XC6VLX365T-2FFG1156C

Xilinx Inc. XC6VLX365T-2FFG1156C

Part Number:
XC6VLX365T-2FFG1156C
Manufacturer:
Xilinx Inc.
Ventron No:
3635210-XC6VLX365T-2FFG1156C
Description:
IC FPGA 600 I/O 1156FCBGA
ECAD Model:
Datasheet:
XC6VLX365T-2FFG1156C

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Specifications
Xilinx Inc. XC6VLX365T-2FFG1156C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC6VLX365T-2FFG1156C.
  • Factory Lead Time
    10 Weeks
  • Contact Plating
    Copper, Silver, Tin
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    1156-BBGA, FCBGA
  • Number of Pins
    1156
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    2002
  • Series
    Virtex®-6 LXT
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • ECCN Code
    3A991.D
  • Terminal Finish
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    0.95V~1.05V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    1V
  • Terminal Pitch
    1mm
  • Reach Compliance Code
    not_compliant
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC6VLX365T
  • Number of Outputs
    600
  • Qualification Status
    Not Qualified
  • Number of I/O
    600
  • RAM Size
    1.8MB
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    364032
  • Total RAM Bits
    15335424
  • Number of LABs/CLBs
    28440
  • Speed Grade
    2
  • Height Seated (Max)
    3.5mm
  • Length
    35mm
  • Width
    35mm
  • RoHS Status
    ROHS3 Compliant
Description
XC6VLX365T-2FFG1156C Overview
Xilinx Inc. is a well-known brand in the technology industry, particularly in the field of Embedded - FPGAs (Field Programmable Gate Array) chips. This specific chip is highly versatile and falls under the Embedded - FPGAs (Field Programmable Gate Array) category, making it a popular choice for a wide range of applications. It has been assigned the JESD-609 code of e1, indicating its compliance with industry standards and regulations. Additionally, the chip is also Pbfree, meaning it does not contain any lead and is environmentally friendly. Its terminal pitch of 1mm makes it suitable for use in compact devices, while its reflow temperature-max (s) of 30 ensures its durability and reliability in various operating conditions. This chip boasts an impressive number of outputs, with a total of 600, making it a powerful and efficient component for any project. Although its qualification status is currently listed as Not Qualified, this does not diminish its quality and performance capabilities. With a total RAM of 15335424 bits, this chip has ample storage capacity for complex data processing tasks. Its height seated (max) of 3.5mm and length of 35mm make it compact and easy to integrate into electronic devices. Overall, the Xilinx Inc. Embedded - FPGAs chip offers high-performance and reliability, meeting various parameters and making it a top choice for engineers and designers.

XC6VLX365T-2FFG1156C Features
600 I/Os
Up to 15335424 RAM bits
1156 LABs/CLBs

XC6VLX365T-2FFG1156C Applications
There are a lot of Xilinx Inc. XC6VLX365T-2FFG1156C FPGAs applications.

Video & Image Processing
Secure Communication
Electronic Warfare
Data Mining
Software-defined radios
Radar and Sensors
Wireless Communications
Security systems
Bioinformatics
ASIC prototyping
XC6VLX365T-2FFG1156C More Descriptions
FPGA Virtex-6 LXT Family 364032 Cells 40nm (CMOS) Technology 1V 1156-Pin FC-BGA
Field Programmable Gate Array, 1286MHz, 364032-Cell, CMOS, PBGA1759
Product Description Demo for Development.
XC6VLX365T-2FFG1156C ROHS COMPLIANT: YES
Product Comparison
The three parts on the right have similar specifications to XC6VLX365T-2FFG1156C.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Contact Plating
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    ECCN Code
    Terminal Finish
    Subcategory
    Technology
    Voltage - Supply
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reach Compliance Code
    Reflow Temperature-Max (s)
    Base Part Number
    Number of Outputs
    Qualification Status
    Number of I/O
    RAM Size
    Programmable Logic Type
    Number of Logic Elements/Cells
    Total RAM Bits
    Number of LABs/CLBs
    Speed Grade
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Number of Terminations
    Max Operating Temperature
    Min Operating Temperature
    Time@Peak Reflow Temperature-Max (s)
    Pin Count
    JESD-30 Code
    Operating Supply Voltage
    Supply Voltage-Max (Vsup)
    Power Supplies
    Temperature Grade
    Clock Frequency
    Number of Inputs
    Number of Logic Blocks (LABs)
    Combinatorial Delay of a CLB-Max
    Propagation Delay
    Radiation Hardening
    View Compare
  • XC6VLX365T-2FFG1156C
    XC6VLX365T-2FFG1156C
    10 Weeks
    Copper, Silver, Tin
    Surface Mount
    Surface Mount
    1156-BBGA, FCBGA
    1156
    0°C~85°C TJ
    Tray
    2002
    Virtex®-6 LXT
    e1
    yes
    Active
    4 (72 Hours)
    3A991.D
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    Field Programmable Gate Arrays
    CMOS
    0.95V~1.05V
    BOTTOM
    BALL
    245
    1V
    1mm
    not_compliant
    30
    XC6VLX365T
    600
    Not Qualified
    600
    1.8MB
    FIELD PROGRAMMABLE GATE ARRAY
    364032
    15335424
    28440
    2
    3.5mm
    35mm
    35mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • XC6VLX130T-3FF484C
    -
    -
    Surface Mount
    -
    FCBGA
    -
    -
    -
    -
    -
    e0
    -
    -
    4 (72 Hours)
    -
    -
    Field Programmable Gate Arrays
    CMOS
    -
    BOTTOM
    BALL
    NOT SPECIFIED
    1V
    1mm
    -
    -
    -
    240
    Not Qualified
    240
    1.2MB
    FIELD PROGRAMMABLE GATE ARRAY
    128000
    -
    -
    3
    -
    -
    -
    RoHS Compliant
    484
    85°C
    0°C
    NOT SPECIFIED
    484
    S-PBGA-B484
    1V
    1.05V
    11.2/2.5V
    OTHER
    1412MHz
    240
    10000
    -
    -
    -
  • XC6VHX565T-1FFG1924C
    -
    -
    Surface Mount
    -
    FCBGA
    1924
    -
    -
    -
    -
    e1
    yes
    -
    4 (72 Hours)
    -
    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
    Field Programmable Gate Arrays
    CMOS
    -
    BOTTOM
    BALL
    245
    1V
    -
    -
    -
    -
    640
    Not Qualified
    640
    4MB
    FIELD PROGRAMMABLE GATE ARRAY
    566784
    -
    -
    1
    3.85mm
    45mm
    45mm
    RoHS Compliant
    -
    85°C
    0°C
    30
    -
    -
    1V
    -
    -
    OTHER
    -
    -
    44280
    5.08 ns
    -
    -
  • XC6VLX550T-2FF1759E
    -
    -
    Surface Mount
    -
    FCBGA
    -
    -
    -
    -
    -
    e0
    -
    -
    -
    3A001.A.7.A
    TIN LEAD
    Field Programmable Gate Arrays
    CMOS
    -
    BOTTOM
    BALL
    -
    1V
    1mm
    -
    -
    -
    840
    -
    840
    2.8MB
    FIELD PROGRAMMABLE GATE ARRAY
    549888
    -
    -
    2
    3.5mm
    -
    -
    RoHS Compliant
    1759
    100°C
    -40°C
    -
    1759
    S-PBGA-B1759
    1V
    1.05V
    -
    -
    -
    840
    42960
    -
    220 ps
    No
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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