XC3S250E-4FT256I

Xilinx Inc. XC3S250E-4FT256I

Part Number:
XC3S250E-4FT256I
Manufacturer:
Xilinx Inc.
Ventron No:
3632977-XC3S250E-4FT256I
Description:
IC FPGA 172 I/O 256FTBGA
ECAD Model:
Datasheet:
XC3S250E-4FT256I

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Specifications
Xilinx Inc. XC3S250E-4FT256I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC3S250E-4FT256I.
  • Factory Lead Time
    10 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    256-LBGA
  • Number of Pins
    256
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2012
  • Series
    Spartan®-3E
  • JESD-609 Code
    e0
  • Pbfree Code
    no
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    256
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin/Lead (Sn63Pb37)
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    1.14V~1.26V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    240
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC3S250E
  • Pin Count
    256
  • Number of Outputs
    132
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    1.2V
  • Power Supplies
    1.21.2/3.32.5V
  • Number of I/O
    172
  • RAM Size
    27kB
  • Clock Frequency
    572MHz
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    5508
  • Total RAM Bits
    221184
  • Number of Gates
    250000
  • Number of LABs/CLBs
    612
  • Speed Grade
    4
  • Number of Registers
    4896
  • Combinatorial Delay of a CLB-Max
    0.76 ns
  • Number of CLBs
    612
  • Height Seated (Max)
    1.55mm
  • Length
    17mm
  • Width
    17mm
  • RoHS Status
    Non-RoHS Compliant
Description
XC3S250E-4FT256I Overview
This product features a surface mount design and has an operating temperature range of -40°C to 100°C. It is currently active and has a terminal finish of tin/lead (Sn63Pb37). The technology used is CMOS and the terminal form is ball. With 132 outputs, it requires 1.2V, 1.2/3.3V, and 2.5V power supplies. It also has a total of 5508 logic elements/cells and 612 CLBs.

XC3S250E-4FT256I Features
172 I/Os
Up to 221184 RAM bits
256 LABs/CLBs
4896 registers

XC3S250E-4FT256I Applications
There are a lot of Xilinx Inc. XC3S250E-4FT256I FPGAs applications.

Computer hardware emulation
Solar Energy
Broadcast
OpenCL
Medical imaging
Secure Communication
Aerospace and Defense
Automotive
Security systems
ADAS
XC3S250E-4FT256I More Descriptions
FPGA Spartan-3E Family 250K Gates 5508 Cells 572MHz 90nm (CMOS) Technology 1.2V 256-Pin FTBGA
Field Programmable Gate Array, 612 CLBs, 250000 Gates, 572MHz, 5508-Cell, CMOS, PBGA256
IC FPGA 172 I/O 256FTBGA
IC FPGA 178 I/O 256FBGA
Contact for details
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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