XC2V6000-5FF1152I

Xilinx Inc. XC2V6000-5FF1152I

Part Number:
XC2V6000-5FF1152I
Manufacturer:
Xilinx Inc.
Ventron No:
3639423-XC2V6000-5FF1152I
Description:
IC FPGA 824 I/O 1152FCBGA
ECAD Model:
Datasheet:
Virtex-II Platform FPGAs

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Specifications
Xilinx Inc. XC2V6000-5FF1152I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC2V6000-5FF1152I.
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    1152-BBGA, FCBGA
  • Number of Pins
    1152
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2011
  • Series
    Virtex®-II
  • JESD-609 Code
    e0
  • Pbfree Code
    no
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • ECCN Code
    3A001.A.7.A
  • Terminal Finish
    Tin/Lead (Sn63Pb37)
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    1.425V~1.575V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    225
  • Supply Voltage
    1.5V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC2V6000
  • Number of Outputs
    824
  • Operating Supply Voltage
    1.5V
  • Number of I/O
    824
  • RAM Size
    324kB
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Total RAM Bits
    2654208
  • Number of Gates
    6000000
  • Number of LABs/CLBs
    8448
  • Speed Grade
    5
  • Number of Registers
    67584
  • Combinatorial Delay of a CLB-Max
    0.39 ns
  • Number of Logic Cells
    76032
  • Height Seated (Max)
    3.4mm
  • Radiation Hardening
    No
  • RoHS Status
    Non-RoHS Compliant
Description
XC2V6000-5FF1152I Overview
This component is manufactured by Xilinx Inc. and falls into the category of Embedded - FPGAs (Field Programmable Gate Array) chips. It was first released in 2011 and is part of the Virtex®-II series. The operating temperature range for this chip is -40°C to 100°C with a packaging method of Tray. It does not contain any lead and has a Moisture Sensitivity Level (MSL) of 4, meaning it can withstand 72 hours of exposure to moisture. The technology used in this chip is CMOS and its terminal position is located at the bottom. The peak reflow temperature for this component is 225 degrees Celsius and it has a total of 2654208 bits of RAM.

XC2V6000-5FF1152I Features
824 I/Os
Up to 2654208 RAM bits
1152 LABs/CLBs
67584 registers

XC2V6000-5FF1152I Applications
There are a lot of Xilinx Inc. XC2V6000-5FF1152I FPGAs applications.

Telecommunication
Software-defined radio
Enterprise networking
Distributed Monetary Systems
Data center hardware accelerators
Broadcast
Industrial,Medical and Scientific Instruments
Image processing
Automation
Data Center
XC2V6000-5FF1152I More Descriptions
Field Programmable Gate Array, 8448 CLBs, 6000000 Gates, 750MHz, 76032-Cell, CMOS, PBGA1152
FPGA Virtex-II Family 6M Gates 76882 Cells 750MHz 0.15um/0.12um (CMOS) Technology 1.5V 1152-Pin FC-BGA
0402 16 pF 50 V ±5% Tolerance C0G SMT Multilayer Ceramic Capacitor
CoC and 2-years warranty / RFQ for pricing
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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