Xilinx Inc. XC2VP4-5FGG256I

XC2VP4-5FGG256I Overview
The packaging for this particular electronic component is a tray, which is used to hold and protect the individual units during transportation and storage. The JESD-609 code for this component is e1, indicating that it meets the industry standards for handling and reliability. However, the part status is listed as obsolete, meaning that it is no longer in production and may be difficult to find. The moisture sensitivity level (MSL) for this component is 3, which means it can withstand exposure to a relative humidity of up to 30% for 168 hours. The voltage supply for this component ranges from 1.425V to 1.575V, and it has a terminal form of BALL. It can withstand a peak reflow temperature of 260 degrees Celsius and has a pin count of 256. This component also has an impressive 6,768 logic elements or cells, making it a powerful and versatile choice for electronic devices. Its height when seated is a maximum of 2mm, making it a compact option for space-constrained designs.

XC2VP4-5FGG256I Features
140 I/Os
Up to 516096 RAM bits
256 LABs/CLBs
6016 registers

XC2VP4-5FGG256I Applications
There are a lot of Xilinx Inc. XC2VP4-5FGG256I FPGAs applications.

Defense Applications
Radar and Sensors
Medical Electronics
Military Temperature
Industrial IoT
Video & Image Processing
Medical imaging
Digital signal processing
Data Center
High Performance Computing