Xilinx Inc. XC3S1400AN-4FGG676I
- Part Number:
- XC3S1400AN-4FGG676I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 4542149-XC3S1400AN-4FGG676I
- Description:
- IC FPGA 502 I/O 676FBGA
- Datasheet:
- XC3S1400AN-4FGG676I
Xilinx Inc. XC3S1400AN-4FGG676I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC3S1400AN-4FGG676I.
- Factory Lead Time10 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case676-BGA
- Number of Pins676
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2007
- SeriesSpartan®-3AN
- JESD-609 Codee1
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations676
- ECCN Code3A991.D
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply1.14V~1.26V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)250
- Supply Voltage1.2V
- Terminal Pitch1mm
- Frequency667MHz
- Reflow Temperature-Max (s)30
- Base Part NumberXC3S1400AN
- Pin Count676
- Number of Outputs408
- Qualification StatusNot Qualified
- Operating Supply Voltage1.2V
- Power Supplies1.21.2/3.33.3V
- Number of I/O502
- RAM Size72kB
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells25344
- Total RAM Bits589824
- Number of Gates1400000
- Number of LABs/CLBs2816
- Speed Grade4
- Combinatorial Delay of a CLB-Max0.71 ns
- Length27mm
- Width27mm
- REACH SVHCUnknown
- RoHS StatusROHS3 Compliant
XC3S1400AN-4FGG676I Overview
There are two packages that contain fpga chips: 676-BGA package and X package. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. 502 I/Os are available for transferring data more efficiently. There are 25344 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1.2V. Part of the Field Programmable Gate Arrays family, this FPGA part is a programmable gate array. By attaching the Surface Mount connector, you can use this FPGA module with your development board. Fpga chips operates wFpga chipsh a supply voltage of 1.14V~1.26V. There are many types of FPGAs in the Spartan?-3AN series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. In this device, there are 408 outputs that can be used. This FPGA model is contained in Tray for space saving. In total, there are a total of 676 terminations on fpga chips. This device is equipped with 589824 RAM bits in terms of its RAM si589824e. Parts related to this part can be found using its base part number XC3S1400AN. During the configuration of this FPGA module, the RAM si72kBe reaches 72kB to ensure that the program runs normally. There are 676 pins on this device. The FPGA is built as an array of 2816 latches or CLBs. Having stated that, if this FPGA is mounted in Surface Mount, then it may be able to perform fantastically according to its specifications. Its flexibility is fully utilized when operated with a supply voltage of 1.2V. In order for fpga electronics to work, fpga electronics requires a 1.21.2/3.33.3V power supply. There are 1400000 gates that make up its basic building block. With a total of 676 pins, it is equipped with a high level of security. To achieve high efficiency, it runs at a frequency of 667MHz.
XC3S1400AN-4FGG676I Features
502 I/Os
Up to 589824 RAM bits
676 LABs/CLBs
Operating from a frequency of 667MHz
XC3S1400AN-4FGG676I Applications
There are a lot of Xilinx Inc. XC3S1400AN-4FGG676I FPGAs applications.
Integrating multiple SPLDs
Aerospace and Defense
Automation
Broadcast
Aircraft navigation
Data center hardware accelerators
Computer hardware emulation
Automotive advanced driver assistance systems (ADAS)
Software-defined radios
Artificial intelligence (AI)
There are two packages that contain fpga chips: 676-BGA package and X package. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. 502 I/Os are available for transferring data more efficiently. There are 25344 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1.2V. Part of the Field Programmable Gate Arrays family, this FPGA part is a programmable gate array. By attaching the Surface Mount connector, you can use this FPGA module with your development board. Fpga chips operates wFpga chipsh a supply voltage of 1.14V~1.26V. There are many types of FPGAs in the Spartan?-3AN series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. In this device, there are 408 outputs that can be used. This FPGA model is contained in Tray for space saving. In total, there are a total of 676 terminations on fpga chips. This device is equipped with 589824 RAM bits in terms of its RAM si589824e. Parts related to this part can be found using its base part number XC3S1400AN. During the configuration of this FPGA module, the RAM si72kBe reaches 72kB to ensure that the program runs normally. There are 676 pins on this device. The FPGA is built as an array of 2816 latches or CLBs. Having stated that, if this FPGA is mounted in Surface Mount, then it may be able to perform fantastically according to its specifications. Its flexibility is fully utilized when operated with a supply voltage of 1.2V. In order for fpga electronics to work, fpga electronics requires a 1.21.2/3.33.3V power supply. There are 1400000 gates that make up its basic building block. With a total of 676 pins, it is equipped with a high level of security. To achieve high efficiency, it runs at a frequency of 667MHz.
