XC2V1000-5BGG575I

Xilinx Inc. XC2V1000-5BGG575I

Part Number:
XC2V1000-5BGG575I
Manufacturer:
Xilinx Inc.
Ventron No:
3133253-XC2V1000-5BGG575I
Description:
IC FPGA 328 I/O 575MBGA
ECAD Model:
Datasheet:
Virtex-II Platform FPGAs

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Specifications
Xilinx Inc. XC2V1000-5BGG575I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC2V1000-5BGG575I.
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    575-BBGA
  • Number of Pins
    575
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2007
  • Series
    Virtex®-II
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    575
  • ECCN Code
    EAR99
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    1.425V~1.575V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    250
  • Supply Voltage
    1.5V
  • Terminal Pitch
    1.27mm
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    XC2V1000
  • Pin Count
    575
  • Number of Outputs
    328
  • Operating Supply Voltage
    1.5V
  • Number of I/O
    328
  • RAM Size
    90kB
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Total RAM Bits
    737280
  • Number of Gates
    1000000
  • Number of LABs/CLBs
    1280
  • Speed Grade
    5
  • Number of Registers
    10240
  • Combinatorial Delay of a CLB-Max
    0.39 ns
  • Height Seated (Max)
    2.6mm
  • Length
    31mm
  • Width
    31mm
  • Radiation Hardening
    No
  • RoHS Status
    RoHS Compliant
Description
XC2V1000-5BGG575I Overview
The manufacturer of this component is Xilinx Inc. It is a type of chip known as an Embedded - FPGAs (Field Programmable Gate Array), which falls under the Embedded - FPGAs (Field Programmable Gate Array) category. It is designed to be mounted on the surface of a circuit board and is packaged in a tray. This particular chip was first released in 2007. Its terminal position is located at the bottom of the chip. The maximum reflow temperature for this chip is 40 degrees Celsius. It has a total of 328 input/output connections. The chip has a RAM size of 90kB and a total of 737280 RAM bits. Its speed grade is 5, indicating its performance capabilities. This chip is also compliant with RoHS regulations.

XC2V1000-5BGG575I Features
328 I/Os
Up to 737280 RAM bits
575 LABs/CLBs
10240 registers

XC2V1000-5BGG575I Applications
There are a lot of Xilinx Inc. XC2V1000-5BGG575I FPGAs applications.

OpenCL
Bioinformatics
Data center search engines
Aircraft navigation
Data center hardware accelerators
DO-254
Data Mining
Device controllers
Military Temperature
Artificial intelligence (AI)
XC2V1000-5BGG575I More Descriptions
IC FPGA 328 I/o 575MBGA
CoC and 2-years warranty / RFQ for pricing
Contact for details
Analog Circuit
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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