Xilinx Inc. XC6VLX240T-3FFG1156C

Name: XC6VLX240T-3FFG1156C
Brand: Xilinx Inc.
SKU: 3636107-XC6VLX240T-3FFG1156C
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XC6VLX240T-3FFG1156C

Manufacturer:: Xilinx Inc.

Ventron No:: 3636107-XC6VLX240T-3FFG1156C

Description:: IC FPGA 600 I/O 1156FCBGA

ECAD Model:

Datasheet:: XC6VLX240T-3FFG1156C

Specifications

Xilinx Inc. XC6VLX240T-3FFG1156C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC6VLX240T-3FFG1156C.

Factory Lead Time
10 Weeks
Contact Plating
Copper, Silver, Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
1156-BBGA, FCBGA
Number of Pins
1156
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2008
Series
Virtex®-6 LXT
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
0.95V~1.05V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
245
Terminal Pitch
1mm
Reach Compliance Code
not_compliant
Reflow Temperature-Max (s)
30
Base Part Number
XC6VLX240T
Number of Outputs
600
Qualification Status
Not Qualified
Power Supplies
11.2/2.5V
Number of I/O
600
RAM Size
1.8MB
Clock Frequency
1412MHz
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
241152
Total RAM Bits
15335424
Number of LABs/CLBs
18840
Speed Grade
3
RoHS Status
ROHS3 Compliant

Description

XC6VLX240T-3FFG1156C Overview
The surface mount type of mount is commonly used for electronic components, and the specific part in question has a total of 1156 pins. It was first published in 2008 and is still an active part in the market. The moisture sensitivity level (MSL) for this component is 4, which means it can withstand up to 72 hours of exposure to moisture without being damaged. The terminal position is located at the bottom of the component, and the terminal form is in the shape of a ball. It is important to note that this component is not compliant with the Reach Compliance Code. Additionally, it has a high number of 600 input/output connections and is compliant with the RoHS3 standards.

XC6VLX240T-3FFG1156C Features
600 I/Os
Up to 15335424 RAM bits
1156 LABs/CLBs

XC6VLX240T-3FFG1156C Applications
There are a lot of Xilinx Inc. XC6VLX240T-3FFG1156C FPGAs applications.

Secure Communication
High Performance Computing
Video & Image Processing
Industrial,Medical and Scientific Instruments
Military DSP
Software-defined radios
Development Boards and Shields for Microcontrollers
Artificial intelligence (AI)
Solar Energy
Automotive

XC6VLX240T-3FFG1156C More Descriptions

FPGA Virtex-6 LXT Family 241152 Cells 40nm (CMOS) Technology 1V 1156-Pin FC-BGA
Field Programmable Gate Array, 1098MHz, 241152-Cell, CMOS, PBGA1759
FPGA - Field Programmable Gate Array XC6VLX240T-3FFG1156C
Product Description Demo for Development.

Product Comparison

The three parts on the right have similar specifications to XC6VLX240T-3FFG1156C.

Image

Part Number

Manufacturer

Factory Lead Time

Contact Plating

Mount

Mounting Type

Package / Case

Number of Pins

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Pbfree Code

Part Status

Moisture Sensitivity Level (MSL)

Subcategory

Technology

Voltage - Supply

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Terminal Pitch

Reach Compliance Code

Reflow Temperature-Max (s)

Base Part Number

Number of Outputs

Qualification Status

Power Supplies

Number of I/O

RAM Size

Clock Frequency

Programmable Logic Type

Number of Logic Elements/Cells

Total RAM Bits

Number of LABs/CLBs

Speed Grade

RoHS Status

Number of Terminations

ECCN Code

Terminal Finish

Supply Voltage

Pin Count

Operating Supply Voltage

Height Seated (Max)

Supplier Device Package

Max Operating Temperature

Min Operating Temperature

Propagation Delay

Number of Logic Blocks (LABs)

Radiation Hardening

Time@Peak Reflow Temperature-Max (s)

Temperature Grade

Combinatorial Delay of a CLB-Max

Length

Width

View Compare
XC6VLX240T-3FFG1156C

Xilinx Inc.

10 Weeks

Copper, Silver, Tin

Surface Mount

Surface Mount

1156-BBGA, FCBGA

1156

0°C~85°C TJ

Tray

2008

Virtex®-6 LXT

e1

yes

Active

4 (72 Hours)

Field Programmable Gate Arrays

CMOS

0.95V~1.05V

BOTTOM

BALL

245

1mm

not_compliant

30

XC6VLX240T

600

Not Qualified

11.2/2.5V

600

1.8MB

1412MHz

FIELD PROGRAMMABLE GATE ARRAY

241152

15335424

18840

3

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
XC6VLX130T-2FF484I

Xilinx Inc.

14 Weeks

-

Surface Mount

Surface Mount

484-BBGA, FCBGA

484

-40°C~100°C TJ

Tray

2008

Virtex®-6 LXT

e0

no

Active

4 (72 Hours)

Field Programmable Gate Arrays

CMOS

0.95V~1.05V

BOTTOM

BALL

NOT SPECIFIED

1mm

not_compliant

NOT SPECIFIED

XC6VLX130T

240

Not Qualified

-

240

1.2MB

-

FIELD PROGRAMMABLE GATE ARRAY

128000

9732096

10000

2

ROHS3 Compliant

484

3A991.D

Tin/Lead (Sn63Pb37)

1V

484

1V

3mm

-

-

-

-

-

-

-

-

-

-

-

XC6VLX240T-3FFG1156C vs XC6VLX130T-2FF484I
XC6VSX475T-2FF1759E

Xilinx Inc.

10 Weeks

-

Surface Mount

Surface Mount

1760-BBGA, FCBGA

-

0°C~100°C TJ

Tray

2008

Virtex®-6 SXT

-

-

Active

4 (72 Hours)

-

-

0.95V~1.05V

-

-

-

-

-

-

XC6VSX475T

-

-

-

840

4.7MB

-

-

476160

39223296

37200

2

Non-RoHS Compliant

-

-

-

-

-

1V

-

1759-FCBGA (42.5x42.5)

100°C

0°C

220 ps

37200

No

-

-

-

-

-

XC6VLX240T-3FFG1156C vs XC6VSX475T-2FF1759E
XC6VHX565T-1FFG1924C

Xilinx Inc.

-

-

Surface Mount

-

FCBGA

1924

-

-

-

-

e1

yes

-

4 (72 Hours)

Field Programmable Gate Arrays

CMOS

-

BOTTOM

BALL

245

-

-

-

-

640

Not Qualified

-

640

4MB

-

FIELD PROGRAMMABLE GATE ARRAY

566784

-

-

1

RoHS Compliant

-

-

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

1V

-

1V

3.85mm

-

85°C

0°C

-

44280

-

30

OTHER

5.08 ns

45mm

45mm

XC6VLX240T-3FFG1156C vs XC6VHX565T-1FFG1924C