Texas Instruments X66AK2G02ZBB60

X66AK2G02ZBB60 Overview
The package or case of this particular electronic component is a 625-LFBGA, which refers to the type of packaging used to protect and house the internal circuitry. It has an operating temperature range of 0°C to 90°C, meaning it can function within this temperature range without any issues. However, it is important to note that this part is now considered obsolete, so alternative options may need to be explored. The moisture sensitivity level (MSL) of this component is 3, indicating that it can withstand exposure to moisture for up to 168 hours. The technology used in this component is CMOS, which stands for complementary metal-oxide-semiconductor and is known for its low power consumption. Its supply voltage-min (Vsup) is 0.85V, meaning it requires a minimum voltage of 0.85V to function properly. It has a variety of interfaces, including CAN, DMA, EBI/EMI, Ethernet, I2C, McASP, McBSP, MMC/SD, QSPI, SPI, UART, and USB, making it versatile and compatible with various systems. The address bus width is 16, indicating the number of bits that can be transferred simultaneously. This component also has external non-volatile memory, meaning it can retain data even when the power is turned off. Its core voltage is 0.9V, which is the voltage required for its core functionality.

X66AK2G02ZBB60 Features
Supplied in the 625-LFBGA package

X66AK2G02ZBB60 Applications
There are a lot of Texas Instruments X66AK2G02ZBB60 DSP applications.

Audio compression
Other sensor array processing
Digital hardware
Digital image processing, data compression
Speech processing and recognition
Medical imaging
Consumer electronic gadgets
Dam design
Compression of videos
Streaming music