Xilinx Inc. XC2V500-6FGG456C

XC2V500-6FGG456C Overview
The package or case of this particular electronic component is 456-BBGA, which is a type of ball grid array package with 456 balls. The code for this package is marked as "yes", indicating that it is lead-free and environmentally friendly. The Moisture Sensitivity Level (MSL) for this package is rated as 3, meaning that it can withstand exposure to moisture for up to 168 hours without being damaged. The voltage supply for this component ranges from 1.425V to 1.575V, making it suitable for a variety of applications. The terminal form of this package is a ball, which is a common form for BGA packages. The supply voltage for this component is 1.5V, and it can operate at this voltage. It has a maximum reflow temperature of 30 seconds, and the operating supply voltage is also 1.5V. With a total of 589824 RAM bits and a width of 23mm, this package is a versatile and efficient choice for electronic devices.

XC2V500-6FGG456C Features
264 I/Os
Up to 589824 RAM bits
456 LABs/CLBs
6144 registers

XC2V500-6FGG456C Applications
There are a lot of Xilinx Inc. XC2V500-6FGG456C FPGAs applications.

Automotive
Industrial Ethernet
Broadcast
Radar and Sensors
Automotive advanced driver assistance systems (ADAS)
Data center hardware accelerators
Image processing
Ecosystem
ADAS
Development Boards and Shields for Microcontrollers