Xilinx Inc. XC3S2000-4FGG900C

Name: XC3S2000-4FGG900C
Brand: Xilinx Inc.
SKU: 3821683-XC3S2000-4FGG900C
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XC3S2000-4FGG900C

Manufacturer:: Xilinx Inc.

Ventron No:: 3821683-XC3S2000-4FGG900C

Description:: IC FPGA 565 I/O 900FBGA

ECAD Model:

Datasheet:: XC3S2000-4FGG900C

Specifications

Xilinx Inc. XC3S2000-4FGG900C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC3S2000-4FGG900C.

Factory Lead Time
10 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
900-BBGA
Number of Pins
900
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2009
Series
Spartan®-3
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
900
ECCN Code
3A991.D
Subcategory
Field Programmable Gate Arrays
Technology
CMOS
Voltage - Supply
1.14V~1.26V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
250
Supply Voltage
1.2V
Terminal Pitch
1mm
Reflow Temperature-Max (s)
30
Base Part Number
XC3S2000
Pin Count
900
Number of Outputs
565
Qualification Status
Not Qualified
Operating Supply Voltage
1.2V
Power Supplies
1.21.2/3.32.5V
Number of I/O
565
RAM Size
90kB
Clock Frequency
630MHz
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
46080
Total RAM Bits
737280
Number of Gates
2000000
Number of LABs/CLBs
5120
Speed Grade
4
Combinatorial Delay of a CLB-Max
0.61 ns
Height Seated (Max)
2.6mm
Length
31mm
Width
31mm
RoHS Status
ROHS3 Compliant

Description

XC3S2000-4FGG900C Overview
The Spartan®-3 series product offers a high-performance solution with a maximum peak reflow temperature of 250°C, making it suitable for a wide range of applications. The product is packaged in a tray for easy handling and storage. It is also Pbfree, ensuring compliance with environmental regulations. The terminal position is located at the bottom for convenient connectivity. With a maximum reflow temperature of 30 seconds, the product offers quick and efficient reflow capabilities. It boasts a generous 565 I/Os, 90kB of RAM size, and 2,000,000 gates, providing ample resources for complex designs. The product has a maximum seated height of 2.6mm, making it a compact and versatile option for various design requirements.

XC3S2000-4FGG900C Features
565 I/Os
Up to 737280 RAM bits
900 LABs/CLBs

XC3S2000-4FGG900C Applications
There are a lot of Xilinx Inc. XC3S2000-4FGG900C FPGAs applications.

Electronic Warfare
Broadcast
Solar Energy
Camera time adjustments
Industrial,Medical and Scientific Instruments
Embedded Vision
High Performance Computing
Medical Applications
OpenCL
Medical imaging

XC3S2000-4FGG900C More Descriptions

FPGA Spartan-3 Family 2M Gates 46080 Cells 630MHz 90nm Technology 1.2V 900-Pin F-BGA
FPGA - Field Programmable Gate Array XC3S2000-4FGG900C
IC FPGA 380 I/O 672FPBGA
IC FPGA 565 I/O 900FBGA
OEMs, CMs ONLY (NO BROKERS)
Contact for details

Certification