Infineon Technologies PEF 2026 T-S V1.1

PEF 2026 T-S V1.1 Overview
Infineon Technologies is a well-known brand in the technology industry, and one of their products is a Interface - Telecom chip. This chip falls under the category of Interface - Telecom, which is designed to facilitate communication between different devices. One of the key features of this chip is its Mounting Type, which is Surface Mount. This means that it can be easily attached to a circuit board, making it a popular choice for electronic devices. The Package / Case of this chip is 20-SOIC (0.433, 11.00mm Width) Exposed Pad, providing a compact and efficient design for space-constrained applications. The Packaging for this chip is Tape & Reel (TR), which is a common method used for shipping and storing electronic components. However, it is important to note that this particular part is now considered obsolete, meaning it is no longer being manufactured. This could be due to advancements in technology or changes in market demand. When it comes to handling and storing this chip, the Moisture Sensitivity Level (MSL) is an important parameter to consider. In this case, the MSL is 1 (Unlimited), indicating that the chip has no restrictions on exposure to moisture during storage or assembly. This makes it easier for manufacturers to handle and incorporate into their products without worrying about potential damage from moisture. The Base Part Number for this chip is PEF2026, which is used to identify the specific model and variations of this chip. Moving on to its functionality, this chip serves as a High Voltage Power Controller, making it suitable for applications that require a reliable and efficient power supply. Its Interface is ISDN, which stands for Integrated Services Digital Network and is a communication standard used for digital transmission of voice, video, and data. This makes the chip compatible with a wide range of devices and systems that use ISDN technology. The Number of Circuits for this chip is 1, indicating that it can support one communication channel at a time. Lastly, the Current - Supply for this chip is 700μA, which is the amount of current required for the chip to operate effectively. In conclusion, the Infineon Technologies Interface - Telecom chip offers a Surface Mount design, compact packaging, and a high voltage power controller function. It is compatible with ISDN technology and has a low current requirement, making it a versatile and efficient choice for various applications. However, it is important to note that this specific part is now obsolete, and alternative options may need to be considered for future designs.

PEF 2026 T-S V1.1 Features
Available in the 20-SOIC (0.433, 11.00mm Width) Exposed Pad package

PEF 2026 T-S V1.1 Applications
There are a lot of Infineon Technologies PEF 2026 T-S V1.1 Telecom applications.

Fiber to the Home (FTTH)
Fiber
Cable Modem
E1 LAN/WAN Routers
PDH Multiplexers
Multichannel DS1 Test Equipment
Central office (CO)
Central office
Private branch exchange (PBX)
T1/E1/J1 Multiplexer and Channel Banks