Xilinx Inc. XC4VLX25-12SFG363C

Name: XC4VLX25-12SFG363C
Brand: Xilinx Inc.
SKU: 3635130-XC4VLX25-12SFG363C
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XC4VLX25-12SFG363C

Manufacturer:: Xilinx Inc.

Ventron No:: 3635130-XC4VLX25-12SFG363C

Description:: IC FPGA 240 I/O 363FCBGA

ECAD Model:

Datasheet:: XC4VLX25-12SFG363C

Specifications

Xilinx Inc. XC4VLX25-12SFG363C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC4VLX25-12SFG363C.

Factory Lead Time
10 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
363-FBGA, FCBGA
Number of Pins
363
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
1999
Series
Virtex®-4 LX
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
363
ECCN Code
3A991.D
Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
1.14V~1.26V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Supply Voltage
1.2V
Terminal Pitch
0.8mm
Reach Compliance Code
not_compliant
Reflow Temperature-Max (s)
30
Base Part Number
XC4VLX25
Pin Count
363
Number of Outputs
240
Qualification Status
Not Qualified
Operating Supply Voltage
1.2V
Number of I/O
240
RAM Size
162kB
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
24192
Total RAM Bits
1327104
Number of LABs/CLBs
2688
Speed Grade
12
Height Seated (Max)
1.99mm
Length
17mm
Width
17mm
RoHS Status
ROHS3 Compliant

Description

XC4VLX25-12SFG363C Overview
This specific component is manufactured by Xilinx Inc. and falls under the category of Embedded - FPGAs (Field Programmable Gate Array) chips. It is packaged in a tray and has a JESD-609 code of e1. It is also lead-free with a Pbfree code of yes. The terminal finish is made of Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5). The peak reflow temperature for this chip is 260 degrees Celsius and it can withstand a maximum reflow temperature of 30 seconds. It has a total of 240 input/output connections and a RAM size of 162kB. Additionally, it contains 24192 logic elements/cells and 2688 LABs/CLBs.

XC4VLX25-12SFG363C Features
240 I/Os
Up to 1327104 RAM bits
363 LABs/CLBs

XC4VLX25-12SFG363C Applications
There are a lot of Xilinx Inc. XC4VLX25-12SFG363C FPGAs applications.

ADAS
Defense Applications
Broadcast
Industrial IoT
OpenCL
Scientific Instruments
Software-defined radio
Video & Image Processing
Audio
Automation

XC4VLX25-12SFG363C More Descriptions

FPGA Virtex-4 LX Family 24192 Cells 90nm (CMOS) Technology 1.2V 363-Pin FCBGA
FPGA - Field Programmable Gate Array
IC FPGA 240 I/O 363FCBGA
TRANS 2NPN 11V 0.05A 6UMT
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Certification