Xilinx Inc. XC3S200AN-5FT256C
- Part Number:
- XC3S200AN-5FT256C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3632787-XC3S200AN-5FT256C
- Description:
- IC FPGA 195 I/O 256FTBGA
- Datasheet:
- XC3S200AN-5FT256C
Xilinx Inc. XC3S200AN-5FT256C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC3S200AN-5FT256C.
- Factory Lead Time10 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case256-LBGA
- Number of Pins256
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published1999
- SeriesSpartan®-3AN
- JESD-609 Codee0
- Pbfree Codeno
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations256
- ECCN CodeEAR99
- Terminal FinishTin/Lead (Sn63Pb37)
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply1.14V~1.26V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)240
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)30
- Base Part NumberXC3S200AN
- Pin Count256
- Number of Outputs160
- Qualification StatusNot Qualified
- Operating Supply Voltage1.2V
- Power Supplies1.21.2/3.33.3V
- Number of I/O195
- RAM Size36kB
- Clock Frequency770MHz
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells4032
- Total RAM Bits294912
- Number of Gates200000
- Number of LABs/CLBs448
- Speed Grade5
- Combinatorial Delay of a CLB-Max0.62 ns
- Number of CLBs448
- Length17mm
- Width17mm
- RoHS StatusNon-RoHS Compliant
XC3S200AN-5FT256C Overview
Xilinx Inc. is the brand of this part, which falls under the Embedded - FPGAs (Field Programmable Gate Array) category. It was published in 1999 and has a JESD-609 Code of e0. The chip has an Operating Temperature range of 0°C~85°C TJ and 256 Number of Terminations. The Terminal Finish is Tin/Lead (Sn63Pb37) and the Terminal Position is BOTTOM. It has a Terminal Pitch of 1mm and a Pin Count of 256. The chip has 195 I/O and a Speed Grade of 5.
XC3S200AN-5FT256C Features
195 I/Os
Up to 294912 RAM bits
256 LABs/CLBs
XC3S200AN-5FT256C Applications
There are a lot of Xilinx Inc. XC3S200AN-5FT256C FPGAs applications.
Server Applications
Wireless Communications
Electronic Warfare
Digital signal processing
Artificial intelligence (AI)
Development Boards and Shields for Microcontrollers
Scientific Instruments
Software-defined radio
Military Temperature
Enterprise networking
Xilinx Inc. is the brand of this part, which falls under the Embedded - FPGAs (Field Programmable Gate Array) category. It was published in 1999 and has a JESD-609 Code of e0. The chip has an Operating Temperature range of 0°C~85°C TJ and 256 Number of Terminations. The Terminal Finish is Tin/Lead (Sn63Pb37) and the Terminal Position is BOTTOM. It has a Terminal Pitch of 1mm and a Pin Count of 256. The chip has 195 I/O and a Speed Grade of 5.
XC3S200AN-5FT256C Features
195 I/Os
Up to 294912 RAM bits
256 LABs/CLBs
XC3S200AN-5FT256C Applications
There are a lot of Xilinx Inc. XC3S200AN-5FT256C FPGAs applications.
Server Applications
Wireless Communications
Electronic Warfare
Digital signal processing
Artificial intelligence (AI)
Development Boards and Shields for Microcontrollers
Scientific Instruments
Software-defined radio
Military Temperature
Enterprise networking
XC3S200AN-5FT256C More Descriptions
FPGA Spartan-3AN Family 200K Gates 4032 Cells 770MHz 90nm Technology 1.2V 256-Pin FTBGA
Field Programmable Gate Array, 612 CLBs, 250000 Gates, 572MHz, 5508-Cell, CMOS, PBGA132
FPGA - Field Programmable Gate Array Connect EBOM
Field Programmable Gate Array, 612 CLBs, 250000 Gates, 572MHz, 5508-Cell, CMOS, PBGA132
FPGA - Field Programmable Gate Array Connect EBOM
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