Infineon Technologies PEB 3324 E V1.4
- Part Number:
- PEB 3324 E V1.4
- Manufacturer:
- Infineon Technologies
- Ventron No:
- 3685994-PEB 3324 E V1.4
- Description:
- IC CODEC VOIP LBGA-176
- Datasheet:
- PEB/ PEF 33xx Product Brief
Infineon Technologies PEB 3324 E V1.4 technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies PEB 3324 E V1.4.
- Mounting TypeSurface Mount
- Package / Case176-LBGA
- Supplier Device PackagePG-LBGA-176
- Operating Temperature-40°C~85°C
- PackagingTray
- SeriesVINETIC®
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Power (Watts)400mW
- Base Part NumberPEB3324
- FunctionAnalog Voice Access
- InterfaceADPCM
- Number of Circuits4
- RoHS StatusNon-RoHS Compliant
PEB 3324 E V1.4 Overview
The mounting type for this particular component is surface mount, meaning it can be attached directly to the surface of a circuit board. The package or case for this component is 176-LBGA, which refers to the type of package and the number of pins it has. It is designed to operate within a temperature range of -40°C to 85°C, making it suitable for a variety of environments. The packaging for this component is a tray, which is a type of container used for shipping and storing electronic components. This particular component, part of the VINETIC® series, is now considered obsolete and is no longer in production. It has a moisture sensitivity level of 3, meaning it can withstand exposure to moisture for up to 168 hours. With a power rating of 400mW, this component is capable of handling a significant amount of power. It contains 4 circuits and is not compliant with RoHS regulations.
PEB 3324 E V1.4 Features
Available in the 176-LBGA package
PEB 3324 E V1.4 Applications
There are a lot of Infineon Technologies PEB 3324 E V1.4 Telecom applications.
Microwave transmission systems
Add/Drop multiplexers (ADMs)
Fault Tolerant Systems
PBXs channel bank
Fiber
High-Density T1/E1/J1 interfaces for Multiplexers
SDH/SONET multiplexers
E2 Rates PCM Line Interface
High speed data transmission line cards
ATM equipment with integrated DS1 interfaces
The mounting type for this particular component is surface mount, meaning it can be attached directly to the surface of a circuit board. The package or case for this component is 176-LBGA, which refers to the type of package and the number of pins it has. It is designed to operate within a temperature range of -40°C to 85°C, making it suitable for a variety of environments. The packaging for this component is a tray, which is a type of container used for shipping and storing electronic components. This particular component, part of the VINETIC® series, is now considered obsolete and is no longer in production. It has a moisture sensitivity level of 3, meaning it can withstand exposure to moisture for up to 168 hours. With a power rating of 400mW, this component is capable of handling a significant amount of power. It contains 4 circuits and is not compliant with RoHS regulations.
PEB 3324 E V1.4 Features
Available in the 176-LBGA package
PEB 3324 E V1.4 Applications
There are a lot of Infineon Technologies PEB 3324 E V1.4 Telecom applications.
Microwave transmission systems
Add/Drop multiplexers (ADMs)
Fault Tolerant Systems
PBXs channel bank
Fiber
High-Density T1/E1/J1 interfaces for Multiplexers
SDH/SONET multiplexers
E2 Rates PCM Line Interface
High speed data transmission line cards
ATM equipment with integrated DS1 interfaces
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