Xilinx Inc. XC5VLX50-1FF676I
- Part Number:
- XC5VLX50-1FF676I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3641407-XC5VLX50-1FF676I
- Description:
- IC FPGA 440 I/O 676FCBGA
- Datasheet:
- XC5VLX50-1FF676I
Xilinx Inc. XC5VLX50-1FF676I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC5VLX50-1FF676I.
- Factory Lead Time10 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case676-BBGA, FCBGA
- Number of Pins676
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published1999
- SeriesVirtex®-5 LX
- JESD-609 Codee0
- Pbfree Codeno
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations676
- Terminal FinishTin/Lead (Sn63Pb37)
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply0.95V~1.05V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)225
- Supply Voltage1V
- Reflow Temperature-Max (s)30
- Base Part NumberXC5VLX50
- Pin Count676
- Number of Outputs440
- Qualification StatusNot Qualified
- Operating Supply Voltage1V
- Number of I/O440
- RAM Size216kB
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells46080
- Total RAM Bits1769472
- Number of LABs/CLBs3600
- Speed Grade1
- Height Seated (Max)3mm
- Length27mm
- Width27mm
- RoHS StatusNon-RoHS Compliant
XC5VLX50-1FF676I Overview
The Pbfree Code for this specific product is "no", indicating that it does not contain any lead. The Terminal Finish is a combination of Tin and Lead, with a ratio of 63% Tin and 37% Lead (Sn63Pb37). The Peak Reflow Temperature is 225 degrees Celsius, which is the maximum temperature at which the product can be heated during the manufacturing process. This particular product has a Pin Count of 676 and a high number of I/O (Input/Output) at 440. It falls under the category of a FIELD PROGRAMMABLE GATE ARRAY, with 46080 Logic Elements/Cells and a Total RAM Bits capacity of 1769472. It also has 3600 LABs/CLBs (Logic Array Blocks/Configurable Logic Blocks) and a maximum seated height of 3mm.
XC5VLX50-1FF676I Features
440 I/Os
Up to 1769472 RAM bits
676 LABs/CLBs
XC5VLX50-1FF676I Applications
There are a lot of Xilinx Inc. XC5VLX50-1FF676I FPGAs applications.
Defense Applications
Automotive
Military Temperature
Digital signal processing
Industrial,Medical and Scientific Instruments
Video & Image Processing
Random logic
ADAS
Automotive Applications
Voice recognition
The Pbfree Code for this specific product is "no", indicating that it does not contain any lead. The Terminal Finish is a combination of Tin and Lead, with a ratio of 63% Tin and 37% Lead (Sn63Pb37). The Peak Reflow Temperature is 225 degrees Celsius, which is the maximum temperature at which the product can be heated during the manufacturing process. This particular product has a Pin Count of 676 and a high number of I/O (Input/Output) at 440. It falls under the category of a FIELD PROGRAMMABLE GATE ARRAY, with 46080 Logic Elements/Cells and a Total RAM Bits capacity of 1769472. It also has 3600 LABs/CLBs (Logic Array Blocks/Configurable Logic Blocks) and a maximum seated height of 3mm.
XC5VLX50-1FF676I Features
440 I/Os
Up to 1769472 RAM bits
676 LABs/CLBs
XC5VLX50-1FF676I Applications
There are a lot of Xilinx Inc. XC5VLX50-1FF676I FPGAs applications.
Defense Applications
Automotive
Military Temperature
Digital signal processing
Industrial,Medical and Scientific Instruments
Video & Image Processing
Random logic
ADAS
Automotive Applications
Voice recognition
XC5VLX50-1FF676I More Descriptions
FPGA Virtex-5 LX Family 46080 Cells 65nm (CMOS) Technology 1V 676-Pin FCBGA
Field Programmable Gate Array, 3600 CLBs, 46080-Cell, PBGA676
FPGA - Field Programmable Gate Array XC5VLX50-1FF676I
Product Description Demo for Development.
Field Programmable Gate Array, 3600 CLBs, 46080-Cell, PBGA676
FPGA - Field Programmable Gate Array XC5VLX50-1FF676I
Product Description Demo for Development.
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