XC3S400-4FGG456I

Xilinx Inc. XC3S400-4FGG456I

Part Number:
XC3S400-4FGG456I
Manufacturer:
Xilinx Inc.
Ventron No:
3821558-XC3S400-4FGG456I
Description:
IC FPGA 264 I/O 456FBGA
ECAD Model:
Datasheet:
XC3S400-4FGG456I

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Specifications
Xilinx Inc. XC3S400-4FGG456I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC3S400-4FGG456I.
  • Factory Lead Time
    10 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    456-BBGA
  • Number of Pins
    456
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2009
  • Series
    Spartan®-3
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    456
  • ECCN Code
    3A991.D
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    1.14V~1.26V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    250
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC3S400
  • Pin Count
    456
  • Number of Outputs
    264
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    1.2V
  • Power Supplies
    1.21.2/3.32.5V
  • Number of I/O
    264
  • RAM Size
    36kB
  • Clock Frequency
    630MHz
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    8064
  • Total RAM Bits
    294912
  • Number of Gates
    400000
  • Number of LABs/CLBs
    896
  • Speed Grade
    4
  • Combinatorial Delay of a CLB-Max
    0.61 ns
  • Number of CLBs
    896
  • Height Seated (Max)
    2.6mm
  • Length
    23mm
  • Width
    23mm
  • RoHS Status
    ROHS3 Compliant
Description
XC3S400-4FGG456I Overview
Xilinx Inc. is the brand of this part, which is an Embedded - FPGAs (Field Programmable Gate Array) chip in the Embedded - FPGAs (Field Programmable Gate Array) category. The chip is mounted using Surface Mount technology and comes in a 456-BBGA package. It is packaged in trays and has a BALL terminal form. The peak reflow temperature for this chip is 250 degrees Celsius and it operates at a supply voltage of 1.2V. With a pin count of 456, it has 264 I/Os and a total of 294912 RAM bits. Additionally, it boasts 400000 gates.

XC3S400-4FGG456I Features
264 I/Os
Up to 294912 RAM bits
456 LABs/CLBs

XC3S400-4FGG456I Applications
There are a lot of Xilinx Inc. XC3S400-4FGG456I FPGAs applications.

Consumer Electronics
Video & Image Processing
Integrating multiple SPLDs
Enterprise networking
Image processing
Artificial intelligence (AI)
Embedded Vision
Defense Applications
Audio
DO-254
XC3S400-4FGG456I More Descriptions
FPGA Spartan-3 Family 400K Gates 8064 Cells 630MHz 90nm Technology 1.2V 456-Pin F-BGA
Field Programmable Gate Array, 192 CLBs, 50000 Gates, PBGA256
FPGA - Field Programmable Gate Array 400000 SYSTEM GATE 1.2 VOLT FPGA
BGA-456 Programmable Logic Device (CPLDs/FPGAs) ROHS
FPGA 896 CLBS 400000 GATES 630 MHz PBGA456
Product Description Demo for Development.
Field Programmable Gate Arrays
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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