XC2S150-5FGG456C

Xilinx Inc. XC2S150-5FGG456C

Part Number:
XC2S150-5FGG456C
Manufacturer:
Xilinx Inc.
Ventron No:
3126215-XC2S150-5FGG456C
Description:
IC FPGA 260 I/O 456FBGA
ECAD Model:
Datasheet:
XC2S150-5FGG456C

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Specifications
Xilinx Inc. XC2S150-5FGG456C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC2S150-5FGG456C.
  • Factory Lead Time
    10 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    456-BBGA
  • Number of Pins
    456
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    2004
  • Series
    Spartan®-II
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    456
  • ECCN Code
    3A991.D
  • Subcategory
    Field Programmable Gate Arrays
  • Voltage - Supply
    2.375V~2.625V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    250
  • Supply Voltage
    2.5V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC2S150
  • Pin Count
    456
  • Number of Outputs
    260
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    2.5V
  • Number of I/O
    260
  • RAM Size
    6kB
  • Clock Frequency
    263MHz
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    3888
  • Total RAM Bits
    49152
  • Number of Gates
    150000
  • Number of LABs/CLBs
    864
  • Speed Grade
    5
  • Combinatorial Delay of a CLB-Max
    0.7 ns
  • Number of CLBs
    864
  • Height Seated (Max)
    2.6mm
  • Length
    23mm
  • Width
    23mm
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free
Description
XC2S150-5FGG456C Overview
The Xilinx Inc. brand offers an Embedded - FPGAs (Field Programmable Gate Array) chip, categorized as an Embedded - FPGAs (Field Programmable Gate Array). This chip has an operating temperature range of 0°C to 85°C TJ and is packaged in a Tray with a Pbfree Code of yes. The terminal position is located at the bottom and can withstand a peak reflow temperature of 250°C. However, it is important to note that this chip has not yet been qualified. It operates at an operating supply voltage of 2.5V and has a RAM size of 6kB. The chip has a maximum seated height of 2.6mm and a width of 23mm.

XC2S150-5FGG456C Features
260 I/Os
Up to 49152 RAM bits
456 LABs/CLBs

XC2S150-5FGG456C Applications
There are a lot of Xilinx Inc. XC2S150-5FGG456C FPGAs applications.

Device controllers
Medical imaging
Distributed Monetary Systems
Industrial,Medical and Scientific Instruments
Military Temperature
Image processing
Embedded Vision
Automation
Solar Energy
Data center hardware accelerators
XC2S150-5FGG456C More Descriptions
FPGA Spartan-II Family 150K Gates 3888 Cells 263MHz 0.18um Technology 2.5V 456-Pin F-BGA
Field Programmable Gate Array, 864 CLBs, 52000 Gates, 357MHz, 3888-Cell, CMOS, PBGA256
FPGA - Field Programmable Gate Array 150000 SYSTEM GATE 2.5 VOLT LOGIC CELL A
BGA-456 Programmable Logic Device (CPLDs/FPGAs) ROHS
Product Description Demo for Development.
French Electronic Distributor since 1988
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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