Xilinx Inc. XC3S400-4FGG456I
- Part Number:
- XC3S400-4FGG456I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3821558-XC3S400-4FGG456I
- Description:
- IC FPGA 264 I/O 456FBGA
- Datasheet:
- XC3S400-4FGG456I
Xilinx Inc. XC3S400-4FGG456I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC3S400-4FGG456I.
- Factory Lead Time10 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case456-BBGA
- Number of Pins456
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2009
- SeriesSpartan®-3
- JESD-609 Codee1
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations456
- ECCN Code3A991.D
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply1.14V~1.26V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)250
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)30
- Base Part NumberXC3S400
- Pin Count456
- Number of Outputs264
- Qualification StatusNot Qualified
- Operating Supply Voltage1.2V
- Power Supplies1.21.2/3.32.5V
- Number of I/O264
- RAM Size36kB
- Clock Frequency630MHz
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells8064
- Total RAM Bits294912
- Number of Gates400000
- Number of LABs/CLBs896
- Speed Grade4
- Combinatorial Delay of a CLB-Max0.61 ns
- Number of CLBs896
- Height Seated (Max)2.6mm
- Length23mm
- Width23mm
- RoHS StatusROHS3 Compliant
XC3S400-4FGG456I Overview
Xilinx Inc. is the brand of this part, which is an Embedded - FPGAs (Field Programmable Gate Array) chip in the Embedded - FPGAs (Field Programmable Gate Array) category. The chip is mounted using Surface Mount technology and comes in a 456-BBGA package. It is packaged in trays and has a BALL terminal form. The peak reflow temperature for this chip is 250 degrees Celsius and it operates at a supply voltage of 1.2V. With a pin count of 456, it has 264 I/Os and a total of 294912 RAM bits. Additionally, it boasts 400000 gates.
XC3S400-4FGG456I Features
264 I/Os
Up to 294912 RAM bits
456 LABs/CLBs
XC3S400-4FGG456I Applications
There are a lot of Xilinx Inc. XC3S400-4FGG456I FPGAs applications.
Consumer Electronics
Video & Image Processing
Integrating multiple SPLDs
Enterprise networking
Image processing
Artificial intelligence (AI)
Embedded Vision
Defense Applications
Audio
DO-254
Xilinx Inc. is the brand of this part, which is an Embedded - FPGAs (Field Programmable Gate Array) chip in the Embedded - FPGAs (Field Programmable Gate Array) category. The chip is mounted using Surface Mount technology and comes in a 456-BBGA package. It is packaged in trays and has a BALL terminal form. The peak reflow temperature for this chip is 250 degrees Celsius and it operates at a supply voltage of 1.2V. With a pin count of 456, it has 264 I/Os and a total of 294912 RAM bits. Additionally, it boasts 400000 gates.
XC3S400-4FGG456I Features
264 I/Os
Up to 294912 RAM bits
456 LABs/CLBs
XC3S400-4FGG456I Applications
There are a lot of Xilinx Inc. XC3S400-4FGG456I FPGAs applications.
Consumer Electronics
Video & Image Processing
Integrating multiple SPLDs
Enterprise networking
Image processing
Artificial intelligence (AI)
Embedded Vision
Defense Applications
Audio
DO-254
XC3S400-4FGG456I More Descriptions
FPGA Spartan-3 Family 400K Gates 8064 Cells 630MHz 90nm Technology 1.2V 456-Pin F-BGA
Field Programmable Gate Array, 192 CLBs, 50000 Gates, PBGA256
FPGA - Field Programmable Gate Array 400000 SYSTEM GATE 1.2 VOLT FPGA
BGA-456 Programmable Logic Device (CPLDs/FPGAs) ROHS
FPGA 896 CLBS 400000 GATES 630 MHz PBGA456
Product Description Demo for Development.
Field Programmable Gate Arrays
Field Programmable Gate Array, 192 CLBs, 50000 Gates, PBGA256
FPGA - Field Programmable Gate Array 400000 SYSTEM GATE 1.2 VOLT FPGA
BGA-456 Programmable Logic Device (CPLDs/FPGAs) ROHS
FPGA 896 CLBS 400000 GATES 630 MHz PBGA456
Product Description Demo for Development.
Field Programmable Gate Arrays
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