Xilinx Inc. XC3S700A-4FTG256C
- Part Number:
- XC3S700A-4FTG256C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 4542014-XC3S700A-4FTG256C
- Description:
- IC FPGA 161 I/O 256FTBGA
- Datasheet:
- XC3S700A-4FTG256C
Xilinx Inc. XC3S700A-4FTG256C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC3S700A-4FTG256C.
- Factory Lead Time10 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case256-LBGA
- Number of Pins256
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published1999
- SeriesSpartan®-3A
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations256
- ECCN CodeEAR99
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply1.14V~1.26V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)260
- Supply Voltage1.2V
- Reflow Temperature-Max (s)30
- Base Part NumberXC3S700A
- Pin Count256
- Number of Outputs148
- Qualification StatusNot Qualified
- Operating Supply Voltage1.2V
- Power Supplies1.21.2/3.33.3V
- Number of I/O161
- RAM Size45kB
- Clock Frequency667MHz
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells13248
- Total RAM Bits368640
- Number of Gates700000
- Number of LABs/CLBs1472
- Speed Grade4
- Combinatorial Delay of a CLB-Max0.71 ns
- Height1mm
- Length17mm
- Width17mm
- REACH SVHCUnknown
- RoHS StatusROHS3 Compliant
XC3S700A-4FTG256C Overview
Xilinx Inc. is the brand of this part, which falls under the Embedded - FPGAs (Field Programmable Gate Array) category. It is a chip specifically designed for Embedded - FPGAs, with a mounting type of Surface Mount and a package/case of 256-LBGA. The packaging for this chip is in a tray, and the maximum reflow temperature is 30 seconds. It has a pin count of 256 and has not yet been qualified. The chip also has 1472 LABs/CLBs and has a height, length, and width of 1mm, 17mm, and 17mm respectively.
XC3S700A-4FTG256C Features
161 I/Os
Up to 368640 RAM bits
256 LABs/CLBs
XC3S700A-4FTG256C Applications
There are a lot of Xilinx Inc. XC3S700A-4FTG256C FPGAs applications.
Telecommunication
Space Applications
Data center search engines
Enterprise networking
Aircraft navigation
ADAS
Military DSP
Artificial intelligence (AI)
Video & Image Processing
Development Boards and Shields for Microcontrollers
Xilinx Inc. is the brand of this part, which falls under the Embedded - FPGAs (Field Programmable Gate Array) category. It is a chip specifically designed for Embedded - FPGAs, with a mounting type of Surface Mount and a package/case of 256-LBGA. The packaging for this chip is in a tray, and the maximum reflow temperature is 30 seconds. It has a pin count of 256 and has not yet been qualified. The chip also has 1472 LABs/CLBs and has a height, length, and width of 1mm, 17mm, and 17mm respectively.
XC3S700A-4FTG256C Features
161 I/Os
Up to 368640 RAM bits
256 LABs/CLBs
XC3S700A-4FTG256C Applications
There are a lot of Xilinx Inc. XC3S700A-4FTG256C FPGAs applications.
Telecommunication
Space Applications
Data center search engines
Enterprise networking
Aircraft navigation
ADAS
Military DSP
Artificial intelligence (AI)
Video & Image Processing
Development Boards and Shields for Microcontrollers
XC3S700A-4FTG256C More Descriptions
FPGA Spartan-3A Family 700K Gates 13248 Cells 667MHz 90nm Technology 1.2V 256-Pin FTBGA
Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 770MHz, 13248-Cell, CMOS, PBGA484
FPGA, SPARTAN-3A, 700K, 256FTBGA; No. of Logic Blocks:1472; No. of Gates:700000; No. of Macrocells:13248; Family Type:Spartan-3A; No. of Speed Grades:4; Total RAM Bits:368640; No. of I/O's:161; Clock Management:DCM; Core Supply Voltage Range:1.14V to 1.26V; I/O Supply Voltage:3.3V; Operating Frequency Max:320MHz; Operating Temperature Range:0°C to 85°C; Logic Case Style:BGA; No. of Pins:256; MSL:MSL 3 - 168 hours; SVHC:No SVHC (19-Dec-2011)
Field Programmable Gate Array, 1472 CLBs, 700000 Gates, 770MHz, 13248-Cell, CMOS, PBGA484
FPGA, SPARTAN-3A, 700K, 256FTBGA; No. of Logic Blocks:1472; No. of Gates:700000; No. of Macrocells:13248; Family Type:Spartan-3A; No. of Speed Grades:4; Total RAM Bits:368640; No. of I/O's:161; Clock Management:DCM; Core Supply Voltage Range:1.14V to 1.26V; I/O Supply Voltage:3.3V; Operating Frequency Max:320MHz; Operating Temperature Range:0°C to 85°C; Logic Case Style:BGA; No. of Pins:256; MSL:MSL 3 - 168 hours; SVHC:No SVHC (19-Dec-2011)
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
12 October 2023
Compare the Differences Between TDA7377 and TDA7388
Ⅰ. What is an amplifier?Ⅱ. Overview of TDA7377Ⅲ. Overview of TDA7388Ⅳ. TDA7377 vs TDA7388: SymbolⅤ. TDA7377 vs TDA7388: Technical parametersⅥ. TDA7377 vs TDA7388: FeaturesⅦ. TDA7377 vs TDA7388: Power... -
13 October 2023
Universal Logic Gate Chip SN7406N: Equivalent, Working Principle and Package
Ⅰ. What is SN7406N?Ⅱ. Symbol, footprint and pinout of SN7406NⅢ. Technical parameters of SN7406NⅣ. Features of SN7406NⅤ. Working principle of SN7406NⅥ. Dimensions and package of SN7406NⅦ. Manufacturer of... -
13 October 2023
LM3481MM NOPB Converter Features, Pin Configuraiton and Other Details
Ⅰ. Overview of LM3481MM/NOPBⅡ. Symbol and footprint of LM3481MM/NOPBⅢ. Technical parameters of LM3481MM/NOPBⅣ. Features of LM3481MM/NOPBⅤ. Pin configuration of LM3481MM/NOPBⅥ. Application of LM3481MM/NOPBⅦ. How to improve the efficiency... -
16 October 2023
What Is H1102N Pulse Ethernet Transformer?
Ⅰ. What is a transformer?Ⅱ. Overview of H1102NLⅢ. Pin configuration, symbol and footprint of H1102NLⅣ. Technical parameters of H1102NLⅤ. Features of H1102NLⅥ. Working principle of H1102NLⅦ. Dimensions and...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.