Xilinx Inc. XC7A75T-2CSG324C
- Part Number:
- XC7A75T-2CSG324C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3127773-XC7A75T-2CSG324C
- Description:
- IC FPGA ARTIX7 210 I/O 324CSBGA
- Datasheet:
- XC7A75T-2CSG324C
Xilinx Inc. XC7A75T-2CSG324C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC7A75T-2CSG324C.
- Factory Lead Time12 Weeks
- Contact PlatingCopper, Silver, Tin
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case324-LFBGA, CSPBGA
- Number of Pins324
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2010
- SeriesArtix-7
- JESD-609 Codee1
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations324
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply0.95V~1.05V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1V
- Terminal Pitch0.8mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- Pin Count324
- Number of Outputs210
- Qualification StatusNot Qualified
- Power Supplies1V
- Number of I/O210
- RAM Size472.5kB
- Propagation Delay850 ps
- Turn On Delay Time850 ps
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells75520
- Total RAM Bits3870720
- Number of LABs/CLBs5900
- Speed Grade2
- Number of Registers94400
- Combinatorial Delay of a CLB-Max1.05 ns
- Height Seated (Max)1.5mm
- Length15mm
- Width15mm
- RoHS StatusROHS3 Compliant
XC7A75T-2CSG324C Overview
Contact plating is an important process in electronic manufacturing, where a thin layer of metal is applied to the surface of a component to improve its conductivity and corrosion resistance. The most commonly used metals for contact plating are copper, silver, and tin. In the case of JESD-609 code e1, the terminal finish is a combination of tin, silver, and copper (Sn/Ag/Cu), which provides excellent conductivity and durability. The terminal position for this particular component is at the bottom, with a terminal pitch of 0.8mm. With a total of 210 outputs and 210 I/Os, this component offers a high level of functionality. It also boasts an impressive 3870720 RAM bits and 5900 LABs/CLBs, making it a powerful and versatile component. Additionally, the maximum seated height is only 1.5mm, making it a compact and space-saving option for electronic devices.
XC7A75T-2CSG324C Features
210 I/Os
Up to 3870720 RAM bits
324 LABs/CLBs
94400 registers
XC7A75T-2CSG324C Applications
There are a lot of Xilinx Inc. XC7A75T-2CSG324C FPGAs applications.
Medical ultrasounds
Consumer Electronics
Industrial,Medical and Scientific Instruments
Automation
Automotive
Data center search engines
Electronic Warfare
Software-defined radio
Secure Communication
Computer hardware emulation
Contact plating is an important process in electronic manufacturing, where a thin layer of metal is applied to the surface of a component to improve its conductivity and corrosion resistance. The most commonly used metals for contact plating are copper, silver, and tin. In the case of JESD-609 code e1, the terminal finish is a combination of tin, silver, and copper (Sn/Ag/Cu), which provides excellent conductivity and durability. The terminal position for this particular component is at the bottom, with a terminal pitch of 0.8mm. With a total of 210 outputs and 210 I/Os, this component offers a high level of functionality. It also boasts an impressive 3870720 RAM bits and 5900 LABs/CLBs, making it a powerful and versatile component. Additionally, the maximum seated height is only 1.5mm, making it a compact and space-saving option for electronic devices.
XC7A75T-2CSG324C Features
210 I/Os
Up to 3870720 RAM bits
324 LABs/CLBs
94400 registers
XC7A75T-2CSG324C Applications
There are a lot of Xilinx Inc. XC7A75T-2CSG324C FPGAs applications.
