Texas Instruments TWL6030B1A4CMRR

TWL6030B1A4CMRR Overview
The lifecycle status of the product is currently NRND, which was last updated 3 days ago. The package or case of the product is 187-VFBGA or FCBGA, which stands for Very Fine Ball Grid Array or Flip Chip Ball Grid Array, respectively. The JESD-609 code for this product is e1, indicating the type of package and thermal characteristics. The terminal finish is Tin/Silver/Copper, also known as Sn/Ag/Cu, which is a common material used for terminal plating. The HTS code for this product is 8542.39.00.01, which is used for classification and tariff purposes. The voltage supply for this product ranges from 2.5V to 4.8V, and the terminal position is located at the bottom of the package. The reflow temperature-max is not specified for this product, but the minimum supply voltage is 2.5V. Lastly, the thickness of the product is 710μm, providing a compact and efficient design for various applications.

TWL6030B1A4CMRR Features
Mainly used in Handheld/Mobile Devices, OMAP? applications
Operating temperature: -40°C~85°C
POWER SUPPLY SUPPORT CIRCUIT analog IC

TWL6030B1A4CMRR Applications
There are a lot of Texas Instruments TWL6030B1A4CMRRPower Management applications.

SSTL-2 Termination
Automotive head unit
Set-Top-Box
Electronic Test Instrumentation
Measurement of Point Voltages
Automotive display
Port/cable dongles
System Thermal for Servers
Automotive Advanced Driver Assistance System (ADAS)
Base Station Power Distribution Systems