Xilinx Inc. XC2V6000-5FF1152I
- Part Number:
- XC2V6000-5FF1152I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3639423-XC2V6000-5FF1152I
- Description:
- IC FPGA 824 I/O 1152FCBGA
- Datasheet:
- Virtex-II Platform FPGAs
Xilinx Inc. XC2V6000-5FF1152I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC2V6000-5FF1152I.
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case1152-BBGA, FCBGA
- Number of Pins1152
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2011
- SeriesVirtex®-II
- JESD-609 Codee0
- Pbfree Codeno
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- ECCN Code3A001.A.7.A
- Terminal FinishTin/Lead (Sn63Pb37)
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply1.425V~1.575V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)225
- Supply Voltage1.5V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)30
- Base Part NumberXC2V6000
- Number of Outputs824
- Operating Supply Voltage1.5V
- Number of I/O824
- RAM Size324kB
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Total RAM Bits2654208
- Number of Gates6000000
- Number of LABs/CLBs8448
- Speed Grade5
- Number of Registers67584
- Combinatorial Delay of a CLB-Max0.39 ns
- Number of Logic Cells76032
- Height Seated (Max)3.4mm
- Radiation HardeningNo
- RoHS StatusNon-RoHS Compliant
XC2V6000-5FF1152I Overview
This component is manufactured by Xilinx Inc. and falls into the category of Embedded - FPGAs (Field Programmable Gate Array) chips. It was first released in 2011 and is part of the Virtex®-II series. The operating temperature range for this chip is -40°C to 100°C with a packaging method of Tray. It does not contain any lead and has a Moisture Sensitivity Level (MSL) of 4, meaning it can withstand 72 hours of exposure to moisture. The technology used in this chip is CMOS and its terminal position is located at the bottom. The peak reflow temperature for this component is 225 degrees Celsius and it has a total of 2654208 bits of RAM.
XC2V6000-5FF1152I Features
824 I/Os
Up to 2654208 RAM bits
1152 LABs/CLBs
67584 registers
XC2V6000-5FF1152I Applications
There are a lot of Xilinx Inc. XC2V6000-5FF1152I FPGAs applications.
Telecommunication
Software-defined radio
Enterprise networking
Distributed Monetary Systems
Data center hardware accelerators
Broadcast
Industrial,Medical and Scientific Instruments
Image processing
Automation
Data Center
This component is manufactured by Xilinx Inc. and falls into the category of Embedded - FPGAs (Field Programmable Gate Array) chips. It was first released in 2011 and is part of the Virtex®-II series. The operating temperature range for this chip is -40°C to 100°C with a packaging method of Tray. It does not contain any lead and has a Moisture Sensitivity Level (MSL) of 4, meaning it can withstand 72 hours of exposure to moisture. The technology used in this chip is CMOS and its terminal position is located at the bottom. The peak reflow temperature for this component is 225 degrees Celsius and it has a total of 2654208 bits of RAM.
XC2V6000-5FF1152I Features
824 I/Os
Up to 2654208 RAM bits
1152 LABs/CLBs
67584 registers
XC2V6000-5FF1152I Applications
There are a lot of Xilinx Inc. XC2V6000-5FF1152I FPGAs applications.
Telecommunication
Software-defined radio
Enterprise networking
Distributed Monetary Systems
Data center hardware accelerators
Broadcast
Industrial,Medical and Scientific Instruments
Image processing
Automation
Data Center
XC2V6000-5FF1152I More Descriptions
Field Programmable Gate Array, 8448 CLBs, 6000000 Gates, 750MHz, 76032-Cell, CMOS, PBGA1152
FPGA Virtex-II Family 6M Gates 76882 Cells 750MHz 0.15um/0.12um (CMOS) Technology 1.5V 1152-Pin FC-BGA
0402 16 pF 50 V ±5% Tolerance C0G SMT Multilayer Ceramic Capacitor
CoC and 2-years warranty / RFQ for pricing
FPGA Virtex-II Family 6M Gates 76882 Cells 750MHz 0.15um/0.12um (CMOS) Technology 1.5V 1152-Pin FC-BGA
0402 16 pF 50 V ±5% Tolerance C0G SMT Multilayer Ceramic Capacitor
CoC and 2-years warranty / RFQ for pricing
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