XC3S1400AN-4FGG676I Features
502 I/Os
Up to 589824 RAM bits
676 LABs/CLBs
Operating from a frequency of 667MHz
XC3S1400AN-4FGG676I Applications
There are a lot of Xilinx Inc. XC3S1400AN-4FGG676I FPGAs applications.
Integrating multiple SPLDs
Aerospace and Defense
Automation
Broadcast
Aircraft navigation
Data center hardware accelerators
Computer hardware emulation
Automotive advanced driver assistance systems (ADAS)
Software-defined radios
Artificial intelligence (AI)
XC3S1400AN-4FGG676I More Descriptions
FPGA Spartan-3AN Family 1.4M Gates 25344 Cells 667MHz 90nm Technology 1.2V 676-Pin FBGA
Field Programmable Gate Array, 2816 CLBs, 1400000 Gates, 667MHz, 25344-Cell, CMOS, PBGA676
XILINX XC3S1400AN-4FGG676I FPGA, SPARTAN-3AN, 1400K GATES, 676FBGA
FPGA, SPARTAN-3AN, 1400K GATES, 676FBGA; No. of Logic Blocks:2816; No. of Gates:1400000; No. of Macrocells:25344; Family Type:Spartan-3AN; No. of Speed Grades:4; Series:Spartan-3AN; Total RAM Bits:589824; No. of I/O's:502; Clock Management:DLL; Core Supply Voltage Range:1.14V to 1.26V; Operating Frequency Max:250MHz; Operating Temperature Range:-40°C to 85°C; Logic Case Style:FBGA; No. of Pins:676; MSL:MSL 3 - 168 hours; SVHC:No SVHC (18-Jun-2012); Frequency:667MHz; I/O Interface Standard:HSTL ,LVCMOS ,LVTTL ,SSTL; I/O Output Drive:3.3V, 2.5V, 1.8V, 1.5V, 1.2V; Logic IC Base Number:3S1400; Logic IC Function:FPGA; No. of I/O's:502; Package / Case:FBGA; Programmable Logic Type:FPGA; Supply Voltage Max:1.26V; Supply Voltage Min:1.14V; Termination Type:SMD
Field Programmable Gate Array, 2816 CLBs, 1400000 Gates, 667MHz, 25344-Cell, CMOS, PBGA676
XILINX XC3S1400AN-4FGG676I FPGA, SPARTAN-3AN, 1400K GATES, 676FBGA
FPGA, SPARTAN-3AN, 1400K GATES, 676FBGA; No. of Logic Blocks:2816; No. of Gates:1400000; No. of Macrocells:25344; Family Type:Spartan-3AN; No. of Speed Grades:4; Series:Spartan-3AN; Total RAM Bits:589824; No. of I/O's:502; Clock Management:DLL; Core Supply Voltage Range:1.14V to 1.26V; Operating Frequency Max:250MHz; Operating Temperature Range:-40°C to 85°C; Logic Case Style:FBGA; No. of Pins:676; MSL:MSL 3 - 168 hours; SVHC:No SVHC (18-Jun-2012); Frequency:667MHz; I/O Interface Standard:HSTL ,LVCMOS ,LVTTL ,SSTL; I/O Output Drive:3.3V, 2.5V, 1.8V, 1.5V, 1.2V; Logic IC Base Number:3S1400; Logic IC Function:FPGA; No. of I/O's:502; Package / Case:FBGA; Programmable Logic Type:FPGA; Supply Voltage Max:1.26V; Supply Voltage Min:1.14V; Termination Type:SMD
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