XC3S400A-4FGG320C

Xilinx Inc. XC3S400A-4FGG320C

Part Number:
XC3S400A-4FGG320C
Manufacturer:
Xilinx Inc.
Ventron No:
3632811-XC3S400A-4FGG320C
Description:
IC FPGA 251 I/O 320FBGA
ECAD Model:
Datasheet:
XC3S400A-4FGG320C

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Specifications
Xilinx Inc. XC3S400A-4FGG320C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC3S400A-4FGG320C.
  • Factory Lead Time
    10 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    320-BGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    1999
  • Series
    Spartan®-3A
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    320
  • ECCN Code
    3A991.D
  • Terminal Finish
    Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    1.14V~1.26V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC3S400A
  • Pin Count
    320
  • JESD-30 Code
    S-PBGA-B320
  • Number of Outputs
    192
  • Qualification Status
    Not Qualified
  • Power Supplies
    1.22.5/3.3V
  • Number of I/O
    251
  • Clock Frequency
    667MHz
  • Number of Inputs
    251
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    8064
  • Total RAM Bits
    368640
  • Number of Gates
    400000
  • Number of LABs/CLBs
    896
  • Combinatorial Delay of a CLB-Max
    0.71 ns
  • Number of CLBs
    896
  • Height Seated (Max)
    2mm
  • Length
    19mm
  • Width
    19mm
  • RoHS Status
    ROHS3 Compliant
Description
XC3S400A-4FGG320C Overview
The manufacturer of this component is Xilinx Inc. It is a type of chip known as an Embedded - FPGAs (Field Programmable Gate Array), which falls under the category of Embedded - FPGAs (Field Programmable Gate Array). The chip has an operating temperature range of 0°C to 85°C and is currently in active production. The terminals are coated with a Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) finish and are located on the bottom of the chip in a ball formation. This particular chip has not yet been qualified for use. It has a clock frequency of 667MHz and a total of 251 input connections. The maximum seated height of the chip is 2mm and it measures 19mm in length.

XC3S400A-4FGG320C Features
251 I/Os
Up to 368640 RAM bits

XC3S400A-4FGG320C Applications
There are a lot of Xilinx Inc. XC3S400A-4FGG320C FPGAs applications.

DO-254
Solar Energy
Embedded Vision
Electronic Warfare
Artificial intelligence (AI)
Camera time adjustments
Enterprise networking
Software-defined radio
Industrial Ethernet
ADAS
XC3S400A-4FGG320C More Descriptions
FPGA Spartan-3A Family 400K Gates 8064 Cells 667MHz 90nm Technology 1.2V 320-Pin F-BGA
FPGA - Field Programmable Gate Array XC3S400A-4FGG320C CONNECTING EBOM TO MARKETING PART.
Field Programmable Gate Array, 896 CLBs, 400000 Gates, 667MHz, 8064-Cell, CMOS, PBGA256
XILINX XC3S400A-4FGG320C FPGA, SPARTAN-3A, 400K ELE, 320FBGA
FPGA, SPARTAN-3A, 400K ELE, 320FBGA; Programmable Logic Type:FPGA; Logic IC Function:FPGA; Logic IC Base Number:3S400; No of I/O Lines:251; No. of Macrocells:8064; Frequency:250MHz; I/O Interface Standard:LVTTL, LVCMOS, PCI, HSTL, SSTL; Voltage, Supply Min:1.14V; Voltage, Supply Max:1.26V; Case Style:FBGA; Operating Temperature Range:0°C to 85°C; No. of Pins:320; Termination Type:SMD
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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