XC3S200-4FT256C

Xilinx Inc. XC3S200-4FT256C

Part Number:
XC3S200-4FT256C
Manufacturer:
Xilinx Inc.
Ventron No:
3632789-XC3S200-4FT256C
Description:
IC FPGA 173 I/O 256FTBGA
ECAD Model:
Datasheet:
XC3S200-4FT256C

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Specifications
Xilinx Inc. XC3S200-4FT256C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC3S200-4FT256C.
  • Factory Lead Time
    10 Weeks
  • Mount
    Standard
  • Mounting Type
    Surface Mount
  • Package / Case
    256-LBGA
  • Number of Pins
    256
  • Supplier Device Package
    256-FTBGA (17x17)
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Bulk
  • Series
    Spartan®-3
  • Published
    2004
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Max Operating Temperature
    85°C
  • Min Operating Temperature
    0°C
  • Voltage - Supply
    1.14V~1.26V
  • Operating Supply Voltage
    1.2V
  • Number of I/O
    173
  • RAM Size
    27kB
  • Number of Logic Elements/Cells
    4320
  • Total RAM Bits
    221184
  • Number of Gates
    200000
  • Number of LABs/CLBs
    480
  • Speed Grade
    4
  • RoHS Status
    Non-RoHS Compliant
Description
XC3S200-4FT256C Overview
There are two packages that contain fpga chips: 256-LBGA package and X package. Having 173 I/Os makes data transfers more coherent. Logic blocks consist of 4320 logic elements/cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. The supply voltage of the device is 1.14V~1.26V , at which it runs. The Spartan®-3 series FPGA is a type of FPGA that belongs to the Spartan®-3 family of FPGAs. When operating the machine, it is important to keep the temperature within 0°C~85°C TJ range. There is an FPGA model contained in Bulk in order to conserve space. A device like this one offers 221184 RAM bits, which is a considerable amount of memory. This FPGA module has a RAM si27kBe of 27kB that is sufficient to make sure that the program is able to run normally. In this case, there are 256 pins on the board. A total of 480 LABs/CLBs make up this FPGA array. Having stated that, if this FPGA is mounted in Standard, then it may be able to perform fantastically according to its specifications. The 1.2V supply voltage provides designers with full flexibility in their designs. During its maximal operating temperature, this module reaches 85°C. In order to achieve 0°C, the operating temperature must be higher than 0°C. The building block that forms the basis of the system contains 200000 gates. The device package supplied by 256-FTBGA (17x17) is one of its suppliers.

XC3S200-4FT256C Features
173 I/Os
Up to 221184 RAM bits
256 LABs/CLBs
85°C gates


XC3S200-4FT256C Applications
There are a lot of Xilinx Inc.
XC3S200-4FT256C FPGAs applications.


Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
Audio
Automotive
Consumer Electronics
XC3S200-4FT256C More Descriptions
FPGA Spartan-3 Family 200K Gates 4320 Cells 630MHz 90nm Technology 1.2V 256-Pin FTBGA
Field Programmable Gate Array, 480 CLBs, 200000 Gates, 630MHz, 4320-Cell, CMOS, PBGA256
Field Programmable Gate Array, 192 CLBs, 50000 Gates, PQFP208
FPGA - Field Programmable Gate Array 200000 SYSTEM GATE 1.2 VOLT FPGA
Product Description Demo for Development.
French Electronic Distributor since 1988
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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