Xilinx Inc. XC2C384-10FG324C

XC2C384-10FG324C Overview
The Terminal Finish for this particular electronic component is Tin/Lead (Sn63Pb37). This finish is commonly used in the manufacturing of electronic devices due to its low melting point and ability to form a strong bond. The Min Operating Temperature for this component is 0°C, meaning it can operate in a wide range of temperatures without any issues. The Terminal Form is BALL, indicating that the terminals of this component are in the shape of small spheres. The Peak Reflow Temperature (Cel) is 225, which is the maximum temperature this component can withstand during the reflow process. The Terminal Pitch is 1mm, indicating the distance between the terminals. This component operates at a supply voltage of 1.8V and is suitable for commercial use, as its Temperature Grade is COMMERCIAL. It is also a ROMless memory type, meaning it does not have any built-in memory. The Output Function of this component is MACROCELL, which refers to its ability to perform logic functions. Finally, it is important to note that this component is Non-RoHS Compliant, meaning it does not comply with the Restriction of Hazardous Substances Directive.

XC2C384-10FG324C Features
FBGA package
240 I/Os
324 pin count
324 pins
24 logic blocks (LABs)

XC2C384-10FG324C Applications
There are a lot of Xilinx XC2C384-10FG324C CPLDs applications.

Custom shift registers
D/T registers and latches
SUPERVISORY FUNCTION (LVD AND WATCHDOG)
Boolean function generators
DMA control
ToR/Aggregation/Core Switch and Router
Auxiliary Power Supply Isolated and Non-isolated
Field programmable gate
Battery operated portable devices
Protection relays