Xilinx Inc. XC2S200-5FG256C
- Part Number:
- XC2S200-5FG256C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 4542114-XC2S200-5FG256C
- Description:
- IC FPGA 176 I/O 256FBGA
- Datasheet:
- XC2S200-5FG256C
Xilinx Inc. XC2S200-5FG256C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC2S200-5FG256C.
- Factory Lead Time10 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case256-BGA
- Number of Pins256
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published1999
- SeriesSpartan®-II
- JESD-609 Codee0
- Pbfree Codeno
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations256
- ECCN CodeEAR99
- Terminal FinishTin/Lead (Sn63Pb37)
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply2.375V~2.625V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)225
- Supply Voltage2.5V
- Terminal Pitch1mm
- Reach Compliance Codenot_compliant
- Reflow Temperature-Max (s)30
- Base Part NumberXC2S200
- Pin Count256
- Number of Outputs176
- Qualification StatusNot Qualified
- Operating Supply Voltage2.5V
- Number of I/O176
- RAM Size7kB
- Clock Frequency263MHz
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells5292
- Total RAM Bits57344
- Number of Gates200000
- Number of LABs/CLBs1176
- Speed Grade5
- Combinatorial Delay of a CLB-Max0.7 ns
- Height Seated (Max)2mm
- Length17mm
- Width17mm
- RoHS StatusNon-RoHS Compliant
- Lead FreeContains Lead
XC2S200-5FG256C Overview
Xilinx Inc. is the brand of this part, which falls under the category of Embedded - FPGAs (Field Programmable Gate Array) chips. It was published in 1999 and has a Pbfree Code of no. The Operating Temperature range is 0°C~85°C TJ and the Terminal Finish is Tin/Lead (Sn63Pb37). The Supply Voltage is 2.5V and the Voltage - Supply range is 2.375V~2.625V. This chip has a Total RAM Bits of 57344 and a Combinatorial Delay of a CLB-Max of 0.7 ns. Additionally, its Peak Reflow Temperature (Cel) is 225 and its Height Seated (Max) is 2mm.
XC2S200-5FG256C Features
176 I/Os
Up to 57344 RAM bits
256 LABs/CLBs
XC2S200-5FG256C Applications
There are a lot of Xilinx Inc. XC2S200-5FG256C FPGAs applications.
Device controllers
Wireless Communications
Broadcast
Data center hardware accelerators
Voice recognition
Aerospace and Defense
Telecommunication
Automotive advanced driver assistance systems (ADAS)
Data center search engines
Enterprise networking
Xilinx Inc. is the brand of this part, which falls under the category of Embedded - FPGAs (Field Programmable Gate Array) chips. It was published in 1999 and has a Pbfree Code of no. The Operating Temperature range is 0°C~85°C TJ and the Terminal Finish is Tin/Lead (Sn63Pb37). The Supply Voltage is 2.5V and the Voltage - Supply range is 2.375V~2.625V. This chip has a Total RAM Bits of 57344 and a Combinatorial Delay of a CLB-Max of 0.7 ns. Additionally, its Peak Reflow Temperature (Cel) is 225 and its Height Seated (Max) is 2mm.
XC2S200-5FG256C Features
176 I/Os
Up to 57344 RAM bits
256 LABs/CLBs
XC2S200-5FG256C Applications
There are a lot of Xilinx Inc. XC2S200-5FG256C FPGAs applications.
Device controllers
Wireless Communications
Broadcast
Data center hardware accelerators
Voice recognition
Aerospace and Defense
Telecommunication
Automotive advanced driver assistance systems (ADAS)
Data center search engines
Enterprise networking
XC2S200-5FG256C More Descriptions
FPGA Spartan-II Family 200K Gates 5292 Cells 263MHz 0.18um Technology 2.5V 256-Pin FBGA
Field Programmable Gate Array, 1176 CLBs, 200000 Gates, 263MHz, 5292-Cell, CMOS, PBGA256
FPGA 1176 CLBS 200000 GATES 263 MHz PBGA256
Product Description Demo for Development.
French Electronic Distributor since 1988
Field Programmable Gate Array, 1176 CLBs, 200000 Gates, 263MHz, 5292-Cell, CMOS, PBGA256
FPGA 1176 CLBS 200000 GATES 263 MHz PBGA256
Product Description Demo for Development.
French Electronic Distributor since 1988
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