XC4VFX12-11SFG363C

Xilinx Inc. XC4VFX12-11SFG363C

Part Number:
XC4VFX12-11SFG363C
Manufacturer:
Xilinx Inc.
Ventron No:
3635613-XC4VFX12-11SFG363C
Description:
IC FPGA 240 I/O 363FCBGA
ECAD Model:
Datasheet:
XC4VFX12-11SFG363C

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Specifications
Xilinx Inc. XC4VFX12-11SFG363C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC4VFX12-11SFG363C.
  • Factory Lead Time
    10 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    363-FBGA, FCBGA
  • Number of Pins
    363
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    1999
  • Series
    Virtex®-4 FX
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • Number of Terminations
    363
  • ECCN Code
    3A991.D
  • Terminal Finish
    Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    1.14V~1.26V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    1.2V
  • Terminal Pitch
    0.8mm
  • Reach Compliance Code
    not_compliant
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC4VFX12
  • Pin Count
    363
  • Number of Outputs
    240
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    1.2V
  • Number of I/O
    240
  • RAM Size
    81kB
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    12312
  • Total RAM Bits
    663552
  • Number of LABs/CLBs
    1368
  • Speed Grade
    11
  • Height Seated (Max)
    1.99mm
  • Length
    17mm
  • Width
    17mm
  • RoHS Status
    ROHS3 Compliant
Description
XC4VFX12-11SFG363C Overview
This component is manufactured by Xilinx Inc. and falls under the category of Embedded - FPGAs (Field Programmable Gate Array) chips. It is designed to be surface mounted and has a package or case size of 363-FBGA, FCBGA. It has a Moisture Sensitivity Level (MSL) rating of 4, meaning it can withstand exposure to moisture for up to 72 hours. The chip has 363 terminations and is not compliant with Reach regulations. Its base part number is XC4VFX12 and it has not yet been qualified. It operates at a voltage of 1.2V and has a total of 240 input/output connections. The chip also has 1368 logic array blocks or configurable logic blocks.

XC4VFX12-11SFG363C Features
240 I/Os
Up to 663552 RAM bits
363 LABs/CLBs

XC4VFX12-11SFG363C Applications
There are a lot of Xilinx Inc. XC4VFX12-11SFG363C FPGAs applications.

Voice recognition
Military DSP
ADAS
Data center hardware accelerators
Ecosystem
Data Mining
Artificial intelligence (AI)
Wireless Communications
ASIC prototyping
Industrial,Medical and Scientific Instruments
XC4VFX12-11SFG363C More Descriptions
FPGA Virtex-4 FX Family 12312 Cells 90nm (CMOS) Technology 1.2V 363-Pin FCBGA
Field Programmable Gate Array, 1181MHz, 12312-Cell, CMOS, PBGA668
IC REG LINEAR 1.5V 200MA SC70-5
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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