Xilinx Inc. XC3S400AN-5FGG400C

Name: XC3S400AN-5FGG400C
Brand: Xilinx Inc.
SKU: 3633242-XC3S400AN-5FGG400C
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XC3S400AN-5FGG400C

Manufacturer:: Xilinx Inc.

Ventron No:: 3633242-XC3S400AN-5FGG400C

Description:: IC FPGA 311 I/O 400FBGA

ECAD Model:

Datasheet:: XC3S400AN-5FGG400C

Specifications

Xilinx Inc. XC3S400AN-5FGG400C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC3S400AN-5FGG400C.

Factory Lead Time
10 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
400-BGA
Number of Pins
400
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
1999
Series
Spartan®-3AN
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
400
ECCN Code
3A991.D
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
1.14V~1.26V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
250
Supply Voltage
1.2V
Terminal Pitch
1mm
Reflow Temperature-Max (s)
30
Base Part Number
XC3S400AN
Pin Count
400
Number of Outputs
248
Qualification Status
Not Qualified
Operating Supply Voltage
1.2V
Power Supplies
1.21.2/3.33.3V
Number of I/O
311
RAM Size
45kB
Clock Frequency
770MHz
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
8064
Total RAM Bits
368640
Number of Gates
400000
Number of LABs/CLBs
896
Speed Grade
5
Combinatorial Delay of a CLB-Max
0.62 ns
Number of CLBs
896
Height Seated (Max)
2.43mm
Length
21mm
Width
21mm
RoHS Status
ROHS3 Compliant

Description

XC3S400AN-5FGG400C Overview
This particular component is manufactured by Xilinx Inc. and falls under the category of Embedded - FPGAs (Field Programmable Gate Array) chips. It is specifically part of the Spartan®-3AN series and has a Moisture Sensitivity Level (MSL) of 3, meaning it can withstand 168 hours of exposure to moisture. The ECCN Code for this chip is 3A991.D and it uses CMOS technology. Its terminal form is BALL and it has a peak reflow temperature of 250 degrees Celsius. This chip is a FIELD PROGRAMMABLE GATE ARRAY, meaning it can be programmed to perform specific functions. It has a total of 896 LABs/CLBs (Logic Array Blocks/Configurable Logic Blocks) and has a length of 21mm. Additionally, this chip is compliant with ROHS3 standards, meaning it is environmentally friendly and does not contain any hazardous materials.

XC3S400AN-5FGG400C Features
311 I/Os
Up to 368640 RAM bits
400 LABs/CLBs

XC3S400AN-5FGG400C Applications
There are a lot of Xilinx Inc. XC3S400AN-5FGG400C FPGAs applications.

OpenCL
High Performance Computing
Video & Image Processing
Wired Communications
Space Applications
Industrial IoT
Filtering and communication encoding
DO-254
Cryptography
Scientific Instruments

XC3S400AN-5FGG400C More Descriptions

FPGA Spartan-3AN Family 400K Gates 8064 Cells 770MHz 90nm Technology 1.2V 400-Pin F-BGA
Field Programmable Gate Array, 896 CLBs, 400000 Gates, 770MHz, 8064-Cell, CMOS, PBGA400
IC FPGA 311 I/O 400FBGA
OEMs, CMs ONLY (NO BROKERS)
IC FPGA 34 I/O 44PLCC
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