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Texas Instruments RI-TRP-RR3P-30

Part Number:

RI-TRP-RR3P-30

Manufacturer:

Texas Instruments

Ventron No:

4409759-RI-TRP-RR3P-30

Description:

RFID 23MM GLASS TRANSP R/O 64BIT

Datasheet:

RI-TRP-RR3P-30

Payment:

Payment

Delivery:

Delivery

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Specifications

Texas Instruments RI-TRP-RR3P-30 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments RI-TRP-RR3P-30.

  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C
  • Packaging
    Tape & Reel (TR)
  • Size / Dimension
    3.85mm Diax23.10mm
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    Passive
  • Depth
    3.85mm
  • Style

    Style in the context of electronic components refers to the physical form or design of the component. It encompasses various aspects such as the shape, size, mounting method, and packaging. The style of a component is crucial for determining its compatibility with specific applications and circuit board designs. It ensures proper fit, functionality, and ease of assembly. Common styles include through-hole, surface mount, axial, radial, and various specialized form factors tailored to specific applications.

    Glass Encapsulated
  • Frequency

    Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.

    134.2kHz
  • Base Part Number
    RI-TRP
  • Memory Type

    Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.

    Read Only
  • Standards
    ISO 11784, ISO 11785
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Contains Lead

Description

The RI-TRP-RR3P-30 is RFID 23MM GLASS TRANSP R/O 64BIT , it is part of - series. they are designed to work as RFID Transponders, Tags.RI-TRP-RR3P-30 with pin details manufactured by . The RI-TRP-RR3P-30 is available in Package,it is part of the electronic component Chips.that includes - Series. they are designed to operate as RFID Transponders, Tags.it is with Operating Temperature -40°C ~ 85°C.RI-TRP-RR3P-30 with original stock manufactured by . The RI-TRP-RR3P-30 is available in Package.Generally IC chips offer Mounting Style features such as SMD/SMT, Package Case of RI-TRP-RR3P-30is designed to work in , it's Operating Temperature is -40°C ~ 85°C.The RI-TRP-RR3P-30 is available in Package, is part of the RFID Transponders, Tags and belong to RF/IF and RFID.RI-TRP-RR3P-30 with EDA / CAD Models manufactured by . The RI-TRP-RR3P-30 is available in Package, is part of the RF/IF and RFID.The RI-TRP-RR3P-30 is RFID Transponders, Tags with package manufactured by . The RI-TRP-RR3P-30 is available in Package, is part of the RFID 23MM GLASS TRANSP R/O 64BIT.
RI-TRP-RR3P-30 More Descriptions
23mm Glass Transponder R/O 0-RFIDT -40 to 85
RFID 23MM GLASS TRANSP R/O 64BIT
23MM GLASS TRANSPONDER
23mm Glass Trp., R/O

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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