Xilinx Inc. XC7K325T-1FFG900CES
- Part Number:
- XC7K325T-1FFG900CES
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3640820-XC7K325T-1FFG900CES
- Description:
- IC FPGA 500 I/O 900FCBGA
- Datasheet:
- XC7K325T-1FFG900CES
Xilinx Inc. XC7K325T-1FFG900CES technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7K325T-1FFG900CES.
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case900-BBGA, FCBGA
- Supplier Device Package900-FCBGA (31x31)
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2009
- SeriesKintex®-7
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Max Operating Temperature85°C
- Min Operating Temperature0°C
- Voltage - Supply0.97V~1.03V
- Base Part NumberXC7K325T
- Number of I/O500
- RAM Size2MB
- Number of Logic Elements/Cells326080
- Total RAM Bits16404480
- Number of LABs/CLBs25475
- Number of Logic Blocks (LABs)25475
- RoHS StatusRoHS Compliant
XC7K325T-1FFG900CES Overview
The package or case for this product is 900-BBGA or FCBGA, and the supplier device package is specifically 900-FCBGA with dimensions of 31x31. It has an operating temperature range of 0°C to 85°C and was published in 2009. This product is currently listed as obsolete and has a moisture sensitivity level of 4, meaning it can withstand exposure to moisture for up to 72 hours. The maximum operating temperature is 85°C and the minimum operating temperature is 0°C. It has a RAM size of 2MB and a total of 25475 LABs/CLBs.
XC7K325T-1FFG900CES Features
500 I/Os
Up to 16404480 RAM bits
85°C gates
25475 logic blocks (LABs)
XC7K325T-1FFG900CES Applications
There are a lot of Xilinx Inc. XC7K325T-1FFG900CES FPGAs applications.
Wireless Communications
Industrial Ethernet
Solar Energy
Secure Communication
Video & Image Processing
Distributed Monetary Systems
Automotive driver's assistance
Data Center
Industrial IoT
ADAS
The package or case for this product is 900-BBGA or FCBGA, and the supplier device package is specifically 900-FCBGA with dimensions of 31x31. It has an operating temperature range of 0°C to 85°C and was published in 2009. This product is currently listed as obsolete and has a moisture sensitivity level of 4, meaning it can withstand exposure to moisture for up to 72 hours. The maximum operating temperature is 85°C and the minimum operating temperature is 0°C. It has a RAM size of 2MB and a total of 25475 LABs/CLBs.
XC7K325T-1FFG900CES Features
500 I/Os
Up to 16404480 RAM bits
85°C gates
25475 logic blocks (LABs)
XC7K325T-1FFG900CES Applications
There are a lot of Xilinx Inc. XC7K325T-1FFG900CES FPGAs applications.
Wireless Communications
Industrial Ethernet
Solar Energy
Secure Communication
Video & Image Processing
Distributed Monetary Systems
Automotive driver's assistance
Data Center
Industrial IoT
ADAS
XC7K325T-1FFG900CES More Descriptions
IC FPGA 500 I/O 900FCBGA
IC FPGA 350 I/O 900FCBGA
IC FPGA 350 I/O 900FCBGA
The three parts on the right have similar specifications to XC7K325T-1FFG900CES.
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ImagePart NumberManufacturerMountMounting TypePackage / CaseSupplier Device PackageOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Max Operating TemperatureMin Operating TemperatureVoltage - SupplyBase Part NumberNumber of I/ORAM SizeNumber of Logic Elements/CellsTotal RAM BitsNumber of LABs/CLBsNumber of Logic Blocks (LABs)RoHS StatusFactory Lead TimeSurface MountNumber of PinsJESD-609 CodePbfree CodeNumber of TerminationsECCN CodeTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReach Compliance CodeReflow Temperature-Max (s)Pin CountNumber of OutputsQualification StatusPower SuppliesClock FrequencyProgrammable Logic TypeSpeed GradeNumber of RegistersCombinatorial Delay of a CLB-MaxHeight Seated (Max)LengthWidthNumber of TerminalsJESD-30 CodeNumber of InputsNumber of Logic CellsMemory SizeMemory TypeView Compare
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XC7K325T-1FFG900CESSurface MountSurface Mount900-BBGA, FCBGA900-FCBGA (31x31)0°C~85°C TJTray2009Kintex®-7Obsolete4 (72 Hours)85°C0°C0.97V~1.03VXC7K325T5002MB326080164044802547525475RoHS Compliant-------------------------------------
-
-Surface Mount676-BBGA, FCBGA-0°C~85°C TJTray2010Kintex®-7Active4 (72 Hours)--0.97V~1.03VXC7K410T4003.5MB4067202930688031775-ROHS3 Compliant12 WeeksYES676e1yes6763A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1V1mmnot_compliantNOT SPECIFIED676400Not Qualified11.83.3V1098MHzFIELD PROGRAMMABLE GATE ARRAY-15084000.74 ns3.37mm27mm27mm------
-
--------------------Non-RoHS Compliant-YES-------Field Programmable Gate ArraysCMOSBOTTOMBALL--1mmcompliant--400Not Qualified11.83.3V1818MHzFIELD PROGRAMMABLE GATE ARRAY------676S-PBGA-B676400406720--
-
-Surface Mount900-BBGA, FCBGA-0°C~100°C TJTray2009Kintex®-7Active4 (72 Hours)--0.97V~1.03VXC7K325T5002MB3260801640448025475-ROHS3 Compliant11 WeeksYES-e1yes9003A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1V1mmnot_compliantNOT SPECIFIED900500Not Qualified11.83.3V1412MHzFIELD PROGRAMMABLE GATE ARRAY-34076000.58 ns3.35mm31mm31mm-S-PBGA-B900500-1GBDDR3
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