Xilinx Inc. XC4VLX25-10SFG363I
- Part Number:
- XC4VLX25-10SFG363I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3129123-XC4VLX25-10SFG363I
- Description:
- IC FPGA 240 I/O 363FCBGA
- Datasheet:
- XC4VLX25-10SFG363I
Xilinx Inc. XC4VLX25-10SFG363I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC4VLX25-10SFG363I.
- Factory Lead Time10 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case363-FBGA, FCBGA
- Number of Pins363
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published1998
- SeriesVirtex®-4 LX
- JESD-609 Codee1
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations363
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply1.14V~1.26V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)260
- Supply Voltage1.2V
- Terminal Pitch0.8mm
- Reach Compliance Codenot_compliant
- Reflow Temperature-Max (s)30
- Base Part NumberXC4VLX25
- Pin Count363
- Number of Outputs240
- Qualification StatusNot Qualified
- Operating Supply Voltage1.2V
- Number of I/O240
- RAM Size162kB
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells24192
- Total RAM Bits1327104
- Number of LABs/CLBs2688
- Speed Grade10
- Height Seated (Max)1.99mm
- Length17mm
- Width17mm
- RoHS StatusROHS3 Compliant
XC4VLX25-10SFG363I Overview
The package or case for this product is 363-FBGA or FCBGA, and it is packaged in a tray. The JESD-609 code for this product is e1, indicating its use of CMOS technology. The peak reflow temperature for this product is 260 degrees Celsius. It has a pin count of 363 and 240 outputs. The total RAM bits for this product is 1327104, and its speed grade is 10. This product is also ROHS3 compliant.
XC4VLX25-10SFG363I Features
240 I/Os
Up to 1327104 RAM bits
363 LABs/CLBs
XC4VLX25-10SFG363I Applications
There are a lot of Xilinx Inc. XC4VLX25-10SFG363I FPGAs applications.
Security systems
Audio
Space Applications
Distributed Monetary Systems
Digital signal processing
Data center hardware accelerators
Random logic
Military DSP
Defense Applications
Telecommunication
The package or case for this product is 363-FBGA or FCBGA, and it is packaged in a tray. The JESD-609 code for this product is e1, indicating its use of CMOS technology. The peak reflow temperature for this product is 260 degrees Celsius. It has a pin count of 363 and 240 outputs. The total RAM bits for this product is 1327104, and its speed grade is 10. This product is also ROHS3 compliant.
XC4VLX25-10SFG363I Features
240 I/Os
Up to 1327104 RAM bits
363 LABs/CLBs
XC4VLX25-10SFG363I Applications
There are a lot of Xilinx Inc. XC4VLX25-10SFG363I FPGAs applications.
Security systems
Audio
Space Applications
Distributed Monetary Systems
Digital signal processing
Data center hardware accelerators
Random logic
Military DSP
Defense Applications
Telecommunication
XC4VLX25-10SFG363I More Descriptions
FPGA Virtex-4 LX Family 24192 Cells 90nm (CMOS) Technology 1.2V 363-Pin FCBGA
Field Programmable Gate Array, 1205MHz, 24192-Cell, CMOS, PBGA668
IC FPGA 300 I/O 536CSPBGA
IC FPGA 240 I/O 363FCBGA
OEMs, CMs ONLY (NO BROKERS)
Contact for details
100% Original New
Field Programmable Gate Array, 1205MHz, 24192-Cell, CMOS, PBGA668
IC FPGA 300 I/O 536CSPBGA
IC FPGA 240 I/O 363FCBGA
OEMs, CMs ONLY (NO BROKERS)
Contact for details
100% Original New
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