Xilinx Inc. XC2VP30-5FFG896I
- Part Number:
- XC2VP30-5FFG896I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3641485-XC2VP30-5FFG896I
- Description:
- IC FPGA 556 I/O 896FCBGA
- Datasheet:
- XC2VP30-5FFG896I
Xilinx Inc. XC2VP30-5FFG896I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC2VP30-5FFG896I.
- Factory Lead Time6 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case896-BBGA, FCBGA
- Number of Pins896
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2010
- SeriesVirtex®-II Pro
- JESD-609 Codee1
- Pbfree Codeyes
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations896
- ECCN Code3A991.D
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply1.425V~1.575V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)245
- Supply Voltage1.5V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)30
- Base Part NumberXC2VP30
- Pin Count896
- Number of Outputs556
- Qualification StatusNot Qualified
- Operating Supply Voltage1.5V
- Number of I/O556
- RAM Size306kB
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells30816
- Total RAM Bits2506752
- Number of LABs/CLBs3424
- Speed Grade5
- Number of Registers27392
- Combinatorial Delay of a CLB-Max0.36 ns
- Height Seated (Max)3.4mm
- Length31mm
- Width31mm
- RoHS StatusROHS3 Compliant
XC2VP30-5FFG896I Overview
The manufacturer of this component is Xilinx Inc., a company that specializes in Embedded - FPGAs (Field Programmable Gate Array) chips. This particular chip falls under the Embedded - FPGAs (Field Programmable Gate Array) category. It has an operating temperature range of -40°C to 100°C TJ and was first published in 2010. It is part of the Virtex®-II Pro series and has a total of 896 terminations, with a terminal pitch of 1mm. There are 556 outputs and a RAM size of 306kB. This chip uses FIELD PROGRAMMABLE GATE ARRAY as its programmable logic type and has a total of 2506752 RAM bits. Additionally, it has 27392 registers.
XC2VP30-5FFG896I Features
556 I/Os
Up to 2506752 RAM bits
896 LABs/CLBs
27392 registers
XC2VP30-5FFG896I Applications
There are a lot of Xilinx Inc. XC2VP30-5FFG896I FPGAs applications.
Aerospace and Defense
Distributed Monetary Systems
Computer hardware emulation
Military Temperature
Bioinformatics
Security systems
Cryptography
Space Applications
ASIC prototyping
Solar Energy
The manufacturer of this component is Xilinx Inc., a company that specializes in Embedded - FPGAs (Field Programmable Gate Array) chips. This particular chip falls under the Embedded - FPGAs (Field Programmable Gate Array) category. It has an operating temperature range of -40°C to 100°C TJ and was first published in 2010. It is part of the Virtex®-II Pro series and has a total of 896 terminations, with a terminal pitch of 1mm. There are 556 outputs and a RAM size of 306kB. This chip uses FIELD PROGRAMMABLE GATE ARRAY as its programmable logic type and has a total of 2506752 RAM bits. Additionally, it has 27392 registers.
XC2VP30-5FFG896I Features
556 I/Os
Up to 2506752 RAM bits
896 LABs/CLBs
27392 registers
XC2VP30-5FFG896I Applications
There are a lot of Xilinx Inc. XC2VP30-5FFG896I FPGAs applications.
Aerospace and Defense
Distributed Monetary Systems
Computer hardware emulation
Military Temperature
Bioinformatics
Security systems
Cryptography
Space Applications
ASIC prototyping
Solar Energy
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