Xilinx Inc. XC7K160T-L2FBG676I
- Part Number:
- XC7K160T-L2FBG676I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3635001-XC7K160T-L2FBG676I
- Description:
- IC FPGA 400 I/O 676FCBGA
- Datasheet:
- XC7K160T-L2FBG676I
Xilinx Inc. XC7K160T-L2FBG676I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7K160T-L2FBG676I.
- Factory Lead Time10 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case676-BBGA, FCBGA
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2010
- SeriesKintex®-7
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations676
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- HTS Code8542.39.00.01
- Voltage - Supply0.97V~1.03V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage0.95V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B676
- Number of I/O400
- RAM Size1.4MB
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells162240
- Total RAM Bits11980800
- Number of LABs/CLBs12675
- Combinatorial Delay of a CLB-Max0.61 ns
- Height Seated (Max)2.54mm
- Length27mm
- Width27mm
- RoHS StatusROHS3 Compliant
XC7K160T-L2FBG676I Overview
The manufacturer of this component is Xilinx Inc. It is a type of chip called an Embedded - FPGAs (Field Programmable Gate Array) and it falls under the Embedded - FPGAs (Field Programmable Gate Array) category. The packaging for this chip is in a tray and it was first published in 2010. The Moisture Sensitivity Level (MSL) for this chip is 4, meaning it can be exposed to moisture for up to 72 hours without being damaged. The ECCN Code for this chip is 3A991.D. The terminal finish for this chip is Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5). The voltage supply range for this chip is 0.97V to 1.03V, with a specific supply voltage of 0.95V. It is a type of programmable logic called FIELD PROGRAMMABLE GATE ARRAY. The Combinatorial Delay of a CLB-Max (the maximum delay for a combinational logic block) is 0.61 nanoseconds. The maximum height when seated is 2.54 millimeters.
XC7K160T-L2FBG676I Features
400 I/Os
Up to 11980800 RAM bits
XC7K160T-L2FBG676I Applications
There are a lot of Xilinx Inc. XC7K160T-L2FBG676I FPGAs applications.
Aircraft navigation
Digital signal processing
Automotive advanced driver assistance systems (ADAS)
High Performance Computing
Military Temperature
Military DSP
Medical imaging
DO-254
ADAS
Device controllers
The manufacturer of this component is Xilinx Inc. It is a type of chip called an Embedded - FPGAs (Field Programmable Gate Array) and it falls under the Embedded - FPGAs (Field Programmable Gate Array) category. The packaging for this chip is in a tray and it was first published in 2010. The Moisture Sensitivity Level (MSL) for this chip is 4, meaning it can be exposed to moisture for up to 72 hours without being damaged. The ECCN Code for this chip is 3A991.D. The terminal finish for this chip is Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5). The voltage supply range for this chip is 0.97V to 1.03V, with a specific supply voltage of 0.95V. It is a type of programmable logic called FIELD PROGRAMMABLE GATE ARRAY. The Combinatorial Delay of a CLB-Max (the maximum delay for a combinational logic block) is 0.61 nanoseconds. The maximum height when seated is 2.54 millimeters.
XC7K160T-L2FBG676I Features
400 I/Os
Up to 11980800 RAM bits
XC7K160T-L2FBG676I Applications
There are a lot of Xilinx Inc. XC7K160T-L2FBG676I FPGAs applications.
Aircraft navigation
Digital signal processing
Automotive advanced driver assistance systems (ADAS)
High Performance Computing
Military Temperature
Military DSP
Medical imaging
DO-254
ADAS
Device controllers
XC7K160T-L2FBG676I More Descriptions
FPGA Kintex-7 162240 Cells 28nm Technology 0.95V 676-Pin FCBGA Tray
Field Programmable Gate Array, 1286MHz, 162240-Cell, CMOS, PBGA676
Product Description Demo for Development.
Field Programmable Gate Array, 1286MHz, 162240-Cell, CMOS, PBGA676
Product Description Demo for Development.
The three parts on the right have similar specifications to XC7K160T-L2FBG676I.
