XC3S400AN-4FGG400C

Xilinx Inc. XC3S400AN-4FGG400C

Part Number:
XC3S400AN-4FGG400C
Manufacturer:
Xilinx Inc.
Ventron No:
3125632-XC3S400AN-4FGG400C
Description:
IC FPGA 311 I/O 400FBGA
ECAD Model:
Datasheet:
XC3S400AN-4FGG400C

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Specifications
Xilinx Inc. XC3S400AN-4FGG400C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC3S400AN-4FGG400C.
  • Factory Lead Time
    10 Weeks
  • Contact Plating
    Copper, Silver, Tin
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    400-BGA
  • Number of Pins
    400
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    1999
  • Series
    Spartan®-3AN
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    400
  • Termination
    SMD/SMT
  • ECCN Code
    3A991.D
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    1.14V~1.26V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    250
  • Supply Voltage
    1.2V
  • Frequency
    667MHz
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC3S400AN
  • Pin Count
    400
  • Number of Outputs
    248
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    1.2V
  • Power Supplies
    1.21.2/3.33.3V
  • Number of I/O
    311
  • RAM Size
    45kB
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    8064
  • Total RAM Bits
    368640
  • Number of Gates
    400000
  • Number of LABs/CLBs
    896
  • Speed Grade
    4
  • Combinatorial Delay of a CLB-Max
    0.71 ns
  • Number of CLBs
    896
  • Height
    1.73mm
  • Length
    21mm
  • Width
    21mm
  • REACH SVHC
    No SVHC
  • RoHS Status
    ROHS3 Compliant
Description
XC3S400AN-4FGG400C Overview
The manufacturer of this component is Xilinx Inc. It is a type of chip called Embedded - FPGAs (Field Programmable Gate Array), which falls under the category of Embedded - FPGAs (Field Programmable Gate Array). The contact plating options available for this chip are Copper, Silver, and Tin. It is designed to be mounted on a surface. The Pbfree code indicates that it is free from lead. The supply voltage required for this chip is 1.2V. The maximum reflow temperature it can withstand is 30 degrees Celsius. It has a total of 248 outputs and a total of 368,640 bits of RAM. The speed grade of this chip is 4. Its width is 21mm. It is compliant with the RoHS3 standard.

XC3S400AN-4FGG400C Features
311 I/Os
Up to 368640 RAM bits
400 LABs/CLBs
Operating from a frequency of 667MHz

XC3S400AN-4FGG400C Applications
There are a lot of Xilinx Inc. XC3S400AN-4FGG400C FPGAs applications.

Voice recognition
Audio
Security systems
Defense Applications
Bioinformatics
Video & Image Processing
Industrial Ethernet
Consumer Electronics
Automotive
Enterprise networking
XC3S400AN-4FGG400C More Descriptions
FPGA Spartan-3AN Family 400K Gates 8064 Cells 667MHz 90nm Technology 1.2V 400-Pin F-BGA
Field Programmable Gate Array, 896 CLBs, 400000 Gates, 667MHz, 8064-Cell, CMOS, PBGA400
XILINX XC3S400AN-4FGG400C FPGA, SPARTAN-3AN, 8064CELLS, 400FBGA
FPGA,SPARTAN-3AN,8064CELLS,400FBGA; Programmable Logic Type:FPGA; Logic IC Function:FPGA; Logic IC Family:CMOS; Logic IC Base Number:3S400; I/O lines, No. of:311; Macrocells, No. of:8064; Frequency:667MHz; I/O Interface Standard:LVCMOS, LVTTL, HSTL, SSTL, True LVDS, RSDS, mini-L; Voltage, Supply Min:1.14V; Voltage, Supply Max:1.26V; Case Style:FBGA; Temperature, Operating Range:0>to 85; Base Number:3; Pins, No. of:400; Temp, Op. Max:85°C; Temp, Op. Min:0°C; Termination Type:SMD
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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