    -
    -
    -
    -
    -
    -
    Non-RoHS Compliant
    YES
    -
    1818MHz
    -
    676
    406720
  • XC7K325T-3FFG900E
    11 Weeks
    -
    Surface Mount
    900-BBGA, FCBGA
    0°C~100°C TJ
    Tray
    2009
    Kintex®-7
    e1
    yes
    Active
    4 (72 Hours)
    900
    3A991.D
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    -
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    0.97V~1.03V
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    1mm
    not_compliant
    NOT SPECIFIED
    XC7K325T
    900
    S-PBGA-B900
    500
    Not Qualified
    11.83.3V
    1GB
    500
    2MB
    DDR3
    500
    FIELD PROGRAMMABLE GATE ARRAY
    326080
    16404480
    25475
    407600
    0.58 ns
    3.35mm
    31mm
    31mm
    ROHS3 Compliant
    YES
    -
    1412MHz
    -3
    -
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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