Xilinx Inc. XC3S250E-4FT256I
- Part Number:
- XC3S250E-4FT256I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3632977-XC3S250E-4FT256I
- Description:
- IC FPGA 172 I/O 256FTBGA
- Datasheet:
- XC3S250E-4FT256I
Xilinx Inc. XC3S250E-4FT256I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC3S250E-4FT256I.
- Factory Lead Time10 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case256-LBGA
- Number of Pins256
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2012
- SeriesSpartan®-3E
- JESD-609 Codee0
- Pbfree Codeno
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations256
- ECCN CodeEAR99
- Terminal FinishTin/Lead (Sn63Pb37)
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply1.14V~1.26V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)240
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)30
- Base Part NumberXC3S250E
- Pin Count256
- Number of Outputs132
- Qualification StatusNot Qualified
- Operating Supply Voltage1.2V
- Power Supplies1.21.2/3.32.5V
- Number of I/O172
- RAM Size27kB
- Clock Frequency572MHz
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells5508
- Total RAM Bits221184
- Number of Gates250000
- Number of LABs/CLBs612
- Speed Grade4
- Number of Registers4896
- Combinatorial Delay of a CLB-Max0.76 ns
- Number of CLBs612
- Height Seated (Max)1.55mm
- Length17mm
- Width17mm
- RoHS StatusNon-RoHS Compliant
XC3S250E-4FT256I Overview
This product features a surface mount design and has an operating temperature range of -40°C to 100°C. It is currently active and has a terminal finish of tin/lead (Sn63Pb37). The technology used is CMOS and the terminal form is ball. With 132 outputs, it requires 1.2V, 1.2/3.3V, and 2.5V power supplies. It also has a total of 5508 logic elements/cells and 612 CLBs.
XC3S250E-4FT256I Features
172 I/Os
Up to 221184 RAM bits
256 LABs/CLBs
4896 registers
XC3S250E-4FT256I Applications
There are a lot of Xilinx Inc. XC3S250E-4FT256I FPGAs applications.
Computer hardware emulation
Solar Energy
Broadcast
OpenCL
Medical imaging
Secure Communication
Aerospace and Defense
Automotive
Security systems
ADAS
This product features a surface mount design and has an operating temperature range of -40°C to 100°C. It is currently active and has a terminal finish of tin/lead (Sn63Pb37). The technology used is CMOS and the terminal form is ball. With 132 outputs, it requires 1.2V, 1.2/3.3V, and 2.5V power supplies. It also has a total of 5508 logic elements/cells and 612 CLBs.
XC3S250E-4FT256I Features
172 I/Os
Up to 221184 RAM bits
256 LABs/CLBs
4896 registers
XC3S250E-4FT256I Applications
There are a lot of Xilinx Inc. XC3S250E-4FT256I FPGAs applications.
Computer hardware emulation
Solar Energy
Broadcast
OpenCL
Medical imaging
Secure Communication
Aerospace and Defense
Automotive
Security systems
ADAS
XC3S250E-4FT256I More Descriptions
FPGA Spartan-3E Family 250K Gates 5508 Cells 572MHz 90nm (CMOS) Technology 1.2V 256-Pin FTBGA
Field Programmable Gate Array, 612 CLBs, 250000 Gates, 572MHz, 5508-Cell, CMOS, PBGA256
IC FPGA 172 I/O 256FTBGA
IC FPGA 178 I/O 256FBGA
Contact for details
Field Programmable Gate Array, 612 CLBs, 250000 Gates, 572MHz, 5508-Cell, CMOS, PBGA256
IC FPGA 172 I/O 256FTBGA
IC FPGA 178 I/O 256FBGA
Contact for details
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