Silicon Labs SI3019-C-FT
- Part Number:
- SI3019-C-FT
- Manufacturer:
- Silicon Labs
- Ventron No:
- 3685471-SI3019-C-FT
- Description:
- IC LINE-SIDE DAA 16TSSOP
- Datasheet:
- SI3019-C-FT
Silicon Labs SI3019-C-FT technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI3019-C-FT.
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case16-TSSOP (0.173, 4.40mm Width)
- Operating Temperature0°C~70°C
- PackagingTube
- Published1999
- Pbfree Codeyes
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations16
- Voltage - Supply3V~3.6V
- Terminal PositionDUAL
- Terminal FormGULL WING
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Terminal Pitch0.65mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- Base Part NumberSI3019
- FunctionDirect Access Arrangement (DAA)
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)3.6V
- Supply Voltage-Min (Vsup)3V
- InterfaceGCI, PCM, SPI
- Number of Circuits1
- Current - Supply8.5mA
- Consumer IC TypeCONSUMER CIRCUIT
- Length5mm
- Width4.4mm
- RoHS StatusRoHS Compliant
- Lead FreeLead Free
SI3019-C-FT Overview
The manufacturer of this component is Silicon Labs. It is a type of chip used for telecommunications and falls under the category of Interface - Telecom. It is designed to be surface mounted and has a surface mount mounting type. The package or case size is 16-TSSOP (0.173, 4.40mm width) and it is packaged in a tube. This particular part was first released in 1999. The peak reflow temperature for this chip is not specified. The terminal pitch, or distance between each terminal, is 0.65mm. The base part number for this chip is SI3019. The maximum supply voltage for this chip is 3.6V and it requires a supply current of 8.5mA.
SI3019-C-FT Features
Available in the 16-TSSOP (0.173, 4.40mm Width) package
SI3019-C-FT Applications
There are a lot of Silicon Labs SI3019-C-FT Telecom applications.
Integrated Multi-Service Access Platforms (IMAPs)
DECT (Digital European Cordless Telephone) Base
PBXs channel bank
Set-Top Box
T1/E1/J1 add/drop multiplexers (MUX)
Integrated Access Devices (IADs)
Digital access cross connects
Stations
E1 Multiplexer
Integrated Access Devices
The manufacturer of this component is Silicon Labs. It is a type of chip used for telecommunications and falls under the category of Interface - Telecom. It is designed to be surface mounted and has a surface mount mounting type. The package or case size is 16-TSSOP (0.173, 4.40mm width) and it is packaged in a tube. This particular part was first released in 1999. The peak reflow temperature for this chip is not specified. The terminal pitch, or distance between each terminal, is 0.65mm. The base part number for this chip is SI3019. The maximum supply voltage for this chip is 3.6V and it requires a supply current of 8.5mA.
SI3019-C-FT Features
Available in the 16-TSSOP (0.173, 4.40mm Width) package
SI3019-C-FT Applications
There are a lot of Silicon Labs SI3019-C-FT Telecom applications.
Integrated Multi-Service Access Platforms (IMAPs)
DECT (Digital European Cordless Telephone) Base
PBXs channel bank
Set-Top Box
T1/E1/J1 add/drop multiplexers (MUX)
Integrated Access Devices (IADs)
Digital access cross connects
Stations
E1 Multiplexer
Integrated Access Devices
SI3019-C-FT More Descriptions
IC TELECOM INTERFACE 16TSSOP
IC LINE-SIDE DAA 16TSSOP
IC LINE-SIDE DAA 16TSSOP
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