XC3S700A-5FGG484C

Xilinx Inc. XC3S700A-5FGG484C

Part Number:
XC3S700A-5FGG484C
Manufacturer:
Xilinx Inc.
Ventron No:
3821597-XC3S700A-5FGG484C
Description:
IC FPGA 372 I/O 484FBGA
ECAD Model:
Datasheet:
XC3S700A-5FGG484C

Quick Request Quote

Please send RFQ , We will respond immediately.

Part Number
Quantity
Company
E-mail
Phone
Comments
Specifications
Xilinx Inc. XC3S700A-5FGG484C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC3S700A-5FGG484C.
  • Factory Lead Time
    10 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    484-BBGA
  • Number of Pins
    484
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    1999
  • Series
    Spartan®-3A
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    484
  • ECCN Code
    3A991.D
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    1.14V~1.26V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    250
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC3S700A
  • Pin Count
    484
  • Number of Outputs
    288
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    1.2V
  • Number of I/O
    372
  • RAM Size
    45kB
  • Clock Frequency
    770MHz
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    13248
  • Total RAM Bits
    368640
  • Number of Gates
    700000
  • Number of LABs/CLBs
    1472
  • Speed Grade
    5
  • Combinatorial Delay of a CLB-Max
    0.62 ns
  • Height Seated (Max)
    2.6mm
  • Length
    23mm
  • Width
    23mm
  • RoHS Status
    ROHS3 Compliant
Description
XC3S700A-5FGG484C Overview
This particular component is manufactured by Xilinx Inc. and falls under the category of Embedded - FPGAs (Field Programmable Gate Array) chips. It is designed to be mounted on the surface of a circuit board and can operate within a temperature range of 0°C to 85°C. It has been assigned the JESD-609 Code e1 and has a Moisture Sensitivity Level (MSL) of 3, meaning it can withstand exposure to moisture for up to 168 hours. The chip requires a voltage supply of 1.14V to 1.26V and has a BALL terminal form. It has a total of 288 outputs and contains 13248 logic elements/cells. The speed grade of this chip is 5, indicating its processing speed capabilities. Its physical length measures 23mm.

XC3S700A-5FGG484C Features
372 I/Os
Up to 368640 RAM bits
484 LABs/CLBs

XC3S700A-5FGG484C Applications
There are a lot of Xilinx Inc. XC3S700A-5FGG484C FPGAs applications.

Software-defined radio
Embedded Vision
Scientific Instruments
Electronic Warfare
Voice recognition
Medical imaging
Secure Communication
Automation
Distributed Monetary Systems
Device controllers
XC3S700A-5FGG484C More Descriptions
FPGA Spartan®-3A Family 700K Gates 13248 Cells 770MHz 90nm Technology 1.2V 484-Pin FBGA
Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 667MHz, 13248-Cell, CMOS, PBGA484
IC FPGA 372 I/O 484FBGA
IC FPGA 264 I/O 456FBGA
OEMs, CMs ONLY (NO BROKERS)
Contact for details
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

Latest News

  • 21 September 2023

    Difference Between 2N2222 and BC547 Transistor

    Ⅰ. What is 2N2222?Ⅱ. What is BC547?Ⅲ. 2N2222 vs BC547 symbolⅣ. 2N2222 vs BC547 technical parametersⅤ. 2N2222 vs BC547 pin comparisonⅥ. 2N2222 vs BC547 featuresⅦ. 2N2222 vs BC547...
  • 22 September 2023

    Power Transistor IC LM317LZ: Symbol, Features and Package

    Ⅰ. Overview of LM317LZⅡ. Symbol and Footprint of LM317LZⅢ. Technical parametersⅣ. Features of LM317LZⅤ. Pins and package of LM317LZⅥ. Advantages and disadvantages of LM317LZⅦ. How to optimize the...
  • 22 September 2023

    LM301AN Operational Amplifier: Equivalent, Circuit and Package

    Ⅰ. What is LM301AN?Ⅱ. Symbol, footprint and pin connection of LM301ANⅢ. Technical parametersⅣ. LM301AN tone control circuitⅤ. Features of LM301ANⅥ. What is the difference between LM301AN and LM709?Ⅶ....
  • 25 September 2023

    Get to Know the IRFB7545PBF Power MOSFET

    Ⅰ. What is IRFB7545PBF?Ⅱ. Symbol and Footprint of IRFB7545PBFⅢ. Technical parametersⅣ. Features of IRFB7545PBFⅤ. Pinout and package of IRFB7545PBFⅥ. Application of IRFB7545PBFⅦ. How to use IRFB7545PBF?Ⅷ. How to...
  • cost

    Help you to save your cost and time.

  • package

    Reliable package for your goods.

  • fast

    Fast Reliable Delivery to save time.

  • service

    Quality premium after-sale service.