Xilinx Inc. XC6VLX365T-2FFG1156C
- Part Number:
- XC6VLX365T-2FFG1156C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3635210-XC6VLX365T-2FFG1156C
- Description:
- IC FPGA 600 I/O 1156FCBGA
- Datasheet:
- XC6VLX365T-2FFG1156C
Xilinx Inc. XC6VLX365T-2FFG1156C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC6VLX365T-2FFG1156C.
- Factory Lead Time10 Weeks
- Contact PlatingCopper, Silver, Tin
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case1156-BBGA, FCBGA
- Number of Pins1156
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2002
- SeriesVirtex®-6 LXT
- JESD-609 Codee1
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply0.95V~1.05V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)245
- Supply Voltage1V
- Terminal Pitch1mm
- Reach Compliance Codenot_compliant
- Reflow Temperature-Max (s)30
- Base Part NumberXC6VLX365T
- Number of Outputs600
- Qualification StatusNot Qualified
- Number of I/O600
- RAM Size1.8MB
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells364032
- Total RAM Bits15335424
- Number of LABs/CLBs28440
- Speed Grade2
- Height Seated (Max)3.5mm
- Length35mm
- Width35mm
- RoHS StatusROHS3 Compliant
XC6VLX365T-2FFG1156C Overview
Xilinx Inc. is a well-known brand in the technology industry, particularly in the field of Embedded - FPGAs (Field Programmable Gate Array) chips. This specific chip is highly versatile and falls under the Embedded - FPGAs (Field Programmable Gate Array) category, making it a popular choice for a wide range of applications. It has been assigned the JESD-609 code of e1, indicating its compliance with industry standards and regulations. Additionally, the chip is also Pbfree, meaning it does not contain any lead and is environmentally friendly. Its terminal pitch of 1mm makes it suitable for use in compact devices, while its reflow temperature-max (s) of 30 ensures its durability and reliability in various operating conditions. This chip boasts an impressive number of outputs, with a total of 600, making it a powerful and efficient component for any project. Although its qualification status is currently listed as Not Qualified, this does not diminish its quality and performance capabilities. With a total RAM of 15335424 bits, this chip has ample storage capacity for complex data processing tasks. Its height seated (max) of 3.5mm and length of 35mm make it compact and easy to integrate into electronic devices. Overall, the Xilinx Inc. Embedded - FPGAs chip offers high-performance and reliability, meeting various parameters and making it a top choice for engineers and designers.
XC6VLX365T-2FFG1156C Features
600 I/Os
Up to 15335424 RAM bits
1156 LABs/CLBs
XC6VLX365T-2FFG1156C Applications
There are a lot of Xilinx Inc. XC6VLX365T-2FFG1156C FPGAs applications.
Video & Image Processing
Secure Communication
Electronic Warfare
Data Mining
Software-defined radios
Radar and Sensors
Wireless Communications
Security systems
Bioinformatics
ASIC prototyping
Xilinx Inc. is a well-known brand in the technology industry, particularly in the field of Embedded - FPGAs (Field Programmable Gate Array) chips. This specific chip is highly versatile and falls under the Embedded - FPGAs (Field Programmable Gate Array) category, making it a popular choice for a wide range of applications. It has been assigned the JESD-609 code of e1, indicating its compliance with industry standards and regulations. Additionally, the chip is also Pbfree, meaning it does not contain any lead and is environmentally friendly. Its terminal pitch of 1mm makes it suitable for use in compact devices, while its reflow temperature-max (s) of 30 ensures its durability and reliability in various operating conditions. This chip boasts an impressive number of outputs, with a total of 600, making it a powerful and efficient component for any project. Although its qualification status is currently listed as Not Qualified, this does not diminish its quality and performance capabilities. With a total RAM of 15335424 bits, this chip has ample storage capacity for complex data processing tasks. Its height seated (max) of 3.5mm and length of 35mm make it compact and easy to integrate into electronic devices. Overall, the Xilinx Inc. Embedded - FPGAs chip offers high-performance and reliability, meeting various parameters and making it a top choice for engineers and designers.
