Xilinx Inc. XC3S1200E-4FG320C
- Part Number:
- XC3S1200E-4FG320C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3633056-XC3S1200E-4FG320C
- Description:
- IC FPGA 250 I/O 320FBGA
- Datasheet:
- XC3S1200E-4FG320C
Xilinx Inc. XC3S1200E-4FG320C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC3S1200E-4FG320C.
- Factory Lead Time10 Weeks
- Mounting TypeSurface Mount
- Package / Case320-BGA
- Surface MountYES
- Operating Temperature0°C~85°C TJ
- PackagingBulk
- SeriesSpartan®-3E
- Published2008
- JESD-609 Codee0
- Pbfree Codeno
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations320
- ECCN Code3A991.D
- Terminal FinishTin/Lead (Sn63Pb37)
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply1.14V~1.26V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)225
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reach Compliance Codenot_compliant
- Time@Peak Reflow Temperature-Max (s)30
- Pin Count320
- JESD-30 CodeS-PBGA-B320
- Number of Outputs194
- Qualification StatusNot Qualified
- Operating Supply Voltage1.2V
- Power Supplies1.21.2/3.32.5V
- Number of I/O250
- RAM Size63kB
- Clock Frequency572MHz
- Number of Inputs250
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells19512
- Total RAM Bits516096
- Number of Gates1200000
- Number of LABs/CLBs2168
- Speed Grade4
- Number of Registers17344
- Combinatorial Delay of a CLB-Max0.76 ns
- Length19mm
- Height Seated (Max)2mm
- Width19mm
- RoHS StatusNon-RoHS Compliant
XC3S1200E-4FG320C Overview
Fpga chips is supplied in the 320-BGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 250 I/Os for transferring data in a more coherent manner. There are 19512 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1.2V. This FPGA part belongs to the family of Field Programmable Gate Arrays. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 1.14V~1.26V. It is a type of FPGA belonging to the Spartan®-3E seies. The operating temperature should be kept at 0°C~85°C TJ when operating. There are 194 outputs incorporated in this device. This FPGA model is contained in Bulk for space saving. Fpga chips is designed wFpga chipsh 320 terminations. The RAM bits that this device offer is 516096. The RAM si63kBe of this FPGA module reaches 63kB to ensure normal operation of the program. This FPGA is built as an array of 2168 LABs/CLBs. When operating with the supply voltage of 1.2V, designers can fully make use of its flexibility. Fpga electronics operates from a 1.21.2/3.32.5V power supply. Its basic building block contains 1200000 gates. Fpga semiconductor is equipped wfpga semiconductorh 320 pin count. Typically, fpga semiconductor uses a crystal oscillating at 572MHz . There are 17344 registers used to store and transfer data.
XC3S1200E-4FG320C Features
250 I/Os
Up to 516096 RAM bits
17344 registers
XC3S1200E-4FG320C Applications
There are a lot of Xilinx Inc.
XC3S1200E-4FG320C FPGAs applications.
Digital signal processing
Bioinformatics
Device controllers
Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Fpga chips is supplied in the 320-BGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 250 I/Os for transferring data in a more coherent manner. There are 19512 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1.2V. This FPGA part belongs to the family of Field Programmable Gate Arrays. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 1.14V~1.26V. It is a type of FPGA belonging to the Spartan®-3E seies. The operating temperature should be kept at 0°C~85°C TJ when operating. There are 194 outputs incorporated in this device. This FPGA model is contained in Bulk for space saving. Fpga chips is designed wFpga chipsh 320 terminations. The RAM bits that this device offer is 516096. The RAM si63kBe of this FPGA module reaches 63kB to ensure normal operation of the program. This FPGA is built as an array of 2168 LABs/CLBs. When operating with the supply voltage of 1.2V, designers can fully make use of its flexibility. Fpga electronics operates from a 1.21.2/3.32.5V power supply. Its basic building block contains 1200000 gates. Fpga semiconductor is equipped wfpga semiconductorh 320 pin count. Typically, fpga semiconductor uses a crystal oscillating at 572MHz . There are 17344 registers used to store and transfer data.
XC3S1200E-4FG320C Features
250 I/Os
Up to 516096 RAM bits
17344 registers
XC3S1200E-4FG320C Applications
There are a lot of Xilinx Inc.
XC3S1200E-4FG320C FPGAs applications.
Digital signal processing
Bioinformatics
Device controllers
Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
XC3S1200E-4FG320C More Descriptions
FPGA Spartan-3E Family 1.2M Gates 19512 Cells 572MHz 90nm (CMOS) Technology 1.2V 320-Pin F-BGA
Field Programmable Gate Array, 2168 CLBs, 1200000 Gates, 572MHz, 19512-Cell, CMOS, PBGA400
BGA-320 Programmable Logic Device (CPLDs/FPGAs) ROHS
Field Programmable Gate Array, 2168 CLBs, 1200000 Gates, 572MHz, 19512-Cell, CMOS, PBGA400
BGA-320 Programmable Logic Device (CPLDs/FPGAs) ROHS
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