Xilinx Inc. XC4VLX25-11FFG668I
- Part Number:
- XC4VLX25-11FFG668I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3128662-XC4VLX25-11FFG668I
- Description:
- IC FPGA 448 I/O 668FCBGA
- Datasheet:
- XC4VLX25-11FFG668I
Xilinx Inc. XC4VLX25-11FFG668I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC4VLX25-11FFG668I.
- Factory Lead Time10 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case668-BBGA, FCBGA
- Number of Pins175
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published1999
- SeriesVirtex®-4 LX
- JESD-609 Codee1
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations668
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply1.14V~1.26V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)245
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)30
- Base Part NumberXC4VLX25
- Pin Count668
- JESD-30 CodeS-PBGA-B668
- Number of Outputs448
- Operating Supply Voltage5V
- Number of I/O448
- RAM Size162kB
- Clock Frequency1205MHz
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells24192
- Total RAM Bits1327104
- Number of LABs/CLBs2688
- Speed Grade100
- Number of Registers928
- Height Seated (Max)2.85mm
- Length27mm
- Width27mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
XC4VLX25-11FFG668I Overview
The product is a surface mount device with an active part status, meaning it is currently in production. It has a moisture sensitivity level of 4, indicating that it can withstand exposure to moisture for up to 72 hours. The device has 668 terminations and falls under ECCN Code 3A991.D. Its base part number is XC4VLX25 and it has 448 outputs. The RAM size is 162kB and it has a speed grade of 100. The maximum seated height is 2.85mm.
XC4VLX25-11FFG668I Features
448 I/Os
Up to 1327104 RAM bits
175 LABs/CLBs
928 registers
XC4VLX25-11FFG668I Applications
There are a lot of Xilinx Inc. XC4VLX25-11FFG668I FPGAs applications.
Consumer Electronics
Device controllers
Automation
Audio
Bioinformatics
Scientific Instruments
Solar Energy
Video & Image Processing
Automotive driver's assistance
ADAS
The product is a surface mount device with an active part status, meaning it is currently in production. It has a moisture sensitivity level of 4, indicating that it can withstand exposure to moisture for up to 72 hours. The device has 668 terminations and falls under ECCN Code 3A991.D. Its base part number is XC4VLX25 and it has 448 outputs. The RAM size is 162kB and it has a speed grade of 100. The maximum seated height is 2.85mm.
XC4VLX25-11FFG668I Features
448 I/Os
Up to 1327104 RAM bits
175 LABs/CLBs
928 registers
XC4VLX25-11FFG668I Applications
There are a lot of Xilinx Inc. XC4VLX25-11FFG668I FPGAs applications.
Consumer Electronics
Device controllers
Automation
Audio
Bioinformatics
Scientific Instruments
Solar Energy
Video & Image Processing
Automotive driver's assistance
ADAS
XC4VLX25-11FFG668I More Descriptions
FPGA Virtex-4 LX Family 24192 Cells 90nm (CMOS) Technology 1.2V 668-Pin FCBGA
Field Programmable Gate Array, 2688 CLBs, 1205MHz, 24192-Cell, CMOS, PBGA363
Inductor RF Chip Thin Film 150nH 5% 100MHz 5Q-Factor 80mA 9Ohm DCR 0201 T/R
Field Programmable Gate Array, 2688 CLBs, 1205MHz, 24192-Cell, CMOS, PBGA363
Inductor RF Chip Thin Film 150nH 5% 100MHz 5Q-Factor 80mA 9Ohm DCR 0201 T/R
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