Texas Instruments PCI7410ZHK

PCI7410ZHK Overview
The package or case of the device is a 209-LFBGA, which stands for Low Profile Fine-Pitch Ball Grid Array. It is a type of surface-mount packaging that uses solder balls as its contact points. The supplier device package, on the other hand, is a 209-PBGA (16x16), which means it has 16 rows and 16 columns of solder balls. This package is commonly used for high-density and high-performance applications. The packaging for this device is in a tray, which is a type of container used for storing and transporting electronic components. Unfortunately, the part status of this device is obsolete, meaning it is no longer in production. The moisture sensitivity level (MSL) for this device is 3, which indicates that it can withstand 168 hours of exposure to moisture at a temperature of 30°C and 60% relative humidity. The voltage supply for this device is 3.3V 5V, which is the range of voltage it requires to function properly. Its main function is as a controller, which means it is responsible for managing and controlling other components. The interface for this device is PCI, which stands for Peripheral Component Interconnect. It is a type of bus that connects the device to the computer's motherboard. The protocol used by this device is PCI CardBus, which is a standard for connecting peripheral devices to a computer. It is also compliant with the IEEE 1394-1995, 1394a-2000, OHCI, Firewire™, and i.Link™ standards, which are specifications for high-speed serial bus interfaces.

PCI7410ZHK Features

PCI7410ZHK Applications
There are a lot of Rochester Electronics, LLC PCI7410ZHK Controllers Interface ICs applications.

Desktop PCs
PC Motherboards
Tablets, Netbooks, Ultra?Mobile PCs
Local Area Networks
Point-of-Sale Devices
Sensitive Applications
Notebook PCs
PDAs
Smart Cities
Smart handheld devices