Xilinx Inc. XA6SLX9-3FTG256I

XA6SLX9-3FTG256I Overview
Fpga chips is supplied in the TFBGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 186 I/Os for transferring data in a more coherent manner. There are 9152 logic elements/cells to form a fundamental building block. This FPGA part belongs to the family of Field Programmable Gate Arrays. There are 186 outputs incorporated in this device. Fpga chips is designed wFpga chipsh 256 terminations. The RAM si72kBe of this FPGA module reaches 72kB to ensure normal operation of the program. Fpga electronics is designed wfpga electronics h 256 pins. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. When operating with the supply voltage of 1.2V, designers can fully make use of its flexibility. The maximal operating temperature of this module reaches 100°C. The operating temperature should be higher than -40°C. Its basic building block is composed of 715 logic blocks (LABs). Typically, fpga semiconductor uses a crystal oscillating at 62.5MHz . There are 11440 registers used to store and transfer data.

XA6SLX9-3FTG256I Features
186 I/Os
256 LABs/CLBs
100°C gates
715 logic blocks (LABs)
11440 registers


XA6SLX9-3FTG256I Applications
There are a lot of Xilinx
XA6SLX9-3FTG256I FPGAs applications.


Digital signal processing
Bioinformatics
Device controllers
Software-defined radio
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition