XC5VLX50-1FFG676CES

Xilinx Inc. XC5VLX50-1FFG676CES

Part Number:
XC5VLX50-1FFG676CES
Manufacturer:
Xilinx Inc.
Ventron No:
3639358-XC5VLX50-1FFG676CES
Description:
IC FPGA 440 I/O 676FCBGA
ECAD Model:
Datasheet:
XC5VLX50-1FFG676CES

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Specifications
Xilinx Inc. XC5VLX50-1FFG676CES technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC5VLX50-1FFG676CES.
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    676-BBGA, FCBGA
  • Supplier Device Package
    676-FCBGA (27x27)
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Series
    Virtex®-5 LX
  • Published
    1999
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Max Operating Temperature
    85°C
  • Min Operating Temperature
    0°C
  • Voltage - Supply
    0.95V~1.05V
  • Base Part Number
    XC5VLX50
  • Number of I/O
    440
  • RAM Size
    216kB
  • Number of Logic Elements/Cells
    46080
  • Total RAM Bits
    1769472
  • Number of LABs/CLBs
    3600
  • Number of Logic Blocks (LABs)
    3600
  • RoHS Status
    RoHS Compliant
  • Lead Free
    Lead Free
Description
XC5VLX50-1FFG676CES Overview
There is a 676-BBGA, FCBGA package that includes this component. 440 I/Os are available for transferring data more efficiently. A fundamental building block consists of 46080 logic elements/cells. The Surface Mount-slot on the development board allows you to attach the FPGA module. A supply voltage of 0.95V~1.05V is needed in order for fpga chips to operate. As part of the Virtex®-5 LX series of FPGAs, it is a type of FPGA. While operating, the operating temperature should be kept within a range of 0°C~85°C TJ. As a space-saving measure, this FPGA model is contained within Tray. There are 1769472 RAM bits that are available with this device. In order to find related parts, you can use its base part number XC5VLX50. There is a maximum RAM si216kBe of 216kB on this FPGA module, which is necessary to ensure the normal operation of the program. 3600 LABs and CLBs are built into this FPGA. Providing that this FPGA is mounted in Surface Mount, it will be able to perform according to its specifications in a flawless manner. This module is capable of operating at a maximum temperature of 85°C. 0°C should be higher than the operating temperature. There are a total of 3600 logic blocks (LABs) that form the basic building blocks of this program. There is a device package provided by 676-FCBGA (27x27) as its supplier.

XC5VLX50-1FFG676CES Features
440 I/Os
Up to 1769472 RAM bits
85°C gates
3600 logic blocks (LABs)


XC5VLX50-1FFG676CES Applications
There are a lot of Xilinx Inc.
XC5VLX50-1FFG676CES FPGAs applications.


Device controllers
Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
XC5VLX50-1FFG676CES More Descriptions
IC FPGA 440 I/O 676FCBGA
IC FPGA 220 I/O 324FCBGA
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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