XC3S200-4VQ100C

Xilinx Inc. XC3S200-4VQ100C

Part Number:
XC3S200-4VQ100C
Manufacturer:
Xilinx Inc.
Ventron No:
3127575-XC3S200-4VQ100C
Description:
IC FPGA 63 I/O 100VQFP
ECAD Model:
Datasheet:
XC3S200-4VQ100C

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Specifications
Xilinx Inc. XC3S200-4VQ100C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC3S200-4VQ100C.
  • Factory Lead Time
    10 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    100-TQFP
  • Number of Pins
    100
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    2006
  • Series
    Spartan®-3
  • JESD-609 Code
    e0
  • Pbfree Code
    no
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    100
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin/Lead (Sn85Pb15)
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    1.14V~1.26V
  • Terminal Position
    QUAD
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    225
  • Supply Voltage
    1.2V
  • Terminal Pitch
    0.5mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC3S200
  • Pin Count
    100
  • Number of Outputs
    63
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    1.2V
  • Power Supplies
    1.21.2/3.32.5V
  • Number of I/O
    63
  • RAM Size
    27kB
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    4320
  • Total RAM Bits
    221184
  • Number of Gates
    200000
  • Number of LABs/CLBs
    480
  • Speed Grade
    4
  • Combinatorial Delay of a CLB-Max
    0.61 ns
  • Number of CLBs
    480
  • Height Seated (Max)
    1.2mm
  • RoHS Status
    Non-RoHS Compliant
Description
XC3S200-4VQ100C Overview
Moisture sensitivity level (MSL) is a crucial factor to consider when dealing with electronic components, especially those with a high level of integration. In this case, the MSL level of 3 (168 hours) indicates that the component can withstand exposure to moisture for up to 168 hours without compromising its functionality. This is particularly important for the technology used in this component, which is CMOS. With a terminal pitch of 0.5mm and 100 terminations, this component offers a compact and efficient design. Additionally, with an operating supply voltage of 1.2V and a RAM size of 27kB, this component is optimized for low power consumption. Furthermore, its FIELD PROGRAMMABLE GATE ARRAY programmable logic type allows for greater flexibility and customization. With a total of 221184 RAM bits and a speed grade of 4, this component offers high performance and storage capabilities. Lastly, with 480 CLBs, this component provides a high level of programmable logic for complex applications.

XC3S200-4VQ100C Features
63 I/Os
Up to 221184 RAM bits
100 LABs/CLBs

XC3S200-4VQ100C Applications
There are a lot of Xilinx Inc. XC3S200-4VQ100C FPGAs applications.

Audio
Broadcast
Secure Communication
Data Mining
Electronic Warfare
Data center hardware accelerators
ASIC prototyping
Defense Applications
Development Boards and Shields for Microcontrollers
Server Applications
XC3S200-4VQ100C More Descriptions
FPGA Spartan®-3 Family 200K Gates 4320 Cells 630MHz 90nm Technology 1.2V 100-Pin VTQFP
Field Programmable Gate Array, 5120 CLBs, 2000000 Gates, 725MHz, 46080-Cell, CMOS, PBGA456
Product Description Demo for Development.
FPGA - Field Programmable Gate Array
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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