XC2VP2-5FGG456C

Xilinx Inc. XC2VP2-5FGG456C

Part Number:
XC2VP2-5FGG456C
Manufacturer:
Xilinx Inc.
Ventron No:
3126997-XC2VP2-5FGG456C
Description:
IC FPGA 156 I/O 456FGBGA
ECAD Model:
Datasheet:
Virtex-II Pro, Pro X

Quick Request Quote

Please send RFQ , We will respond immediately.

Part Number
Quantity
Company
E-mail
Phone
Comments
Specifications
Xilinx Inc. XC2VP2-5FGG456C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC2VP2-5FGG456C.
  • Factory Lead Time
    6 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    456-BBGA
  • Number of Pins
    456
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    2011
  • Series
    Virtex®-II Pro
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    456
  • ECCN Code
    EAR99
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    1.425V~1.575V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    250
  • Supply Voltage
    1.5V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC2VP2
  • Pin Count
    456
  • Number of Outputs
    156
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    1.5V
  • Number of I/O
    156
  • RAM Size
    27kB
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    3168
  • Total RAM Bits
    221184
  • Number of LABs/CLBs
    352
  • Speed Grade
    5
  • Number of Registers
    2816
  • Combinatorial Delay of a CLB-Max
    0.36 ns
  • Number of CLBs
    352
  • Height Seated (Max)
    2.6mm
  • Length
    23mm
  • Width
    23mm
  • RoHS Status
    ROHS3 Compliant
Description
XC2VP2-5FGG456C Overview
The specific brand of this electronic component is Xilinx Inc. It is a chip that falls under the category of Embedded - FPGAs (Field Programmable Gate Array), meaning it is a type of integrated circuit that can be programmed after being manufactured. The package or case of this chip is 456-BBGA, which refers to the type of packaging used to protect and connect the chip. Its operating temperature ranges from 0°C to 85°C TJ, indicating the temperature range in which the chip can function properly. This particular chip was first published in 2011. The terminal pitch, which is the distance between the center of one terminal to the center of the next, is 1mm. It has 156 outputs, which are the points where signals can be sent out from the chip. It also has 156 input/output (I/O) pins, which are used to connect the chip to other components. The chip contains 3168 logic elements or cells, which are the basic building blocks for creating digital logic circuits. It also has 352 LABs (Logic Array Blocks) or CLBs (Configurable Logic Blocks), which are collections of logic elements that can be configured to perform specific functions. The combinatorial delay, which is the time it takes for a signal to pass through a CLB, has a maximum value of 0.36 nanoseconds. Lastly, the width of the chip is 23mm, indicating its physical size.

XC2VP2-5FGG456C Features
156 I/Os
Up to 221184 RAM bits
456 LABs/CLBs
2816 registers

XC2VP2-5FGG456C Applications
There are a lot of Xilinx Inc. XC2VP2-5FGG456C FPGAs applications.

Integrating multiple SPLDs
Development Boards and Shields for Microcontrollers
Artificial intelligence (AI)
Software-defined radio
Video & Image Processing
Data center hardware accelerators
Automotive driver's assistance
Medical imaging
Aircraft navigation
Audio
XC2VP2-5FGG456C More Descriptions
FPGA Virtex-II Pro Family 3168 Cells 1050MHz 0.13um/90nm (CMOS) Technology 1.5V 456-Pin F-BGA
Field Programmable Gate Array, 2320 CLBs, 1200MHz, 20880-Cell, CMOS, PBGA1152
IC FPGA 156 I/O 456FGBGA
IC FPGA 140 I/O 256FBGA
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

Latest News

  • 14 March 2024

    Comprehensive Understanding of the 78M05 Chip

    Ⅰ. Development history of linear voltage regulatorsⅡ. Introduction to 78M05Ⅲ. Pin layout of 78M05Ⅳ. External components of 78M05Ⅴ. Technical key points of 78M05Ⅵ. Internal circuit diagram of 78M05Ⅶ....
  • 14 March 2024

    What is the NE555 and How Does it Work?

    Ⅰ. The birth background of NE555Ⅱ. Introduction to NE555Ⅲ. Design of NE555 timerⅣ. Internal composition of NE555Ⅴ. Operating modes of the NE555Ⅵ. Working principle of NE555Ⅶ. Application of...
  • 15 March 2024

    ULN2003 Alternatives, Characteristics, Working Principle and Application

    Ⅰ. ULN2003 overviewⅡ. What are the characteristics of ULN2003?Ⅲ. Pin diagram and functions of ULN2003Ⅳ. Working principle and function of ULN2003Ⅴ. ULN2003 drive circuit diagramⅥ. Where is ULN2003...
  • 15 March 2024

    Detailed Explanation of 24C02 EEPROM Memory Chip

    Ⅰ. Overview of 24C02Ⅱ. Functions of 24C02Ⅲ. Basic operations of 24C02Ⅳ. Application of 24C02Ⅴ. 24C02 pinoutⅥ. How to protect the data of 24C02?Ⅶ. How to use 24C02?EEPROM refers...
  • cost

    Help you to save your cost and time.

  • package

    Reliable package for your goods.

  • fast

    Fast Reliable Delivery to save time.

  • service

    Quality premium after-sale service.