Xilinx Inc. XC3S50A-4VQG100C

XC3S50A-4VQG100C Overview
The mounting type for this device is surface mount, which means it is designed to be mounted directly onto a surface rather than inserted into a socket. The operating temperature range is 0°C to 85°C, indicating that the device is capable of functioning within this temperature range without any issues. The JESD-609 code assigned to this device is e3, which signifies that it meets the industry standard for handling electrostatic discharge. The technology used in this device is CMOS, which stands for Complementary Metal-Oxide-Semiconductor, a popular type of technology used in integrated circuits. The peak reflow temperature for this device is 260°C, indicating the maximum temperature it can withstand during the reflow soldering process. The reflow temperature-max is 30 seconds, indicating the maximum duration for which the device should be exposed to the reflow soldering process. The pin count for this device is 100, indicating the number of pins or connection points it has. The total RAM bits for this device is 55296, indicating the amount of memory it has. The height seated (max) is 1.2mm, indicating the maximum height of the device when it is properly seated or mounted. Lastly, the RoHS status of this device is ROHS3 compliant, meaning it meets the requirements of the Restriction of Hazardous Substances Directive.

XC3S50A-4VQG100C Features
68 I/Os
Up to 55296 RAM bits

XC3S50A-4VQG100C Applications
There are a lot of Xilinx Inc. XC3S50A-4VQG100C FPGAs applications.

Audio
Defense Applications
Filtering and communication encoding
Automotive advanced driver assistance systems (ADAS)
Consumer Electronics
Automotive driver's assistance
Enterprise networking
Medical imaging
Bioinformatics
Industrial Ethernet