XC6VLX365T-2FFG1156C Features
600 I/Os
Up to 15335424 RAM bits
1156 LABs/CLBs
XC6VLX365T-2FFG1156C Applications
There are a lot of Xilinx Inc. XC6VLX365T-2FFG1156C FPGAs applications.
Video & Image Processing
Secure Communication
Electronic Warfare
Data Mining
Software-defined radios
Radar and Sensors
Wireless Communications
Security systems
Bioinformatics
ASIC prototyping
XC6VLX365T-2FFG1156C More Descriptions
FPGA Virtex-6 LXT Family 364032 Cells 40nm (CMOS) Technology 1V 1156-Pin FC-BGA
Field Programmable Gate Array, 1286MHz, 364032-Cell, CMOS, PBGA1759
Product Description Demo for Development.
XC6VLX365T-2FFG1156C ROHS COMPLIANT: YES
Field Programmable Gate Array, 1286MHz, 364032-Cell, CMOS, PBGA1759
Product Description Demo for Development.
XC6VLX365T-2FFG1156C ROHS COMPLIANT: YES
The three parts on the right have similar specifications to XC6VLX365T-2FFG1156C.
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ImagePart NumberManufacturerFactory Lead TimeContact PlatingMountMounting TypePackage / CaseNumber of PinsOperating TemperaturePackagingPublishedSeriesJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)ECCN CodeTerminal FinishSubcategoryTechnologyVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReach Compliance CodeReflow Temperature-Max (s)Base Part NumberNumber of OutputsQualification StatusNumber of I/ORAM SizeProgrammable Logic TypeNumber of Logic Elements/CellsTotal RAM BitsNumber of LABs/CLBsSpeed GradeHeight Seated (Max)LengthWidthRoHS StatusNumber of TerminationsMax Operating TemperatureMin Operating TemperatureTime@Peak Reflow Temperature-Max (s)Pin CountJESD-30 CodeOperating Supply VoltageSupply Voltage-Max (Vsup)Power SuppliesTemperature GradeClock FrequencyNumber of InputsNumber of Logic Blocks (LABs)Combinatorial Delay of a CLB-MaxPropagation DelayRadiation HardeningView Compare
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XC6VLX365T-2FFG1156C10 WeeksCopper, Silver, TinSurface MountSurface Mount1156-BBGA, FCBGA11560°C~85°C TJTray2002Virtex®-6 LXTe1yesActive4 (72 Hours)3A991.DTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)Field Programmable Gate ArraysCMOS0.95V~1.05VBOTTOMBALL2451V1mmnot_compliant30XC6VLX365T600Not Qualified6001.8MBFIELD PROGRAMMABLE GATE ARRAY364032153354242844023.5mm35mm35mmROHS3 Compliant-----------------
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--Surface Mount-FCBGA-----e0--4 (72 Hours)--Field Programmable Gate ArraysCMOS-BOTTOMBALLNOT SPECIFIED1V1mm---240Not Qualified2401.2MBFIELD PROGRAMMABLE GATE ARRAY128000--3---RoHS Compliant48485°C0°CNOT SPECIFIED484S-PBGA-B4841V1.05V11.2/2.5VOTHER1412MHz24010000---
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--Surface Mount-FCBGA1924----e1yes-4 (72 Hours)-Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)Field Programmable Gate ArraysCMOS-BOTTOMBALL2451V----640Not Qualified6404MBFIELD PROGRAMMABLE GATE ARRAY566784--13.85mm45mm45mmRoHS Compliant-85°C0°C30--1V--OTHER--442805.08 ns--
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--Surface Mount-FCBGA-----e0---3A001.A.7.ATIN LEADField Programmable Gate ArraysCMOS-BOTTOMBALL-1V1mm---840-8402.8MBFIELD PROGRAMMABLE GATE ARRAY549888--23.5mm--RoHS Compliant1759100°C-40°C-1759S-PBGA-B17591V1.05V---84042960-220 psNo
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