XC2C384-10FG324I

Xilinx Inc. XC2C384-10FG324I

Part Number:
XC2C384-10FG324I
Manufacturer:
Xilinx Inc.
Ventron No:
3124964-XC2C384-10FG324I
Description:
IC CPLD 384MC 9.2NS 324FBGA
ECAD Model:
Datasheet:
XC2C384-10FG324I

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Specifications
Xilinx Inc. XC2C384-10FG324I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XC2C384-10FG324I.
  • Factory Lead Time
    10 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    324-BBGA
  • Number of Pins
    324
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • Published
    2001
  • Series
    CoolRunner II
  • JESD-609 Code
    e0
  • Pbfree Code
    no
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    324
  • ECCN Code
    3A991.D
  • Terminal Finish
    Tin/Lead (Sn63Pb37)
  • Additional Feature
    YES
  • HTS Code
    8542.39.00.01
  • Subcategory
    Programmable Logic Devices
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    225
  • Supply Voltage
    1.8V
  • Terminal Pitch
    1mm
  • Reach Compliance Code
    not_compliant
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC2C384
  • Pin Count
    324
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    1.8V
  • Supply Voltage-Max (Vsup)
    1.9V
  • Programmable Type
    In System Programmable
  • Number of I/O
    240
  • Memory Type
    ROMless
  • Propagation Delay
    10 ns
  • Number of Logic Elements/Cells
    24
  • Number of Gates
    9000
  • Max Frequency
    125MHz
  • Speed Grade
    10
  • Output Function
    MACROCELL
  • Number of Macro Cells
    384
  • JTAG BST
    YES
  • Voltage Supply - Internal
    1.7V~1.9V
  • Delay Time tpd(1) Max
    9.2ns
  • Height Seated (Max)
    2.5mm
  • Length
    23mm
  • Width
    23mm
  • RoHS Status
    Non-RoHS Compliant
Description
XC2C384-10FG324I Overview
This component is manufactured by Xilinx Inc. and falls under the category of Embedded - CPLDs (Complex Programmable Logic Devices). It is a chip used for embedded systems and has the Surface Mount mounting type. It can operate within a temperature range of -40°C to 85°C and is packaged in a tray. The chip was first published in 2001 and follows the JESD-609 Code e0 standard. It has a Moisture Sensitivity Level of 3, meaning it can withstand 168 hours of exposure to moisture. The terminal finish is Tin/Lead (Sn63Pb37) and it is not compliant with Reach regulations. The chip has a width of 23mm and is not RoHS compliant.

XC2C384-10FG324I Features
324-BBGA package
240 I/Os
The operating temperature of -40°C~85°C TA
324 pin count
324 pins

XC2C384-10FG324I Applications
There are a lot of Xilinx Inc. XC2C384-10FG324I CPLDs applications.

Address decoding
SFP, QSFP, QSFP-DD, OSFP, Mini-SAS HD Port Management
Wide Vin Industrial low power SMPS
Custom state machines
Custom shift registers
Dedicated input registers
ANALOG-TO-DIGITAL CONVERTOR (ADC)
Power up sequencing
Multiple Clock Source Selection
DMA control
XC2C384-10FG324I More Descriptions
YES 324-BBGA 2001 XC2C384 complex programmable logic device 125MHz 23mm 9.2ns 1.7V~1.9V
CPLD CoolRunner -II Family 9K Gates 384 Macro Cells 125MHz 0.18um (CMOS) Technology 1.8V 324-Pin F-BGA
Flash PLD, 10ns, 384-Cell, PLA-Type, CMOS, PBGA256
CPLD - Complex Programmable Logic Devices
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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