Medical ultrasounds
Consumer Electronics
Industrial,Medical and Scientific Instruments
Automation
Automotive
Data center search engines
Electronic Warfare
Software-defined radio
Secure Communication
Computer hardware emulation
XC7A75T-2CSG324C More Descriptions
Field Programmable Gate Array, 5900 CLBs, 1286MHz, 75520-Cell, PBGA324
Artix-7 324-LFBGA CSPBGA Tin/Silver/Copper (Sn/Ag/Cu) Surface Mount field programmable gate array 1.5mm 1V 850ps 472.5kB
Fpga, Artix-7, 210 I/O, Csbga-324; No. Of Logic Blocks:11800; No. Of Macrocells:75520; Fpga Family:Artix-7; Logic Case Style:Csbga; No. Of Pins:324Pins; No. Of Speed Grades:2; Total Ram Bits:3780Kbit; No. Of I/O S:210I/O S; Clock Rohs Compliant: Yes |Amd Xilinx XC7A75T-2CSG324C
Artix-7 324-LFBGA CSPBGA Tin/Silver/Copper (Sn/Ag/Cu) Surface Mount field programmable gate array 1.5mm 1V 850ps 472.5kB
Fpga, Artix-7, 210 I/O, Csbga-324; No. Of Logic Blocks:11800; No. Of Macrocells:75520; Fpga Family:Artix-7; Logic Case Style:Csbga; No. Of Pins:324Pins; No. Of Speed Grades:2; Total Ram Bits:3780Kbit; No. Of I/O S:210I/O S; Clock Rohs Compliant: Yes |Amd Xilinx XC7A75T-2CSG324C
The three parts on the right have similar specifications to XC7A75T-2CSG324C.
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ImagePart NumberManufacturerFactory Lead TimeContact PlatingMountMounting TypePackage / CaseNumber of PinsOperating TemperaturePackagingPublishedSeriesJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishSubcategoryTechnologyVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)Pin CountNumber of OutputsQualification StatusPower SuppliesNumber of I/ORAM SizePropagation DelayTurn On Delay TimeProgrammable Logic TypeNumber of Logic Elements/CellsTotal RAM BitsNumber of LABs/CLBsSpeed GradeNumber of RegistersCombinatorial Delay of a CLB-MaxHeight Seated (Max)LengthWidthRoHS StatusMax Operating TemperatureMin Operating TemperatureAdditional FeatureHTS CodeTime@Peak Reflow Temperature-Max (s)Supply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Number of Logic Blocks (LABs)Supplier Device PackageBase Part NumberJESD-30 CodeOperating Supply VoltageRadiation HardeningView Compare
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XC7A75T-2CSG324C12 WeeksCopper, Silver, TinSurface MountSurface Mount324-LFBGA, CSPBGA3240°C~85°C TJTray2010Artix-7e1yesActive3 (168 Hours)3243A991.DTin/Silver/Copper (Sn/Ag/Cu)Field Programmable Gate ArraysCMOS0.95V~1.05VBOTTOMBALLNOT SPECIFIED1V0.8mmNOT SPECIFIED324210Not Qualified1V210472.5kB850 ps850 psFIELD PROGRAMMABLE GATE ARRAY75520387072059002944001.05 ns1.5mm15mm15mmROHS3 Compliant--------------
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--Surface Mount--256----e1---256EAR99Tin/Silver/Copper (Sn/Ag/Cu)---BOTTOMBALLNOT SPECIFIED0.9V1mm-----170112.5kB--FIELD PROGRAMMABLE GATE ARRAY16640----1.51 ns1.55mm17mm17mmRoHS Compliant100°C0°CALSO OPERATES AT 1V SUPPLY8542.39.00.01NOT SPECIFIED0.93V0.87V1300-----
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--Surface MountSurface Mount324-LFBGA, CSPBGA-0°C~85°C TJTray2009Artix-7--Obsolete3 (168 Hours)-----0.95V~1.05V----------210607.5kB---10144049766407925------RoHS Compliant85°C0°C-----7925324-CSPBGA (15x15)XC7A100T---
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11 Weeks-Surface MountSurface Mount484-BBGA, FCBGA--40°C~100°C TJTray2009Artix-7e0-Active4 (72 Hours)484-TIN LEAD--0.95V~1.05VBOTTOMBALL-1V------2851.6MB130 ps-FIELD PROGRAMMABLE GATE ARRAY21536013455360168251269200-2.54mm23mm23mmNon-RoHS Compliant---------XC7A200TS-PBGA-B4841VNo
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