Xilinx Inc. XC2VP2-5FGG456C
- Part Number:
- XC2VP2-5FGG456C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3126997-XC2VP2-5FGG456C
- Description:
- IC FPGA 156 I/O 456FGBGA
- Datasheet:
- Virtex-II Pro, Pro X
Xilinx Inc. XC2VP2-5FGG456C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC2VP2-5FGG456C.
- Factory Lead Time6 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case456-BBGA
- Number of Pins456
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2011
- SeriesVirtex®-II Pro
- JESD-609 Codee1
- Pbfree Codeyes
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations456
- ECCN CodeEAR99
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply1.425V~1.575V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)250
- Supply Voltage1.5V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)30
- Base Part NumberXC2VP2
- Pin Count456
- Number of Outputs156
- Qualification StatusNot Qualified
- Operating Supply Voltage1.5V
- Number of I/O156
- RAM Size27kB
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells3168
- Total RAM Bits221184
- Number of LABs/CLBs352
- Speed Grade5
- Number of Registers2816
- Combinatorial Delay of a CLB-Max0.36 ns
- Number of CLBs352
- Height Seated (Max)2.6mm
- Length23mm
- Width23mm
- RoHS StatusROHS3 Compliant
XC2VP2-5FGG456C Overview
The specific brand of this electronic component is Xilinx Inc. It is a chip that falls under the category of Embedded - FPGAs (Field Programmable Gate Array), meaning it is a type of integrated circuit that can be programmed after being manufactured. The package or case of this chip is 456-BBGA, which refers to the type of packaging used to protect and connect the chip. Its operating temperature ranges from 0°C to 85°C TJ, indicating the temperature range in which the chip can function properly. This particular chip was first published in 2011. The terminal pitch, which is the distance between the center of one terminal to the center of the next, is 1mm. It has 156 outputs, which are the points where signals can be sent out from the chip. It also has 156 input/output (I/O) pins, which are used to connect the chip to other components. The chip contains 3168 logic elements or cells, which are the basic building blocks for creating digital logic circuits. It also has 352 LABs (Logic Array Blocks) or CLBs (Configurable Logic Blocks), which are collections of logic elements that can be configured to perform specific functions. The combinatorial delay, which is the time it takes for a signal to pass through a CLB, has a maximum value of 0.36 nanoseconds. Lastly, the width of the chip is 23mm, indicating its physical size.
XC2VP2-5FGG456C Features
156 I/Os
Up to 221184 RAM bits
456 LABs/CLBs
2816 registers
XC2VP2-5FGG456C Applications
There are a lot of Xilinx Inc. XC2VP2-5FGG456C FPGAs applications.
Integrating multiple SPLDs
Development Boards and Shields for Microcontrollers
Artificial intelligence (AI)
Software-defined radio
Video & Image Processing
Data center hardware accelerators
Automotive driver's assistance
Medical imaging
Aircraft navigation
Audio
The specific brand of this electronic component is Xilinx Inc. It is a chip that falls under the category of Embedded - FPGAs (Field Programmable Gate Array), meaning it is a type of integrated circuit that can be programmed after being manufactured. The package or case of this chip is 456-BBGA, which refers to the type of packaging used to protect and connect the chip. Its operating temperature ranges from 0°C to 85°C TJ, indicating the temperature range in which the chip can function properly. This particular chip was first published in 2011. The terminal pitch, which is the distance between the center of one terminal to the center of the next, is 1mm. It has 156 outputs, which are the points where signals can be sent out from the chip. It also has 156 input/output (I/O) pins, which are used to connect the chip to other components. The chip contains 3168 logic elements or cells, which are the basic building blocks for creating digital logic circuits. It also has 352 LABs (Logic Array Blocks) or CLBs (Configurable Logic Blocks), which are collections of logic elements that can be configured to perform specific functions. The combinatorial delay, which is the time it takes for a signal to pass through a CLB, has a maximum value of 0.36 nanoseconds. Lastly, the width of the chip is 23mm, indicating its physical size.
XC2VP2-5FGG456C Features
156 I/Os
Up to 221184 RAM bits
456 LABs/CLBs
2816 registers
XC2VP2-5FGG456C Applications
There are a lot of Xilinx Inc. XC2VP2-5FGG456C FPGAs applications.
Integrating multiple SPLDs
Development Boards and Shields for Microcontrollers
Artificial intelligence (AI)
Software-defined radio
Video & Image Processing
Data center hardware accelerators
Automotive driver's assistance
Medical imaging
Aircraft navigation
Audio
XC2VP2-5FGG456C More Descriptions
FPGA Virtex-II Pro Family 3168 Cells 1050MHz 0.13um/90nm (CMOS) Technology 1.5V 456-Pin F-BGA
Field Programmable Gate Array, 2320 CLBs, 1200MHz, 20880-Cell, CMOS, PBGA1152
IC FPGA 156 I/O 456FGBGA
IC FPGA 140 I/O 256FBGA
Field Programmable Gate Array, 2320 CLBs, 1200MHz, 20880-Cell, CMOS, PBGA1152
IC FPGA 156 I/O 456FGBGA
IC FPGA 140 I/O 256FBGA
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