Xilinx Inc. XC2V1000-5BGG575I
- Part Number:
- XC2V1000-5BGG575I
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3133253-XC2V1000-5BGG575I
- Description:
- IC FPGA 328 I/O 575MBGA
- Datasheet:
- Virtex-II Platform FPGAs
Xilinx Inc. XC2V1000-5BGG575I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC2V1000-5BGG575I.
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case575-BBGA
- Number of Pins575
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2007
- SeriesVirtex®-II
- JESD-609 Codee1
- Pbfree Codeyes
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations575
- ECCN CodeEAR99
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply1.425V~1.575V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)250
- Supply Voltage1.5V
- Terminal Pitch1.27mm
- Reflow Temperature-Max (s)40
- Base Part NumberXC2V1000
- Pin Count575
- Number of Outputs328
- Operating Supply Voltage1.5V
- Number of I/O328
- RAM Size90kB
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Total RAM Bits737280
- Number of Gates1000000
- Number of LABs/CLBs1280
- Speed Grade5
- Number of Registers10240
- Combinatorial Delay of a CLB-Max0.39 ns
- Height Seated (Max)2.6mm
- Length31mm
- Width31mm
- Radiation HardeningNo
- RoHS StatusRoHS Compliant
XC2V1000-5BGG575I Overview
The manufacturer of this component is Xilinx Inc. It is a type of chip known as an Embedded - FPGAs (Field Programmable Gate Array), which falls under the Embedded - FPGAs (Field Programmable Gate Array) category. It is designed to be mounted on the surface of a circuit board and is packaged in a tray. This particular chip was first released in 2007. Its terminal position is located at the bottom of the chip. The maximum reflow temperature for this chip is 40 degrees Celsius. It has a total of 328 input/output connections. The chip has a RAM size of 90kB and a total of 737280 RAM bits. Its speed grade is 5, indicating its performance capabilities. This chip is also compliant with RoHS regulations.
XC2V1000-5BGG575I Features
328 I/Os
Up to 737280 RAM bits
575 LABs/CLBs
10240 registers
XC2V1000-5BGG575I Applications
There are a lot of Xilinx Inc. XC2V1000-5BGG575I FPGAs applications.
OpenCL
Bioinformatics
Data center search engines
Aircraft navigation
Data center hardware accelerators
DO-254
Data Mining
Device controllers
Military Temperature
Artificial intelligence (AI)
The manufacturer of this component is Xilinx Inc. It is a type of chip known as an Embedded - FPGAs (Field Programmable Gate Array), which falls under the Embedded - FPGAs (Field Programmable Gate Array) category. It is designed to be mounted on the surface of a circuit board and is packaged in a tray. This particular chip was first released in 2007. Its terminal position is located at the bottom of the chip. The maximum reflow temperature for this chip is 40 degrees Celsius. It has a total of 328 input/output connections. The chip has a RAM size of 90kB and a total of 737280 RAM bits. Its speed grade is 5, indicating its performance capabilities. This chip is also compliant with RoHS regulations.
XC2V1000-5BGG575I Features
328 I/Os
Up to 737280 RAM bits
575 LABs/CLBs
10240 registers
XC2V1000-5BGG575I Applications
There are a lot of Xilinx Inc. XC2V1000-5BGG575I FPGAs applications.
OpenCL
Bioinformatics
Data center search engines
Aircraft navigation
Data center hardware accelerators
DO-254
Data Mining
Device controllers
Military Temperature
Artificial intelligence (AI)
XC2V1000-5BGG575I More Descriptions
IC FPGA 328 I/o 575MBGA
CoC and 2-years warranty / RFQ for pricing
Contact for details
Analog Circuit
CoC and 2-years warranty / RFQ for pricing
Contact for details
Analog Circuit
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