Texas Instruments TP3054WM-X/NOPB

TP3054WM-X/NOPB Overview
The 16-SOIC (0.295, 7.50mm Width) package or case is a popular choice in the electronics industry due to its compact size and versatility. It is designed to withstand a wide range of operating temperatures, from -25°C to 125°C, making it suitable for use in various environments. This package is compliant with the JESD-609 code, indicating that it has been tested and meets industry standards for reliability and performance. The terminal finish of this package is TIN, which provides excellent conductivity and corrosion resistance. The technology used in this package is CMOS, known for its low power consumption and high speed. With a terminal pitch of 1.27mm and a pin count of 16, this package offers efficient and reliable connectivity. It is classified under the JESD-30 code as R-PDSO-G16, indicating its physical and electrical characteristics. This package is qualified for commercial use, ensuring its quality and reliability. The maximum seated height of this package is 2.65mm, making it suitable for space-constrained applications. Overall, the 16-SOIC package is a highly versatile and reliable option for a wide range of electronic devices.

TP3054WM-X/NOPB Features
Embedded in the 16-SOIC (0.295, 7.50mm Width) package
Operating temperature of -25°C~125°C
1 / 1 ADCs / DACs

TP3054WM-X/NOPB Applications
There are a lot of Rochester Electronics, LLC TP3054WM-X/NOPB CODECs Interface ICs applications.

High-performance memory systems
Sawmills
Steel mills
Automated Guided Vehicles (AGV)
Wire number reduction in a particular circuits
Electronic circuits
Data distribution
Magnetic positional control
Packaging
Speed synchronization of multiple motors in industries