Xilinx Inc. XC4VFX12-11SFG363C
- Part Number:
- XC4VFX12-11SFG363C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3635613-XC4VFX12-11SFG363C
- Description:
- IC FPGA 240 I/O 363FCBGA
- Datasheet:
- XC4VFX12-11SFG363C
Xilinx Inc. XC4VFX12-11SFG363C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC4VFX12-11SFG363C.
- Factory Lead Time10 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case363-FBGA, FCBGA
- Number of Pins363
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published1999
- SeriesVirtex®-4 FX
- JESD-609 Codee1
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations363
- ECCN Code3A991.D
- Terminal FinishTin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply1.14V~1.26V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)260
- Supply Voltage1.2V
- Terminal Pitch0.8mm
- Reach Compliance Codenot_compliant
- Reflow Temperature-Max (s)30
- Base Part NumberXC4VFX12
- Pin Count363
- Number of Outputs240
- Qualification StatusNot Qualified
- Operating Supply Voltage1.2V
- Number of I/O240
- RAM Size81kB
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells12312
- Total RAM Bits663552
- Number of LABs/CLBs1368
- Speed Grade11
- Height Seated (Max)1.99mm
- Length17mm
- Width17mm
- RoHS StatusROHS3 Compliant
XC4VFX12-11SFG363C Overview
This component is manufactured by Xilinx Inc. and falls under the category of Embedded - FPGAs (Field Programmable Gate Array) chips. It is designed to be surface mounted and has a package or case size of 363-FBGA, FCBGA. It has a Moisture Sensitivity Level (MSL) rating of 4, meaning it can withstand exposure to moisture for up to 72 hours. The chip has 363 terminations and is not compliant with Reach regulations. Its base part number is XC4VFX12 and it has not yet been qualified. It operates at a voltage of 1.2V and has a total of 240 input/output connections. The chip also has 1368 logic array blocks or configurable logic blocks.
XC4VFX12-11SFG363C Features
240 I/Os
Up to 663552 RAM bits
363 LABs/CLBs
XC4VFX12-11SFG363C Applications
There are a lot of Xilinx Inc. XC4VFX12-11SFG363C FPGAs applications.
Voice recognition
Military DSP
ADAS
Data center hardware accelerators
Ecosystem
Data Mining
Artificial intelligence (AI)
Wireless Communications
ASIC prototyping
Industrial,Medical and Scientific Instruments
This component is manufactured by Xilinx Inc. and falls under the category of Embedded - FPGAs (Field Programmable Gate Array) chips. It is designed to be surface mounted and has a package or case size of 363-FBGA, FCBGA. It has a Moisture Sensitivity Level (MSL) rating of 4, meaning it can withstand exposure to moisture for up to 72 hours. The chip has 363 terminations and is not compliant with Reach regulations. Its base part number is XC4VFX12 and it has not yet been qualified. It operates at a voltage of 1.2V and has a total of 240 input/output connections. The chip also has 1368 logic array blocks or configurable logic blocks.
XC4VFX12-11SFG363C Features
240 I/Os
Up to 663552 RAM bits
363 LABs/CLBs
XC4VFX12-11SFG363C Applications
There are a lot of Xilinx Inc. XC4VFX12-11SFG363C FPGAs applications.
Voice recognition
Military DSP
ADAS
Data center hardware accelerators
Ecosystem
Data Mining
Artificial intelligence (AI)
Wireless Communications
ASIC prototyping
Industrial,Medical and Scientific Instruments
XC4VFX12-11SFG363C More Descriptions
FPGA Virtex-4 FX Family 12312 Cells 90nm (CMOS) Technology 1.2V 363-Pin FCBGA
Field Programmable Gate Array, 1181MHz, 12312-Cell, CMOS, PBGA668
IC REG LINEAR 1.5V 200MA SC70-5
Field Programmable Gate Array, 1181MHz, 12312-Cell, CMOS, PBGA668
IC REG LINEAR 1.5V 200MA SC70-5
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