Xilinx Inc. XC7K325T-1FB676C
- Part Number:
- XC7K325T-1FB676C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3135503-XC7K325T-1FB676C
- Description:
- IC FPGA 400 I/O 676FCBGA
- Datasheet:
- XC7K325T-1FB676C
Xilinx Inc. XC7K325T-1FB676C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7K325T-1FB676C.
- Factory Lead Time16 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case676-BBGA, FCBGA
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2009
- SeriesKintex®-7
- JESD-609 Codee0
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations676
- Terminal FinishTin/Lead (Sn63Pb37)
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply0.97V~1.03V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Base Part NumberXC7K325T
- JESD-30 CodeS-PBGA-B676
- Number of Outputs400
- Operating Supply Voltage1V
- Number of I/O400
- RAM Size2MB
- Propagation Delay120 ps
- Number of Inputs400
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells326080
- Total RAM Bits16404480
- Number of LABs/CLBs25475
- Speed Grade1
- Number of Registers407600
- Radiation HardeningNo
- RoHS StatusNon-RoHS Compliant
XC7K325T-1FB676C Overview
This product features a 676-BBGA or FCBGA package/case, with an operating temperature range of 0°C to 85°C TJ. It is packaged in trays, with a JESD-609 code of e0. With 676 terminations and a terminal finish of Tin/Lead (Sn63Pb37), this product utilizes CMOS technology. It offers a RAM size of 2MB and a propagation delay of 120 ps. Additionally, it boasts a high number of LABs/CLBs, with 25475 included in the design. These specifications make this product ideal for a wide range of applications, providing reliable performance in various operating conditions.
XC7K325T-1FB676C Features
400 I/Os
Up to 16404480 RAM bits
407600 registers
XC7K325T-1FB676C Applications
There are a lot of Xilinx Inc. XC7K325T-1FB676C FPGAs applications.
Enterprise networking
Device controllers
Telecommunication
OpenCL
Radar and Sensors
Automotive
Secure Communication
Security systems
Military Temperature
Distributed Monetary Systems
This product features a 676-BBGA or FCBGA package/case, with an operating temperature range of 0°C to 85°C TJ. It is packaged in trays, with a JESD-609 code of e0. With 676 terminations and a terminal finish of Tin/Lead (Sn63Pb37), this product utilizes CMOS technology. It offers a RAM size of 2MB and a propagation delay of 120 ps. Additionally, it boasts a high number of LABs/CLBs, with 25475 included in the design. These specifications make this product ideal for a wide range of applications, providing reliable performance in various operating conditions.
XC7K325T-1FB676C Features
400 I/Os
Up to 16404480 RAM bits
407600 registers
XC7K325T-1FB676C Applications
There are a lot of Xilinx Inc. XC7K325T-1FB676C FPGAs applications.
Enterprise networking
Device controllers
Telecommunication
OpenCL
Radar and Sensors
Automotive
Secure Communication
Security systems
Military Temperature
Distributed Monetary Systems
XC7K325T-1FB676C More Descriptions
Dual low-power JFET-input low offset operational amplifier 8-PDIP 0 to 70
FPGA Kintex-7 326080 Cells 28nm Technology 1V 676-Pin FCBGA
Field Programmable Gate Array, PBGA676
FPGA Kintex-7 326080 Cells 28nm Technology 1V 676-Pin FCBGA
Field Programmable Gate Array, PBGA676
The three parts on the right have similar specifications to XC7K325T-1FB676C.
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ImagePart NumberManufacturerFactory Lead TimeMountMounting TypePackage / CaseOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishSubcategoryTechnologyVoltage - SupplyTerminal PositionTerminal FormBase Part NumberJESD-30 CodeNumber of OutputsOperating Supply VoltageNumber of I/ORAM SizePropagation DelayNumber of InputsProgrammable Logic TypeNumber of Logic Elements/CellsTotal RAM BitsNumber of LABs/CLBsSpeed GradeNumber of RegistersRadiation HardeningRoHS StatusSurface MountNumber of PinsPbfree CodeECCN CodeHTS CodePeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReach Compliance CodeReflow Temperature-Max (s)Pin CountQualification StatusPower SuppliesClock FrequencyCombinatorial Delay of a CLB-MaxHeight Seated (Max)LengthWidthContact PlatingNumber of TerminalsNumber of Logic CellsView Compare
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XC7K325T-1FB676C16 WeeksSurface MountSurface Mount676-BBGA, FCBGA0°C~85°C TJTray2009Kintex®-7e0Active4 (72 Hours)676Tin/Lead (Sn63Pb37)Field Programmable Gate ArraysCMOS0.97V~1.03VBOTTOMBALLXC7K325TS-PBGA-B6764001V4002MB120 ps400FIELD PROGRAMMABLE GATE ARRAY32608016404480254751407600NoNon-RoHS Compliant----------------------
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12 Weeks-Surface Mount676-BBGA, FCBGA0°C~85°C TJTray2010Kintex®-7e1Active4 (72 Hours)676Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)Field Programmable Gate ArraysCMOS0.97V~1.03VBOTTOMBALLXC7K410T-400-4003.5MB--FIELD PROGRAMMABLE GATE ARRAY4067202930688031775-1508400-ROHS3 CompliantYES676yes3A991.D8542.39.00.01NOT SPECIFIED1V1mmnot_compliantNOT SPECIFIED676Not Qualified11.83.3V1098MHz0.74 ns3.37mm27mm27mm---
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10 Weeks-Surface Mount676-BBGA, FCBGA-40°C~100°C TJTray2010Kintex®-7e1Active4 (72 Hours)676Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)Field Programmable Gate ArraysCMOS0.97V~1.03VBOTTOMBALLXC7K160S-PBGA-B676400-4001.4MB100 ps400FIELD PROGRAMMABLE GATE ARRAY1622401198080012675-2202800NoROHS3 CompliantYES-yes3A991.D8542.39.00.01-1V1mm--676-11.83.3V1286MHz0.61 ns2.54mm27mm27mmCopper, Silver, Tin--
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-------------Field Programmable Gate ArraysCMOS-BOTTOMBALL-S-PBGA-B676400----400FIELD PROGRAMMABLE GATE ARRAY------Non-RoHS CompliantYES------1mmcompliant--Not Qualified11.83.3V1818MHz-----676406720
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