XC3S700A-4FTG256C

Xilinx Inc. XC3S700A-4FTG256C

Part Number:
XC3S700A-4FTG256C
Manufacturer:
Xilinx Inc.
Ventron No:
4542014-XC3S700A-4FTG256C
Description:
IC FPGA 161 I/O 256FTBGA
ECAD Model:
Datasheet:
XC3S700A-4FTG256C

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Specifications
Xilinx Inc. XC3S700A-4FTG256C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC3S700A-4FTG256C.
  • Factory Lead Time
    10 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    256-LBGA
  • Number of Pins
    256
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    1999
  • Series
    Spartan®-3A
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    256
  • ECCN Code
    EAR99
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    1.14V~1.26V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    1.2V
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC3S700A
  • Pin Count
    256
  • Number of Outputs
    148
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    1.2V
  • Power Supplies
    1.21.2/3.33.3V
  • Number of I/O
    161
  • RAM Size
    45kB
  • Clock Frequency
    667MHz
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    13248
  • Total RAM Bits
    368640
  • Number of Gates
    700000
  • Number of LABs/CLBs
    1472
  • Speed Grade
    4
  • Combinatorial Delay of a CLB-Max
    0.71 ns
  • Height
    1mm
  • Length
    17mm
  • Width
    17mm
  • REACH SVHC
    Unknown
  • RoHS Status
    ROHS3 Compliant
Description
XC3S700A-4FTG256C Overview
Xilinx Inc. is the brand of this part, which falls under the Embedded - FPGAs (Field Programmable Gate Array) category. It is a chip specifically designed for Embedded - FPGAs, with a mounting type of Surface Mount and a package/case of 256-LBGA. The packaging for this chip is in a tray, and the maximum reflow temperature is 30 seconds. It has a pin count of 256 and has not yet been qualified. The chip also has 1472 LABs/CLBs and has a height, length, and width of 1mm, 17mm, and 17mm respectively.

XC3S700A-4FTG256C Features
161 I/Os
Up to 368640 RAM bits
256 LABs/CLBs

XC3S700A-4FTG256C Applications
There are a lot of Xilinx Inc. XC3S700A-4FTG256C FPGAs applications.

Telecommunication
Space Applications
Data center search engines
Enterprise networking
Aircraft navigation
ADAS
Military DSP
Artificial intelligence (AI)
Video & Image Processing
Development Boards and Shields for Microcontrollers
XC3S700A-4FTG256C More Descriptions
FPGA Spartan-3A Family 700K Gates 13248 Cells 667MHz 90nm Technology 1.2V 256-Pin FTBGA
Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 770MHz, 13248-Cell, CMOS, PBGA484
FPGA, SPARTAN-3A, 700K, 256FTBGA; No. of Logic Blocks:1472; No. of Gates:700000; No. of Macrocells:13248; Family Type:Spartan-3A; No. of Speed Grades:4; Total RAM Bits:368640; No. of I/O's:161; Clock Management:DCM; Core Supply Voltage Range:1.14V to 1.26V; I/O Supply Voltage:3.3V; Operating Frequency Max:320MHz; Operating Temperature Range:0°C to 85°C; Logic Case Style:BGA; No. of Pins:256; MSL:MSL 3 - 168 hours; SVHC:No SVHC (19-Dec-2011)
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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