XC2S200-5FG256C

Xilinx Inc. XC2S200-5FG256C

Part Number:
XC2S200-5FG256C
Manufacturer:
Xilinx Inc.
Ventron No:
4542114-XC2S200-5FG256C
Description:
IC FPGA 176 I/O 256FBGA
ECAD Model:
Datasheet:
XC2S200-5FG256C

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Specifications
Xilinx Inc. XC2S200-5FG256C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC2S200-5FG256C.
  • Factory Lead Time
    10 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    256-BGA
  • Number of Pins
    256
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    1999
  • Series
    Spartan®-II
  • JESD-609 Code
    e0
  • Pbfree Code
    no
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    256
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin/Lead (Sn63Pb37)
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    2.375V~2.625V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    225
  • Supply Voltage
    2.5V
  • Terminal Pitch
    1mm
  • Reach Compliance Code
    not_compliant
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC2S200
  • Pin Count
    256
  • Number of Outputs
    176
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    2.5V
  • Number of I/O
    176
  • RAM Size
    7kB
  • Clock Frequency
    263MHz
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    5292
  • Total RAM Bits
    57344
  • Number of Gates
    200000
  • Number of LABs/CLBs
    1176
  • Speed Grade
    5
  • Combinatorial Delay of a CLB-Max
    0.7 ns
  • Height Seated (Max)
    2mm
  • Length
    17mm
  • Width
    17mm
  • RoHS Status
    Non-RoHS Compliant
  • Lead Free
    Contains Lead
Description
XC2S200-5FG256C Overview
Xilinx Inc. is the brand of this part, which falls under the category of Embedded - FPGAs (Field Programmable Gate Array) chips. It was published in 1999 and has a Pbfree Code of no. The Operating Temperature range is 0°C~85°C TJ and the Terminal Finish is Tin/Lead (Sn63Pb37). The Supply Voltage is 2.5V and the Voltage - Supply range is 2.375V~2.625V. This chip has a Total RAM Bits of 57344 and a Combinatorial Delay of a CLB-Max of 0.7 ns. Additionally, its Peak Reflow Temperature (Cel) is 225 and its Height Seated (Max) is 2mm.

XC2S200-5FG256C Features
176 I/Os
Up to 57344 RAM bits
256 LABs/CLBs

XC2S200-5FG256C Applications
There are a lot of Xilinx Inc. XC2S200-5FG256C FPGAs applications.

Device controllers
Wireless Communications
Broadcast
Data center hardware accelerators
Voice recognition
Aerospace and Defense
Telecommunication
Automotive advanced driver assistance systems (ADAS)
Data center search engines
Enterprise networking
XC2S200-5FG256C More Descriptions
FPGA Spartan-II Family 200K Gates 5292 Cells 263MHz 0.18um Technology 2.5V 256-Pin FBGA
Field Programmable Gate Array, 1176 CLBs, 200000 Gates, 263MHz, 5292-Cell, CMOS, PBGA256
FPGA 1176 CLBS 200000 GATES 263 MHz PBGA256
Product Description Demo for Development.
French Electronic Distributor since 1988
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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