NXP USA Inc. TDF8599TH/N2,518

TDF8599TH/N2,518 Overview
The 36-BSSOP (0.433, 11.00mm Width) Exposed Pad is a versatile and compact package or case that is ideal for surface mount applications. With a surface mount option, this package is designed to be easily mounted onto a circuit board for efficient and space-saving installation. The packaging for this component is tape and reel (TR), making it convenient for mass production and automated assembly processes. This package was first published in 2008 and has been widely used since then. It has a voltage supply range of 8V~18V, making it suitable for a variety of electronic devices. The JESD-30 Code for this package is R-PDSO-G36, indicating its compatibility with industry standards. The maximum supply voltage (Vsup) for this package is 18V, providing a stable power source for the component. With a gain of 26dB, this package can amplify signals effectively. It also has a maximum output power of 85W x 1 at 1 Ω or 70W x 2 at 2 Ω, making it a powerful choice for audio applications. The maximum seated height for this package is 3.5mm, ensuring a compact and low-profile design. Overall, the 36-BSSOP package offers a convenient, reliable, and high-performing solution for a wide range of electronic devices.

TDF8599TH/N2,518 Features
36-BSSOP (0.433, 11.00mm Width) Exposed Pad package
36 pin count
TDF8599 family

TDF8599TH/N2,518 Applications
There are a lot of NXP USA Inc. TDF8599TH/N2,518 audio amplifiers applications.

High gain DC amplifier
Professional videography
Medical imaging
Radar
Vehicle electronics
Power control
Band-stop filter
Signal amplification
Multiplication and division circuits
Displayers for aircraft and air transportation control systems