-
ImagePart NumberManufacturerFactory Lead TimeMountMounting TypePackage / CaseOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishHTS CodeVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeNumber of I/ORAM SizeProgrammable Logic TypeNumber of Logic Elements/CellsTotal RAM BitsNumber of LABs/CLBsCombinatorial Delay of a CLB-MaxHeight Seated (Max)LengthWidthRoHS StatusSurface MountNumber of PinsPbfree CodeSubcategoryTechnologyReach Compliance CodeBase Part NumberPin CountNumber of OutputsQualification StatusPower SuppliesClock FrequencySpeed GradeNumber of RegistersContact PlatingPropagation DelayNumber of InputsRadiation HardeningMemory SizeMemory TypeView Compare
-
XC7K160T-L2FBG676I10 WeeksSurface MountSurface Mount676-BBGA, FCBGA-40°C~100°C TJTray2010Kintex®-7e1Active4 (72 Hours)6763A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.010.97V~1.03VBOTTOMBALLNOT SPECIFIED0.95V1mmNOT SPECIFIEDS-PBGA-B6764001.4MBFIELD PROGRAMMABLE GATE ARRAY16224011980800126750.61 ns2.54mm27mm27mmROHS3 Compliant---------------------
-
12 Weeks-Surface Mount676-BBGA, FCBGA0°C~85°C TJTray2010Kintex®-7e1Active4 (72 Hours)6763A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.010.97V~1.03VBOTTOMBALLNOT SPECIFIED1V1mmNOT SPECIFIED-4003.5MBFIELD PROGRAMMABLE GATE ARRAY40672029306880317750.74 ns3.37mm27mm27mmROHS3 CompliantYES676yesField Programmable Gate ArraysCMOSnot_compliantXC7K410T676400Not Qualified11.83.3V1098MHz-1508400------
-
10 Weeks-Surface Mount676-BBGA, FCBGA-40°C~100°C TJTray2010Kintex®-7e1Active4 (72 Hours)6763A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.010.97V~1.03VBOTTOMBALL-1V1mm-S-PBGA-B6764001.4MBFIELD PROGRAMMABLE GATE ARRAY16224011980800126750.61 ns2.54mm27mm27mmROHS3 CompliantYES-yesField Programmable Gate ArraysCMOS-XC7K160676400-11.83.3V1286MHz-2202800Copper, Silver, Tin100 ps400No--
-
11 Weeks-Surface Mount900-BBGA, FCBGA0°C~100°C TJTray2009Kintex®-7e1Active4 (72 Hours)9003A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)8542.39.00.010.97V~1.03VBOTTOMBALLNOT SPECIFIED1V1mmNOT SPECIFIEDS-PBGA-B9005002MBFIELD PROGRAMMABLE GATE ARRAY32608016404480254750.58 ns3.35mm31mm31mmROHS3 CompliantYES-yesField Programmable Gate ArraysCMOSnot_compliantXC7K325T900500Not Qualified11.83.3V1412MHz-3407600--500-1GBDDR3
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
29 January 2024
TQP3M9028 RF Amplifier Alternatives, Market Trend, Applications and Other Details
Ⅰ. TQP3M9028 descriptionⅡ. Manufacturer of TQP3M9028Ⅲ. Specifications of TQP3M9028Ⅳ. Market trend of TQP3M9028Ⅴ. How to choose TQP3M9028?Ⅵ. Absolute maximum ratings of TQP3M9028Ⅶ. Where is TQP3M9028 used?TQP3M9028 is a... -
30 January 2024
AD7606BSTZ Converter Technical Parameters, Characteristics, Working Principle and Package
Ⅰ. Overview of AD7606BSTZⅡ. Technical parameters of AD7606BSTZⅢ. Characteristics of AD7606BSTZⅣ. Absolute maximum ratings of AD7606BSTZⅤ. How does AD7606BSTZ work?Ⅵ. Package of AD7606BSTZⅦ. What are the applications of... -
30 January 2024
LSM6DS3TR Alternatives, Features, Specifications, LSM6DS3TR vs LSM6DS3 and Applications
Ⅰ. Introduction to LSM6DS3TRⅡ. What are the features of LSM6DS3TR?Ⅲ. Absolute maximum ratings of LSM6DS3TRⅣ. Specifications of LSM6DS3TRⅤ. What are the advantages and disadvantages of LSM6DS3TR?Ⅵ. What is... -
31 January 2024
ISO1050DUBR Characteristics, Application Fields, Layout Guidelines and More
Ⅰ. What is a CAN transceiver?Ⅱ. Overview of ISO1050DUBRⅢ. Technical parameters of ISO1050DUBRⅣ. Characteristics of ISO1050DUBRⅤ. ISO1050DUBR symbol, footprint and pin configurationⅥ. Application fields of ISO1050DUBRⅦ. Layout guidelines...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.